having two nitrogen atoms in the ring

Industry

CPC
C08G59/5073

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Parent Industries

CCHEMISTRY METALLURGY C08Organic compounds C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS C08G59/00Polycondensates containing more than one epoxy group per molecule Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups

Current Industry

C08G59/5073having two nitrogen atoms in the ring

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin systems
- Patent number 12,173,112
- Issue date Dec 24, 2024
- Amitabh Bansal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
High heat dissipation polymer composite material sheet and manufact...
- Patent number 12,173,222
- Issue date Dec 24, 2024
- SAMDO ATS CO., LTD.
- Taeyoon Lim
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Fast-cure resin formulations with consistent handling characteristics
- Patent number 12,139,575
- Issue date Nov 12, 2024
- Cytec Industries Inc.
- Andrew Gibbs
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid resin composition for sealing and electronic component appar...
- Patent number 12,131,970
- Issue date Oct 29, 2024
- Resonac Corporation
- Hidetoshi Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrical device comprising a cross-linked layer
- Patent number 12,071,506
- Issue date Aug 27, 2024
- NEXANS
- Laureene Malheurty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable resin composition, cured product, and sheet-like formed body
- Patent number 12,060,482
- Issue date Aug 13, 2024
- Mitsubishi Chemical Corporation
- Yosuke Tsuge
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solvent-less ionic liquid epoxy resin
- Patent number 11,976,162
- Issue date May 7, 2024
- Arizona Board of Regents on behalf of Arizona State University
- Cody Friesen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluorine-containing epoxy resin for electrical materials and method...
- Patent number 11,965,060
- Issue date Apr 23, 2024
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- Yoshito Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solvent-less ionic liquid epoxy resin
- Patent number 11,859,077
- Issue date Jan 2, 2024
- Arizona Board of Regents on behalf of Arizona State University
- Cody Friesen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber-reinforced molded article and method of producing same
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- Issue date Nov 28, 2023
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- Hideki Oka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Phenoxy resin, resin composition including same, cured object obtai...
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- Issue date Nov 7, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Hiroshi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition for printed wiring board, prepreg, laminate, meta...
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- Issue date Jul 18, 2023
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- Shohei Yamaguchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composition for curable resin, cured product of said composition, p...
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- Issue date Jan 17, 2023
- ENEOS Corporation
- Yoshinori Nishitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepregs and production of composite material using prepregs
- Patent number 11,505,642
- Issue date Nov 22, 2022
- Gurit (UK) Ltd.
- Paul Spencer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multi-component epoxy resin compound with leakage indicator, and cu...
- Patent number 11,499,003
- Issue date Nov 15, 2022
- Hilti Aktiengesellschaft
- Alexander Bornschlegl
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Curable compositions and related methods
- Patent number 11,370,908
- Issue date Jun 28, 2022
- 3M Innovative Properties Company
- Lianzhou Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Fast-curing epoxy systems
- Patent number 11,370,877
- Issue date Jun 28, 2022
- Evonik Operations GmbH
- Emmanouil Spyrou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multi-component solid epoxy proppant binder resins
- Patent number 11,359,475
- Issue date Jun 14, 2022
- Battelle Memorial Institute
- Joel D. Elhard
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin systems
- Patent number 11,359,047
- Issue date Jun 14, 2022
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- Amitabh Bansal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition, prepreg, fiber-reinforced plastic...
- Patent number 11,292,874
- Issue date Apr 5, 2022
- MITSUBISHI CHEMICAL CORPORATION
- Takuya Teranishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Low temperature anhydride epoxy cured systems
- Patent number 11,286,336
- Issue date Mar 29, 2022
- Evonik Operations GmbH
- Pritesh G. Patel
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fast-curing epoxy systems
- Patent number 11,286,335
- Issue date Mar 29, 2022
- Evonik Operations GmbH
- Emmanouil Spyrou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable composition
- Patent number 11,261,358
- Issue date Mar 1, 2022
- Sunstar Engineering Inc.
- Kazunobu Takami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin composition
- Patent number 11,236,228
- Issue date Feb 1, 2022
- Kaneka Corporation
- Nobuo Miyatake
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable composition
- Patent number 11,208,526
- Issue date Dec 28, 2021
- LG Chem, Ltd.
- Dong Hyun Woo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Phenyl imidazoline compound having aminomethyl group or salt thereo...
- Patent number 11,198,676
- Issue date Dec 14, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Yutaka Kanbara
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Blend for curing epoxy resin composistions
- Patent number 11,198,756
- Issue date Dec 14, 2021
- Huntsman Petrochemical LLC
- Hui Zhou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, prepreg, fiber-reinforced composite materi...
