Heterocyclic compounds

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CPC
C25D3/18

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D3/00Electroplating: Baths therefor

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C25D3/18Heterocyclic compounds

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Composition for cobalt plating comprising additive for void-free su...
- Patent number 12,098,473
- Issue date Sep 24, 2024
- BASF SE
- Sathana Kitayaporn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Production of nanoporous films
- Patent number 11,697,885
- Issue date Jul 11, 2023
- University of Central Florida Research Foundation, Inc.
- Yang Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for cobalt or cobalt alloy electroplating
- Patent number 11,585,004
- Issue date Feb 21, 2023
- BASF SE
- Marco Arnold
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-strength single-crystal like nanotwinned nickel coatings and m...
- Patent number 11,492,725
- Issue date Nov 8, 2022
- Purdue Research Foundation
- Qiang Li
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Galvanic nickel or nickel alloy electroplating bath for depositing...
- Patent number 11,408,085
- Issue date Aug 9, 2022
- Atotech Deutschland GmbH
- Philipp Wachter
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cobalt filling of interconnects
- Patent number 11,401,618
- Issue date Aug 2, 2022
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for cobalt electroplating comprising leveling agent
- Patent number 11,377,748
- Issue date Jul 5, 2022
- BASF SE
- Nadine Engelhardt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhanced plating bath and additive chemistries for cobalt plating
- Patent number 11,118,278
- Issue date Sep 14, 2021
- Applied Materials, Inc.
- Ismail Emesh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Bath and method for filling a vertical interconnect access or trenc...
- Patent number 11,091,849
- Issue date Aug 17, 2021
- Atotech Deutschland GmbH
- Josef Gaida
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for plating printed circuit board and printed circuit board...
- Patent number 11,096,291
- Issue date Aug 17, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Chan Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for preparing high strength and durable super-hyd...
- Patent number 11,078,572
- Issue date Aug 3, 2021
- NORTHEAST PETROLEUM UNIVERSITY
- Huaiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt filling of interconnects
- Patent number 11,035,048
- Issue date Jun 15, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nickel plated coating and method of manufacturing the same
- Patent number 10,753,008
- Issue date Aug 25, 2020
- Toyoda Gosei Co., Ltd.
- Kenjiro Morimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nickel electroplating compositions with cationic polymers and metho...
- Patent number 10,718,059
- Issue date Jul 21, 2020
- Rohm and Haas Electronic Materials LLC
- Michael Lipschutz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nickel electroplating compositions with copolymers of arginine and...
- Patent number 10,711,360
- Issue date Jul 14, 2020
- Rohm and Haas Electronic Materials LLC
- Michael Lipschutz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Joining member, solder material, solder paste, formed solder, flux...
- Patent number 10,675,719
- Issue date Jun 9, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Pollution-free electroplating solution for electroplating and prepa...
- Patent number 10,619,259
- Issue date Apr 14, 2020
- Ming Chi University of Technology
- Kun-Cheng Peng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Environmentally friendly nickel electroplating compositions and met...
- Patent number 10,508,348
- Issue date Dec 17, 2019
- Rohm and Haas Electronic Materials LLC
- Michael Lipschutz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhanced plating bath and additive chemistries for cobalt plating
- Patent number 10,487,410
- Issue date Nov 26, 2019
- Applied Materials, Inc.
- Ismail Emesh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metallic material for electronic components and method for producin...
- Patent number 10,373,730
- Issue date Aug 6, 2019
- JX Nippon Mining & Metals Corporation
- Yoshitaka Shibuya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carrier-attached copper foil, laminate, method for manufacturing pr...
- Patent number 10,332,756
- Issue date Jun 25, 2019
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Needle and method for manufacturing the same
- Patent number 10,086,150
- Issue date Oct 2, 2018
- EFR CO., LTD.
- Akitoshi Tomihara
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Copper foil provided with carrier, laminate, printed wiring board,...
- Patent number 9,839,124
- Issue date Dec 5, 2017
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electr...
- Patent number 9,790,607
- Issue date Oct 17, 2017
- Atotech Deutschland GmbH
- Klaus-Dieter Schulz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chemistry additives and process for cobalt film electrodeposition
- Patent number 9,777,386
- Issue date Oct 3, 2017
- Lam Research Corporation
- Natalia V. Doubina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of making sound interface in overcast bimetal components
- Patent number 9,770,757
- Issue date Sep 26, 2017
- GM Global Technology Operations LLC
- Qigui Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Galvanic nickel electroplating bath for depositing a semi-bright ni...
- Patent number 9,752,244
- Issue date Sep 5, 2017
- Atotech Deutschland GmbH
- Klaus-Dieter Schulz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite plated product
- Patent number 8,846,201
- Issue date Sep 30, 2014
- Nissei Industrial Plastic Co., Ltd.
- Tomoyuki Sato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Biological molecule-immobilized chip and its use
- Patent number 7,919,332
- Issue date Apr 5, 2011
- Kitakyushu Foundation for the Advancement of Industry Science and Technology
- Tetsuya Haruyama
- G01 - MEASURING TESTING
Information Patent Grant
Production of nickelized shaped articles
