Including means to apply thermal shock to work

Industry

CPC
Y10T225/304

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T225/00Severing by tearing or breaking

Current Industry

Y10T225/304Including means to apply thermal shock to work

Industries

Patents Grantslast 30 patents

Information Patent Grant
Glass bottle cutter based on electric heating
- Patent number 11,485,672
- Issue date Nov 1, 2022
- Qi Zheng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Combined wafer production method with a receiving layer having holes
- Patent number 10,960,574
- Issue date Mar 30, 2021
- Siltectra GmbH
- Jan Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cutting plate-like glass, and cutting device therefor
- Patent number 10,829,404
- Issue date Nov 10, 2020
- Nippon Electric Glass Co., Ltd.
- Yasuo Teranishi
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of separating a back layer on a singulated semiconductor waf...
- Patent number 10,770,350
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cutting brittle material, device for cutting brittle mate...
- Patent number 10,576,651
- Issue date Mar 3, 2020
- Central Glass Co., Ltd.
- Hiroyuki Tamon
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method of separating a back layer on a singulated semiconductor waf...
- Patent number 10,553,491
- Issue date Feb 4, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of singulating semiconductor wafer having a plurality of die...
- Patent number 10,269,642
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of singulating semiconductor wafer having back layer
- Patent number 9,564,365
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Waste fluorescent light end-cutting apparatus
- Patent number 9,552,954
- Issue date Jan 24, 2017
- KYONGGI UNIVERSITY INDUSTRY & ACADEMIA COOPERATION FOUNDATION
- Seung-Whee Rhee
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Systems and methods for producing silicon slim rods
- Patent number 9,527,158
- Issue date Dec 27, 2016
- ATS Automation Tooling Systems Inc.
- Gerald Wootton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating a sheet of brittle material
- Patent number 8,269,138
- Issue date Sep 18, 2012
- Corning Incorporated
- Sean Matthew Garner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brittle workpiece splitting system and brittle workpiece splitting...
- Patent number 8,104,385
- Issue date Jan 31, 2012
- Shibaura Mechatronics Corporation
- Masakazu Hayashi
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Apparatus and method for scribing substrate
- Patent number 7,934,976
- Issue date May 3, 2011
- LG Display Co., Ltd.
- Kwang Jong Yoo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for cutting nonmetal material
- Patent number 7,880,118
- Issue date Feb 1, 2011
- Instrument Technology Research Center, National Applied Research Laboratories
- Yuan-Chieh Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of breaking a brittle substrate
- Patent number 7,838,795
- Issue date Nov 23, 2010
- Mitsuboshi Diamond Industrial Co., Ltd.
- Rudolf Heinrich Brzesowsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and apparatus for scoring a brittle material
- Patent number 7,820,941
- Issue date Oct 26, 2010
- Corning Incorporated
- James W Brown
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for forming cracks
- Patent number 7,726,532
- Issue date Jun 1, 2010
- Mitsuboshi Diamond Industrial Co., Ltd.
- Togo Gonoe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass-plate cutting machine
- Patent number 7,642,483
- Issue date Jan 5, 2010
- Rorze Systems Corporation
- Ki-Yong You
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method for cutting an LCD substrate using coolant having low surfac...
- Patent number 7,542,125
- Issue date Jun 2, 2009
- Samsung Electronics Co., Ltd.
- Gi-Heon Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scribing apparatus, substrate cutting apparatus equipped with the s...
- Patent number 7,528,341
- Issue date May 5, 2009
- LG Display Co., Ltd.
- Jung Sik Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of cutting laminated glass with laser beams
- Patent number 7,423,237
- Issue date Sep 9, 2008
- The Japan Steel Works, Ltd.
- Hideaki Kusama
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
In-line system and method for manufacturing liquid crystal display
- Patent number 7,138,030
- Issue date Nov 21, 2006
- Samsung Electronics Co., Ltd.
- Dae-Ho Choo
- G02 - OPTICS
Information Patent Grant
Method for cutting the edges of a continuous glass ribbon, a device...
- Patent number 7,128,250
- Issue date Oct 31, 2006
- Saint-Gobain Glass France
- Mauro Lucio Nascimento Luiz
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method and device for cutting flat work pieces made of a brittle ma...
- Patent number 7,014,082
- Issue date Mar 21, 2006
- Schott AG
- Dirk Hauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of removing stators from tubular stator housings
- Patent number 6,973,707
- Issue date Dec 13, 2005
- John Russell McKay
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Method and apparatus for fracturing brittle materials by thermal st...
- Patent number 6,912,356
- Issue date Jun 28, 2005
- Diversified Industries Ltd.
- Norman L. Arrison
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and device for cutting a flat glass plate into a number of r...
- Patent number 6,870,129
- Issue date Mar 22, 2005
- Schott Glas
- Dirk Hauer
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Automatic picture tube cutting machine
- Patent number 6,837,410
- Issue date Jan 4, 2005
- Neng-Kuei Yeh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method and device for the separation of flat workpieces made from a...
- Patent number 6,811,069
- Issue date Nov 2, 2004
- Schott Glas
- Dirk Hauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass cutting method and apparatus with controlled laser beam energy