- Patent number 11,186,674
- Issue date Nov 30, 2021
- Toray Industries, Inc.
- Kentaro Sano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fast-cure pre-preg
- Patent number 11,149,125
- Issue date Oct 19, 2021
- Cytec Industries Inc.
- Ian Paul Aspin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy compound, curable composition containing the same, and cured...
- Patent number 11,104,686
- Issue date Aug 31, 2021
- ENEOS Corporation
- Shohei Takata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
DISPERSANT
- Publication number 20250034318
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- BASF COATINGS GMBH
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METHODS, SYSTEMS, DEVICES AND KITS FOR FORMULATING STRUCTURAL ADHES...
- Publication number 20250026969
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THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING...
- Publication number 20240400855
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- TAIYO HOLDINGS CO., LTD.
- Satsuki OZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP...
- Publication number 20240368374
- Publication date Nov 7, 2024
- Namics Corporation
- Makoto SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
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EPOXY RESIN FOAM, CARBON DIOXIDE ABSORBENT, METHOD FOR PRODUCING EP...
- Publication number 20240360289
- Publication date Oct 31, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Kazuki KOUNO
- B32 - LAYERED PRODUCTS
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RAPID CURING EPOXY-RESIN COMPOSITION FOR FIBER-MATRIX SEMIFINISHED...
- Publication number 20240327582
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- Polynt Composites Norway AS
- Lionel Gehringer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION
- Publication number 20240317967
- Publication date Sep 26, 2024
- Takeshi ENDO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION AND FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE U...
- Publication number 20240279517
- Publication date Aug 22, 2024
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- Kenji TOKUHISA
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EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
- Publication number 20240254279
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CURABLE RESIN COMPOSITION
- Publication number 20240239950
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- THREEBOND CO., LTD.
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SIDE-FILLING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR RE...
- Publication number 20240186203
- Publication date Jun 6, 2024
- Panasonic Intellectual Property Management Co., Ltd.
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- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HIGH HEAT DISSIPATION POLYMER COMPOSITE MATERIAL SHEET AND MANUFACT...
- Publication number 20240124757
- Publication date Apr 18, 2024
- SAMDO ATS CO., LTD.
- Taeyoon LIM
- C01 - INORGANIC CHEMISTRY
Information Patent Application
CHARGE TRANSFER COMPLEX
- Publication number 20240109869
- Publication date Apr 4, 2024
- ADEKA CORPORATION
- Takeshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN CURED PRODUCT, AND FIBER REINFORCED RESIN
- Publication number 20230391943
- Publication date Dec 7, 2023
- Hitachi, Ltd
- Takeshi KONDO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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HIGH-TEMPERATURE-RESISTANT INSULATING COATING MATERIAL AND PREPARAT...
- Publication number 20230212384
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- SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES
- Suibin LUO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY AMINE ADDUCT, CURING CATALYST, RESIN COMPOSITION, SEALING MAT...
- Publication number 20230203237
- Publication date Jun 29, 2023
- Namics Corporation
- Yuya NAKAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PR...
- Publication number 20230183416
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- The Yokohama Rubber Co., Ltd.
- Yukihiro KAMIMURA
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CHEMOENZYMATIC DEGRADATION OF EPOXY RESINS
- Publication number 20230183440
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- SOLVAY S.A.
- Victor Ferrao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTUR...
- Publication number 20230141042
- Publication date May 11, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Shohei SANADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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ELECTRICALLY CONDUCTIVE PASTE FOR ELECTROLYTIC CAPACITOR, AND ELECT...
- Publication number 20230105450
- Publication date Apr 6, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Takashi OHBAYASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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LOW-TEMPERATURE CURABLE COMPOSITION
- Publication number 20230013387
- Publication date Jan 19, 2023
- SUNSTAR ENGINEERING INC.
- Takatomi NISHIDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Vitrimers Containing Additives
- Publication number 20220372273
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- Mallinda
- Philip Taynton
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
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- Tomomasa Kashino
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ROOM TEMPERATURE IONIC LIQUID CURING AGENT
- Publication number 20220356298
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SOLVENT-LESS IONIC LIQUID EPOXY RESIN
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- Cody Friesen
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Information Patent Application
PHENOXY RESIN, RESIN COMPOSITION INCLUDING SAME, CURED OBJECT OBTAI...
- Publication number 20220098360
- Publication date Mar 31, 2022
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- Hiroshi Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