- Patent number 5,438,140
- Issue date Aug 1, 1995
- BASF Aktiengesellschaft
- Alfred Oftring
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR ELECTROPLATING ARTICLE WITH METAL
- Publication number 20240392461
- Publication date Nov 28, 2024
- DIPSOL CHEMICALS CO., LTD.
- Kota Kobayashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NICKEL ELECTROPLATING COMPOSITIONS FOR ROUGH NICKEL
- Publication number 20240124999
- Publication date Apr 18, 2024
- Rohm and Haas Electronic Materials L.L.C.
- Weigang WU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NICKEL ELECTROPLATING COMPOSITIONS FOR ROUGH NICKEL
- Publication number 20240117516
- Publication date Apr 11, 2024
- Rohm and Haas Electronic Materials L.L.C.
- Weigang WU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRODUCTION OF NANOPOROUS FILMS
- Publication number 20230366116
- Publication date Nov 16, 2023
- Yang YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composition for Cobalt Electroplating Comprising Leveling Agent
- Publication number 20220298664
- Publication date Sep 22, 2022
- BASF SE
- Nadine ENGELHARDT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING...
- Publication number 20220098747
- Publication date Mar 31, 2022
- Atotech Deutschland GmbH
- Philipp WACHTER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composition and Method for Fabrication of Nickel Interconnects
- Publication number 20220064811
- Publication date Mar 3, 2022
- MacDermid Enthone Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cobalt Filling of Interconnects
- Publication number 20210332491
- Publication date Oct 28, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...
- Publication number 20210329794
- Publication date Oct 21, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Jong Chan CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-STRENGTH SINGLE-CRYSTAL LIKE NANOTWINNED NICKEL COATINGS AND M...
- Publication number 20210189581
- Publication date Jun 24, 2021
- Qiang Li
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITION FOR COBALT OR COBALT ALLOY ELECTROPLATING
- Publication number 20210147994
- Publication date May 20, 2021
- BASF SE
- Marco ARNOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...
- Publication number 20210040635
- Publication date Feb 11, 2021
- BASF SE
- Marcel Patrik KIENLE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...
- Publication number 20200413548
- Publication date Dec 31, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jong Chan CHOI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COBALT ELECTROPLATING COMPRISING LEVELING AGENT
- Publication number 20200347503
- Publication date Nov 5, 2020
- BASF SE
- Nadine ENGELHARDT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
A BATH AND METHOD FOR FILLING A VERTICAL INTERCONNECT ACCESS OR TRE...
- Publication number 20200199766
- Publication date Jun 25, 2020
- Atotech Deutschland GmbH
- Josef GAIDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING
- Publication number 20200048784
- Publication date Feb 13, 2020
- Applied Materials, Inc.
- Ismail EMESH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...
- Publication number 20190226107
- Publication date Jul 25, 2019
- BASF SE
- Marcel Patrik KIENLE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POLLUTION-FREE ELECTROPLATING SOLUTION FOR ELECTROPLATING AND PREPA...
- Publication number 20190024252
- Publication date Jan 24, 2019
- Ming Chi University of Technology
- Kun-Cheng Peng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NICKEL ELECTROPLATING COMPOSITIONS WITH COPOLYMERS OF ARGININE AND...
- Publication number 20190017187
- Publication date Jan 17, 2019
- Rohm and Haas Electronic Materials L.L.C.
- Michael Lipschutz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NICKEL ELECTROPLATING COMPOSITIONS WITH CATIONIC POLYMERS AND METHO...
- Publication number 20190010625
- Publication date Jan 10, 2019
- Rohm and Haas Electronic Materials L.L.C.
- Michael Lipschutz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENVIRONMENTALLY FRIENDLY NICKEL ELECTROPLATING COMPOSITIONS AND MET...
- Publication number 20180363157
- Publication date Dec 20, 2018
- Rohm and Haas Electronic Materials L.L.C.
- Michael Lipschutz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING
- Publication number 20170247806
- Publication date Aug 31, 2017
- Applied Materials, Inc.
- Ismail EMESH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHEMISTRY ADDITIVES AND PROCESS FOR COBALT FILM ELECTRODEPOSITION
- Publication number 20160273117
- Publication date Sep 22, 2016
- LAM RESEARCH CORPORATION
- Natalia V. Doubina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF COATING SUBSTRATES WITH COMPOSITE COATINGS OF DIAMOND NA...
- Publication number 20160083860
- Publication date Mar 24, 2016
- BAKER HUGHES INCORPORATED
- Othon R. Monteiro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING...
- Publication number 20160053395
- Publication date Feb 25, 2016
- Atotech Deutschland GmbH
- Klaus-Dieter SCHULZ
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE TREATED PLATING MATERIAL AND METHOD FOR PRODUCING THE SAME,...
- Publication number 20150259813
- Publication date Sep 17, 2015
- JX NIPPON MINING & METALS CORPORATION
- Atsushi Kodama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20140117549
- Publication date May 1, 2014
- Mitsubishi Electric Corporation
- Daisuke Tsunami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CORROSION-RESISTANT ALLOY COATING FILM FOR METAL MATERIALS AND METH...
- Publication number 20140030635
- Publication date Jan 30, 2014
- Nihon Parkerizing Co., Ltd.
- Kazuya Nakada
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SOFT PACKAGE LITHIUM BATTERY TAB MATERIAL AND ITS METHOD OF PLATING...
- Publication number 20130071738
- Publication date Mar 21, 2013
- Qiming Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NICKEL-CONTAINING LAYER ARRANGEMENT FOR INTAGLIO PRINTING
- Publication number 20110308958
- Publication date Dec 22, 2011
- IPT International Plating Technologies GmbH
- Matthias Kurrle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Heterocyclic compounds

