incorporating means for treating the terminal leads only before insertion

Industry

CPC
H05K13/0439

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/0439incorporating means for treating the terminal leads only before insertion

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Component supply device and component mounting device
- Patent number 11,357,144
- Issue date Jun 7, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Correction mechanism for pin and correction device
- Patent number 9,549,492
- Issue date Jan 17, 2017
- Hong Fu Precision Industry (ShenZhen) Co., Ltd.
- Bing Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tray holding device
- Patent number 8,118,531
- Issue date Feb 21, 2012
- Hirata Corporation
- Yoshito Watanabe
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Components insertion method
- Patent number 7,568,284
- Issue date Aug 4, 2009
- Panasonic Corporation
- Shozo Kadota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit with offset pins
- Patent number 7,414,308
- Issue date Aug 19, 2008
- Micronas GmbH
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for testing a chip with a package and for mounting the packa...
- Patent number 7,284,321
- Issue date Oct 23, 2007
- Micronas GmbH
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit with offset pins
- Patent number 7,053,480
- Issue date May 30, 2006
- Micronas GmbH
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for configuring and inserting component leads into printe...
- Patent number 6,581,274
- Issue date Jun 24, 2003
- Trans Tron Ltd., Inc.
- Michael E. Salmon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Programmable lead conditioner
- Patent number 5,777,886
- Issue date Jul 7, 1998
- Semiconductor Technologies & Instruments, Inc.
- Michael D. Glucksman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component observation system
- Patent number 5,519,495
- Issue date May 21, 1996
- Matsushita Electric Industrial Co., Ltd.
- Shintaro Kawaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conveying device for electrical components
- Patent number 5,494,149
- Issue date Feb 27, 1996
- Sillner; Kamilla
- Georg Sillner
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Electric component observation system
- Patent number 5,420,691
- Issue date May 30, 1995
- Matsushita Electric Industrial Co., Ltd.
- Shintaro Kawaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape automated bonding feeder and lead forming apparatus
- Patent number 5,287,608
- Issue date Feb 22, 1994
- Microtek Industries
- J. Gregg Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape automated bonding feeder and lead forming apparatus
- Patent number 5,133,390
- Issue date Jul 28, 1992
- Microtek Industries, Inc.
- J. Gregg Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for bending the leads of electrical and/or electronic compon...
- Patent number 4,718,461
- Issue date Jan 12, 1988
- Arcotronics Italia, S.p.A.
- Mario Musiani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembling electrical connectors to a circuit board
- Patent number 4,718,165
- Issue date Jan 12, 1988
- AMP Incorporated
- George D. Reuss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of and apparatus for mounting an electronic part
- Patent number 4,670,979
- Issue date Jun 9, 1987
- Silver Seiko Ltd.
- Shigeru Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inserter device for electronic components
- Patent number 4,670,977
- Issue date Jun 9, 1987
- AVX Corporation
- DeHart G. Scrantom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component handling apparatus
- Patent number 4,663,821
- Issue date May 12, 1987
- Zenith Electronics Corporation
- Carl Campisi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor for component plug-in
- Patent number 4,654,964
- Issue date Apr 7, 1987
- Siemens Aktiengesellschaft
- Bernd Schneider
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for inserting leads of electrical components i...
- Patent number 4,625,399
- Issue date Dec 2, 1986
- Universal Instruments Corporation
- Albert W. Zemek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for gripping multilead articles
- Patent number 4,616,414
- Issue date Oct 14, 1986
- AT&T Technologies, Inc.
- Robert H. Cushman
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus for maintaining electronic component pin alignment
- Patent number 4,573,254
- Issue date Mar 4, 1986
- Sperry Corporation
- Kenneth H. Kirk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for automatically inserting electronic parts into printed...
- Patent number 4,566,071
- Issue date Jan 21, 1986
- Ikegami Tsushinki Co. Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal straightener for an integrated circuit package
- Patent number 4,544,003
- Issue date Oct 1, 1985
- Burroughs Corporation
- Richard L. Bumann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inserter device for electronic components
- Patent number 4,539,740
- Issue date Sep 10, 1985
- AVX Corporation
- DeHart G. Scrantom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-channel position detection system
- Patent number 4,529,315
- Issue date Jul 16, 1985
- Westinghouse Electric Corp.
- Brian S. Cohen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for proper registration of mating parts
- Patent number 4,500,032
- Issue date Feb 19, 1985
- Universal Instruments Corporation
- Daniel W. Ackerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment apparatus and method for mounting LSI and VLSI packages t...
- Patent number 4,479,298
- Issue date Oct 30, 1984
- Storage Technology Partners
- Paul Hug
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for securing a component to a printed circuit board
- Patent number 4,462,435
- Issue date Jul 31, 1984
- RCA Corporation
- George J. Whitley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CORRECTION MECHANISM FOR PIN AND CORRECTION DEVICE
- Publication number 20140007422
- Publication date Jan 9, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- BING LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tray Holding Device
- Publication number 20090169345
- Publication date Jul 2, 2009
- Hirata Corporation
- Yoshito Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Part inserting head device, part inserting device, and part inserti...
- Publication number 20060164794
- Publication date Jul 27, 2006
- Shozo Kadota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for testing a chip with a package and for mounting the packa...
- Publication number 20060108679
- Publication date May 25, 2006
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for testing a chip with a package and for mounting the packa...
- Publication number 20050258849
- Publication date Nov 24, 2005
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for testing a chip with a housing and for placing said housi...
- Publication number 20050009216
- Publication date Jan 13, 2005
- Wolfgang Hauser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

incorporating means for treating the terminal leads only before insertion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component supply device and component mounting device

Correction mechanism for pin and correction device

Tray holding device

Components insertion method

Integrated circuit with offset pins

Method for testing a chip with a package and for mounting the packa...

Integrated circuit with offset pins

Apparatus for configuring and inserting component leads into printe...

Programmable lead conditioner

Electronic component observation system

Conveying device for electrical components

Electric component observation system

Tape automated bonding feeder and lead forming apparatus

Tape automated bonding feeder and lead forming apparatus

Device for bending the leads of electrical and/or electronic compon...

Assembling electrical connectors to a circuit board

Method of and apparatus for mounting an electronic part

Inserter device for electronic components

Component handling apparatus

Sensor for component plug-in

Method and apparatus for inserting leads of electrical components i...

Method and apparatus for gripping multilead articles

Apparatus for maintaining electronic component pin alignment

Apparatus for automatically inserting electronic parts into printed...

Terminal straightener for an integrated circuit package

Inserter device for electronic components

Multi-channel position detection system

Method and apparatus for proper registration of mating parts

Alignment apparatus and method for mounting LSI and VLSI packages t...

Apparatus for securing a component to a printed circuit board

Patents Applicationslast 30 patents

CORRECTION MECHANISM FOR PIN AND CORRECTION DEVICE

Tray Holding Device

Part inserting head device, part inserting device, and part inserti...

Method for testing a chip with a package and for mounting the packa...

Method for testing a chip with a package and for mounting the packa...

Method for testing a chip with a housing and for placing said housi...