having two nitrogen atoms in the ring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Epoxy resin systems

High heat dissipation polymer composite material sheet and manufact...

Fast-cure resin formulations with consistent handling characteristics

Liquid resin composition for sealing and electronic component appar...

Electrical device comprising a cross-linked layer

Curable resin composition, cured product, and sheet-like formed body

Solvent-less ionic liquid epoxy resin

Fluorine-containing epoxy resin for electrical materials and method...

Solvent-less ionic liquid epoxy resin

Fiber-reinforced molded article and method of producing same

Phenoxy resin, resin composition including same, cured object obtai...

Resin composition for printed wiring board, prepreg, laminate, meta...

Composition for curable resin, cured product of said composition, p...

Prepregs and production of composite material using prepregs

Multi-component epoxy resin compound with leakage indicator, and cu...

Curable compositions and related methods

Fast-curing epoxy systems

Multi-component solid epoxy proppant binder resins

Epoxy resin systems

Thermosetting resin composition, prepreg, fiber-reinforced plastic...

Low temperature anhydride epoxy cured systems

Fast-curing epoxy systems

Curable composition

Epoxy resin composition

Curable composition

Phenyl imidazoline compound having aminomethyl group or salt thereo...

Blend for curing epoxy resin composistions

Epoxy resin composition, prepreg, fiber-reinforced composite materi...

Fast-cure pre-preg

Epoxy compound, curable composition containing the same, and cured...

Patents Applicationslast 30 patents

DISPERSANT

METHODS, SYSTEMS, DEVICES AND KITS FOR FORMULATING STRUCTURAL ADHES...

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING...

EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP...

EPOXY RESIN FOAM, CARBON DIOXIDE ABSORBENT, METHOD FOR PRODUCING EP...

RAPID CURING EPOXY-RESIN COMPOSITION FOR FIBER-MATRIX SEMIFINISHED...

CURABLE RESIN COMPOSITION

ADHESIVE COMPOSITION AND FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE U...

EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

CURABLE RESIN COMPOSITION

SIDE-FILLING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR RE...

HIGH HEAT DISSIPATION POLYMER COMPOSITE MATERIAL SHEET AND MANUFACT...

CHARGE TRANSFER COMPLEX

RESIN COMPOSITION, RESIN CURED PRODUCT, AND FIBER REINFORCED RESIN

HIGH-TEMPERATURE-RESISTANT INSULATING COATING MATERIAL AND PREPARAT...

EPOXY AMINE ADDUCT, CURING CATALYST, RESIN COMPOSITION, SEALING MAT...

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PR...

CHEMOENZYMATIC DEGRADATION OF EPOXY RESINS

FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTUR...

ELECTRICALLY CONDUCTIVE PASTE FOR ELECTROLYTIC CAPACITOR, AND ELECT...

LOW-TEMPERATURE CURABLE COMPOSITION

Vitrimers Containing Additives

THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE

ROOM TEMPERATURE IONIC LIQUID CURING AGENT

ENCAPSULATING RESIN COMPOSITION AND ELECTRONIC COMPONENT

EPOXY RESIN SYSTEMS

Curing agent composition for an epoxy resin compound, epoxy resin c...

THERMOSETTING RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC...

SOLVENT-LESS IONIC LIQUID EPOXY RESIN

PHENOXY RESIN, RESIN COMPOSITION INCLUDING SAME, CURED OBJECT OBTAI...