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composition for cobalt plating comprising additive for void-free su...

Production of nanoporous films

Composition for cobalt or cobalt alloy electroplating

High-strength single-crystal like nanotwinned nickel coatings and m...

Galvanic nickel or nickel alloy electroplating bath for depositing...

Cobalt filling of interconnects

Composition for cobalt electroplating comprising leveling agent

Enhanced plating bath and additive chemistries for cobalt plating

Bath and method for filling a vertical interconnect access or trenc...

Method for plating printed circuit board and printed circuit board...

Method and device for preparing high strength and durable super-hyd...

Cobalt filling of interconnects

Nickel plated coating and method of manufacturing the same

Nickel electroplating compositions with cationic polymers and metho...

Nickel electroplating compositions with copolymers of arginine and...

Joining member, solder material, solder paste, formed solder, flux...

Pollution-free electroplating solution for electroplating and prepa...

Environmentally friendly nickel electroplating compositions and met...

Enhanced plating bath and additive chemistries for cobalt plating

Metallic material for electronic components and method for producin...

Carrier-attached copper foil, laminate, method for manufacturing pr...

Needle and method for manufacturing the same

Copper foil provided with carrier, laminate, printed wiring board,...

3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electr...

Chemistry additives and process for cobalt film electrodeposition

Method of making sound interface in overcast bimetal components

Galvanic nickel electroplating bath for depositing a semi-bright ni...

Composite plated product

Biological molecule-immobilized chip and its use

Production of nickelized shaped articles

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR ELECTROPLATING ARTICLE WITH METAL

NICKEL ELECTROPLATING COMPOSITIONS FOR ROUGH NICKEL

NICKEL ELECTROPLATING COMPOSITIONS FOR ROUGH NICKEL

PRODUCTION OF NANOPOROUS FILMS

Composition for Cobalt Electroplating Comprising Leveling Agent

GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING...

Composition and Method for Fabrication of Nickel Interconnects

Cobalt Filling of Interconnects

METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...

HIGH-STRENGTH SINGLE-CRYSTAL LIKE NANOTWINNED NICKEL COATINGS AND M...

COMPOSITION FOR COBALT OR COBALT ALLOY ELECTROPLATING

COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...

METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD...

COMPOSITION FOR COBALT ELECTROPLATING COMPRISING LEVELING AGENT

A BATH AND METHOD FOR FILLING A VERTICAL INTERCONNECT ACCESS OR TRE...

ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING

COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...

POLLUTION-FREE ELECTROPLATING SOLUTION FOR ELECTROPLATING AND PREPA...

NICKEL ELECTROPLATING COMPOSITIONS WITH COPOLYMERS OF ARGININE AND...

NICKEL ELECTROPLATING COMPOSITIONS WITH CATIONIC POLYMERS AND METHO...

ENVIRONMENTALLY FRIENDLY NICKEL ELECTROPLATING COMPOSITIONS AND MET...

ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING

CHEMISTRY ADDITIVES AND PROCESS FOR COBALT FILM ELECTRODEPOSITION

METHODS OF COATING SUBSTRATES WITH COMPOSITE COATINGS OF DIAMOND NA...

GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING...

SURFACE TREATED PLATING MATERIAL AND METHOD FOR PRODUCING THE SAME,...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

CORROSION-RESISTANT ALLOY COATING FILM FOR METAL MATERIALS AND METH...

SOFT PACKAGE LITHIUM BATTERY TAB MATERIAL AND ITS METHOD OF PLATING...

NICKEL-CONTAINING LAYER ARRANGEMENT FOR INTAGLIO PRINTING