- Patent number 6,812,430
- Issue date Nov 2, 2004
- LG Electronics Inc.
- Hyoung Shik Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SINGULATING SEMICONDUCTOR WAFER HAVING A PLURALITY OF DIE...
- Publication number 20200118878
- Publication date Apr 16, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF SINGULATING SEMICONDUCTOR WAFER HAVING A PLURALITY OF DIE...
- Publication number 20190214301
- Publication date Jul 11, 2019
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD AND APPARATUS
- Publication number 20140127880
- Publication date May 8, 2014
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR CUTTING PLATE-LIKE GLASS, AND CUTTING DEVICE THEREFOR
- Publication number 20140054348
- Publication date Feb 27, 2014
- Yasuo Teranishi
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEMS AND METHODS FOR PRODUCING SILICON SLIM RODS
- Publication number 20130174607
- Publication date Jul 11, 2013
- ATS Automation Tooling Systems Inc.
- Gerald WOOTTON
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
APPARATUS AND METHOD CHARACTERIZING GLASS SHEETS
- Publication number 20130126576
- Publication date May 23, 2013
- Dale Charles Marshall
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
METHOD AND APARATUS FOR PRODUCING AN ELASTICALLY DEFORMABLE GLASS P...
- Publication number 20120061440
- Publication date Mar 15, 2012
- Grenzebach Maschinenbau GmbH
- Bernhard Roell
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
WAFER CUTTING METHOD AND A SYSTEM THEREOF
- Publication number 20110244659
- Publication date Oct 6, 2011
- Agency for Science, Technology and Research
- Zhongke Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING A SHEET OF BRITTLE MATERIAL
- Publication number 20100294748
- Publication date Nov 25, 2010
- Sean Matthew Garner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for the separative machining of components made from brittle...
- Publication number 20090014492
- Publication date Jan 15, 2009
- Michael Haase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Separating Non-Metallic Material Using Microwave Radiation
- Publication number 20080236199
- Publication date Oct 2, 2008
- Vladislav Sklyarevich
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Method for cutting nonmetal material
- Publication number 20080074747
- Publication date Mar 27, 2008
- Instrument Technology Research Center National Applied Research Laboratories
- Yuan-Chieh Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Forming Cracks
- Publication number 20070228100
- Publication date Oct 4, 2007
- Togo Gonoe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate dividing apparatus and method for dividing substrate
- Publication number 20070164072
- Publication date Jul 19, 2007
- Yoshitaka Nishio
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
IN-LINE SYSTEM AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY
- Publication number 20070056686
- Publication date Mar 15, 2007
- Dae-Ho Choo
- G02 - OPTICS
Information Patent Application
Glass cutting method
- Publication number 20060201983
- Publication date Sep 14, 2006
- Hideaki Kusama
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Glass-plate cutting machine
- Publication number 20060151450
- Publication date Jul 13, 2006
- Ki-Yong You
- G02 - OPTICS
Information Patent Application
Scribing apparatus, substrate cutting apparatus equipped with the s...
- Publication number 20060097022
- Publication date May 11, 2006
- LG. Philips LCD Co., Ltd.
- Jung Sik Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Brittle workpiece splitting system and brittle workpiece splitting...
- Publication number 20060081101
- Publication date Apr 20, 2006
- SHIBAURA MECHATRONICS CORPORATION
- Masakazu Hayashi
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Method for cutting substrate using coolant
- Publication number 20060065647
- Publication date Mar 30, 2006
- Gi-Heon Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process and apparatus for scoring a brittle material
- Publication number 20060022008
- Publication date Feb 2, 2006
- James W. Brown
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of breaking a brittle substrate
- Publication number 20050263503
- Publication date Dec 1, 2005
- Rudolf Heinrich Brzesowsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for scribing substrate
- Publication number 20050252943
- Publication date Nov 17, 2005
- LG. Philips LCD Co., Ltd.
- Kwang Jong Yoo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and device for cutting flat work pieces made of a brittle ma...
- Publication number 20050029321
- Publication date Feb 10, 2005
- Dirk Hauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CRT separation apparatus
- Publication number 20040160200
- Publication date Aug 19, 2004
- Hidenori Hakage
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
In-line system and method for manufacturing liquid crystal display
- Publication number 20040150766
- Publication date Aug 5, 2004
- Dae-Ho Choo
- G02 - OPTICS
Information Patent Application
METHOD AND APPARATUS FOR FRACTURING BRITTLE MATERIALS BY THERMAL ST...
- Publication number 20040104216
- Publication date Jun 3, 2004
- Norman L. Arrison
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for cutting the edges of a continuous glass ribbon, a device...
- Publication number 20040060416
- Publication date Apr 1, 2004
- Mauro Lucio Nascimento Luiz
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and device for cutting a flat glass plate into a number of r...
- Publication number 20040020960
- Publication date Feb 5, 2004
- Dirk Hauer
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Glass cutting method and apparatus
- Publication number 20030201261
- Publication date Oct 30, 2003
- LG ELECTRONICS INC.
- Hyoung Shik Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Including means to apply thermal shock to work

