including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one

Industry

CPC
B24B49/05

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work Arrangements of indicating or measuring equipment

Current Industry

B24B49/05including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wafer thinning apparatus having feedback control
- Patent number 11,728,172
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Hsuan Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Method, apparatus, and system for determining optimum operation rec...
- Patent number 11,648,643
- Issue date May 16, 2023
- Ebara Corporation
- Yuki Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of identifying trajectory of eddy current sensor, method of...
- Patent number 11,376,704
- Issue date Jul 5, 2022
- Ebara Corporation
- Akira Nakamura
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing bearing components
- Patent number 11,285,579
- Issue date Mar 29, 2022
- Schaeffler Technologies AG & Co. KG
- Wolfgang Schnabel
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus and method
- Patent number 11,195,729
- Issue date Dec 7, 2021
- Ebara Corporation
- Yuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer thinning apparatus having feedback control and method of using
- Patent number 10,643,853
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Hsuan Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Real time profile control for chemical mechanical polishing
- Patent number 10,562,148
- Issue date Feb 18, 2020
- Applied Materials, Inc.
- Shih-Haur Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 10,399,203
- Issue date Sep 3, 2019
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding machine and method with improved teaching operation
- Patent number 9,056,385
- Issue date Jun 16, 2015
- NSK Ltd.
- Takashi Nishide
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic selection of reference spectra library
- Patent number 8,755,928
- Issue date Jun 17, 2014
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Method of modeling and controlling the endpoint of chemical mechani...
- Patent number 6,534,328
- Issue date Mar 18, 2003
- Advanced Micro Devices, Inc.
- Joyce S. Oey Hewett
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing a semiconductor wafer according to the process time b...
- Patent number 6,514,861
- Issue date Feb 4, 2003
- ProMos Technologies Inc.
- Ming-Cheng Yang
- B24 - GRINDING POLISHING
Information Patent Grant
Method and relevant apparatus for controlling machine tools
- Patent number 4,703,587
- Issue date Nov 3, 1987
- Marposs Societa' per Azioni
- Antonio Bolognesi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
UNDERLAYER TOPOGRAPHY METAL RESIDUE DETECTION AND OVERPOLISHING STR...
- Publication number 20240165768
- Publication date May 23, 2024
- Applied Materials, Inc.
- Kun XU
- B24 - GRINDING POLISHING
Information Patent Application
WAFER THINNING METHOD HAVING FEEDBACK CONTROL
- Publication number 20230360919
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Hsuan Chen
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20220402094
- Publication date Dec 22, 2022
- TOKYO ELECTRON LIMITED
- Nobutaka FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20220402087
- Publication date Dec 22, 2022
- TOKYO ELECTRON LIMITED
- Nobutaka FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND GRINDING MACHINE FOR FABRICATING A WORKPIECE COMPRISING...
- Publication number 20210122002
- Publication date Apr 29, 2021
- Rollomatic S.A.
- Jean-Charles MARTY
- B24 - GRINDING POLISHING
Information Patent Application
METHOD, APPARATUS, AND SYSTEM FOR DETERMINING OPTIMUM OPERATION REC...
- Publication number 20200406422
- Publication date Dec 31, 2020
- EBARA CORPORATION
- Yuki Watanabe
- B24 - GRINDING POLISHING
Information Patent Application
WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL
- Publication number 20200258756
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BEARING COMPONENTS
- Publication number 20190240806
- Publication date Aug 8, 2019
- SCHAEFFLER TECHNOLOGIES AG & CO. KG
- Wolfgang Schnabel
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND METHOD
- Publication number 20190027382
- Publication date Jan 24, 2019
- EBARA CORPORATION
- Yuki WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAL TIME PROFILE CONTROL FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20180099374
- Publication date Apr 12, 2018
- Shih-Haur Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20170190020
- Publication date Jul 6, 2017
- EBARA CORPORATION
- Yoichi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRINDING MACHINE AND GRINDING METHOD
- Publication number 20140148081
- Publication date May 29, 2014
- NSK Ltd.
- Takashi Nishide
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTOMATIC SELECTION OF REFERENCE SPECTRA LIBRARY
- Publication number 20120276814
- Publication date Nov 1, 2012
- Jimin Zhang
- B24 - GRINDING POLISHING

including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer thinning apparatus having feedback control

Method, apparatus, and system for determining optimum operation rec...

Method of identifying trajectory of eddy current sensor, method of...

Method for producing bearing components

Substrate polishing apparatus and method

Wafer thinning apparatus having feedback control and method of using

Real time profile control for chemical mechanical polishing

Polishing method and polishing apparatus

Grinding machine and method with improved teaching operation

Automatic selection of reference spectra library

Method of modeling and controlling the endpoint of chemical mechani...

Manufacturing a semiconductor wafer according to the process time b...

Method and relevant apparatus for controlling machine tools

Patents Applicationslast 30 patents

UNDERLAYER TOPOGRAPHY METAL RESIDUE DETECTION AND OVERPOLISHING STR...

WAFER THINNING METHOD HAVING FEEDBACK CONTROL

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD AND GRINDING MACHINE FOR FABRICATING A WORKPIECE COMPRISING...

METHOD, APPARATUS, AND SYSTEM FOR DETERMINING OPTIMUM OPERATION REC...

WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL

METHOD FOR PRODUCING BEARING COMPONENTS

SUBSTRATE POLISHING APPARATUS AND METHOD

REAL TIME PROFILE CONTROL FOR CHEMICAL MECHANICAL POLISHING

POLISHING METHOD AND POLISHING APPARATUS

GRINDING MACHINE AND GRINDING METHOD

AUTOMATIC SELECTION OF REFERENCE SPECTRA LIBRARY