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Glass bottle cutter based on electric heating

Combined wafer production method with a receiving layer having holes

Method for cutting plate-like glass, and cutting device therefor

Method of separating a back layer on a singulated semiconductor waf...

Method of cutting brittle material, device for cutting brittle mate...

Method of separating a back layer on a singulated semiconductor waf...

Method of singulating semiconductor wafer having a plurality of die...

Method of singulating semiconductor wafer having back layer

Waste fluorescent light end-cutting apparatus

Systems and methods for producing silicon slim rods

Method for separating a sheet of brittle material

Brittle workpiece splitting system and brittle workpiece splitting...

Apparatus and method for scribing substrate

Method for cutting nonmetal material

Method of breaking a brittle substrate

Process and apparatus for scoring a brittle material

Method and apparatus for forming cracks

Glass-plate cutting machine

Method for cutting an LCD substrate using coolant having low surfac...

Scribing apparatus, substrate cutting apparatus equipped with the s...

Method of cutting laminated glass with laser beams

In-line system and method for manufacturing liquid crystal display

Method for cutting the edges of a continuous glass ribbon, a device...

Method and device for cutting flat work pieces made of a brittle ma...

Method of removing stators from tubular stator housings

Method and apparatus for fracturing brittle materials by thermal st...

Method and device for cutting a flat glass plate into a number of r...

Automatic picture tube cutting machine

Method and device for the separation of flat workpieces made from a...

Glass cutting method and apparatus with controlled laser beam energy

Patents Applicationslast 30 patents

METHOD OF SINGULATING SEMICONDUCTOR WAFER HAVING A PLURALITY OF DIE...

METHOD OF SINGULATING SEMICONDUCTOR WAFER HAVING A PLURALITY OF DIE...

SEMICONDUCTOR DIE SINGULATION METHOD AND APPARATUS

METHOD FOR CUTTING PLATE-LIKE GLASS, AND CUTTING DEVICE THEREFOR

SYSTEMS AND METHODS FOR PRODUCING SILICON SLIM RODS

APPARATUS AND METHOD CHARACTERIZING GLASS SHEETS

METHOD AND APARATUS FOR PRODUCING AN ELASTICALLY DEFORMABLE GLASS P...

WAFER CUTTING METHOD AND A SYSTEM THEREOF

METHOD FOR SEPARATING A SHEET OF BRITTLE MATERIAL

Device for the separative machining of components made from brittle...

Method of Separating Non-Metallic Material Using Microwave Radiation

Method for cutting nonmetal material

Method and Apparatus for Forming Cracks

Substrate dividing apparatus and method for dividing substrate

IN-LINE SYSTEM AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY

Glass cutting method

Glass-plate cutting machine

Scribing apparatus, substrate cutting apparatus equipped with the s...

Brittle workpiece splitting system and brittle workpiece splitting...

Method for cutting substrate using coolant

Process and apparatus for scoring a brittle material

Method of breaking a brittle substrate

Apparatus and method for scribing substrate

Method and device for cutting flat work pieces made of a brittle ma...

CRT separation apparatus

In-line system and method for manufacturing liquid crystal display

METHOD AND APPARATUS FOR FRACTURING BRITTLE MATERIALS BY THERMAL ST...

Method for cutting the edges of a continuous glass ribbon, a device...

Method and device for cutting a flat glass plate into a number of r...

Glass cutting method and apparatus