Ink in pores

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Y10T428/249996

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T428/00Stock material or miscellaneous articles

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Y10T428/249996Ink in pores

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Patents Grantslast 30 patents

Information Patent Grant
Pressure indicator films for high temperature applications
- Patent number 10,067,011
- Issue date Sep 4, 2018
- International Business Machines Corporation
- Scott B. King
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ink for ink-jet recording
- Patent number 8,093,311
- Issue date Jan 10, 2012
- Brother Kogyo Kabushiki Kaisha
- Akiko Noguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Black food containers
- Patent number 7,306,836
- Issue date Dec 11, 2007
- Dixie Consumer Products LLC
- Donald C. McCarthy
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing a double-sided circuit board
- Patent number 7,174,632
- Issue date Feb 13, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Kawakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Water-metachromatic laminate, and process for its production
- Patent number 7,056,570
- Issue date Jun 6, 2006
- The Pilot Ink Co., Ltd.
- Akio Nakashima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Water-metachromatic laminate, and process for its production
- Patent number 6,984,418
- Issue date Jan 10, 2006
- The Pilot Ink Co., Ltd.
- Akio Nakashima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Water-metachromatic laminate, and process for its production
- Patent number 6,964,807
- Issue date Nov 15, 2005
- The Pilot Ink Co., Ltd.
- Akio Nakashima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multilayer wiring board assembly, multilayer wiring board assembly...
- Patent number 6,914,199
- Issue date Jul 5, 2005
- Fujikura Ltd.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stock material for container body of insulating paper container, in...
- Patent number 6,908,651
- Issue date Jun 21, 2005
- Sanyo Pax Kabushiki Kaisha
- Hiromi Watanabe
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Insulation sheet, multi-layer wiring substrate and production proce...
- Patent number 6,855,892
- Issue date Feb 15, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shingo Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board assembly, multilayer wiring board assembly...
- Patent number 6,831,236
- Issue date Dec 14, 2004
- Fujikura Ltd.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stock material for container body of insulating paper container, in...
- Patent number 6,749,913
- Issue date Jun 15, 2004
- Sanyo Pax Kabushiki Kaisha
- Hiromi Watanabe
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Circuit board having an interstitial inner via hole structure
- Patent number 6,734,375
- Issue date May 11, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Kawakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, and method and apparatus for manufacturing th...
- Patent number 6,671,951
- Issue date Jan 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Toshihiro Nishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Random microembossed receptor media
- Patent number 6,649,249
- Issue date Nov 18, 2003
- 3M Innovative Properties Company
- Lori P. Engle
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Irreversible heat-sensitive composition
- Patent number 6,602,594
- Issue date Aug 5, 2003
- Nichiyu Giken Kogyo Co., Ltd.
- Sachie Miyata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed wiring board, and method and apparatus for manufacturing th...
- Patent number 6,518,515
- Issue date Feb 11, 2003
- Matsushita Electric Industrial Co, LTD
- Toshihiro Nishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole wiring board
- Patent number 6,515,237
- Issue date Feb 4, 2003
- Hitachi Chemical Company, Ltd.
- Junichi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board and method for producing same
- Patent number 6,512,182
- Issue date Jan 28, 2003
- NGK Spark Plug Co., Ltd.
- Hiroki Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pigmented porous material
- Patent number 6,495,250
- Issue date Dec 17, 2002
- Ciba Specialty Chemicals Corporation
- Hans-Thomas Schacht
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Image-forming substrate coated with layer of microcapsules
- Patent number 6,482,471
- Issue date Nov 19, 2002
- Asahi Kogaku Kogyo Kabushiki Kaisha
- Minoru Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Printing sheet for stamp
- Patent number 6,440,549
- Issue date Aug 27, 2002
- Brother Kogyo Kabushiki Kaisha
- Keiji Seo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printed circuit board
- Patent number 6,326,694
- Issue date Dec 4, 2001
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and assembly of the same
- Patent number 6,324,067
- Issue date Nov 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Tousaku Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 6,211,487
- Issue date Apr 3, 2001
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Decorative laminated sheet
- Patent number 6,183,842
- Issue date Feb 6, 2001
- Riken Vinyl Industry Co., Ltd.
- Motohiro Shimizu
- B44 - DECORATIVE ARTS
Information Patent Grant
Information handling system with circuit assembly having holes fill...
- Patent number 6,178,093
- Issue date Jan 23, 2001
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a circuit board with filled holes
- Patent number 6,138,350
- Issue date Oct 31, 2000
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad methods of manufacture and use
- Patent number 6,136,043
- Issue date Oct 24, 2000
- Micron Technology, Inc.
- Karl M. Robinson
- B24 - GRINDING POLISHING
Information Patent Grant
Circuit board with wiring sealing filled holes
- Patent number 6,127,025
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ink for ink-jet recording
- Publication number 20060205839
- Publication date Sep 14, 2006
- Akiko Noguchi
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
Multilayer wiring board assembly, multilayer wiring board assembly...
- Publication number 20050016765
- Publication date Jan 27, 2005
- FUJIKURA LTD.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Water-metachromatic laminate, and process for its production
- Publication number 20040191487
- Publication date Sep 30, 2004
- The Pilot Ink Co., Ltd.
- Akio Nakashima
- B32 - LAYERED PRODUCTS
Information Patent Application
Water-metachromatic laminate, and process for its production
- Publication number 20040185234
- Publication date Sep 23, 2004
- The Pilot Ink Co., Ltd.
- Akio Nakashima
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit board electrically insulating material, circuit board and m...
- Publication number 20040142161
- Publication date Jul 22, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Kawakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STOCK MATERIAL FOR CONTAINER BODY OF INSULATING PAPER CONTAINER, IN...
- Publication number 20030190440
- Publication date Oct 9, 2003
- HIROMI WATANABE
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermoformed food containers with colorfast high color density blac...
- Publication number 20030190443
- Publication date Oct 9, 2003
- Donald C. McCarthy
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Insulation sheet and multi-layer wiring substrate and production pr...
- Publication number 20030085058
- Publication date May 8, 2003
- Shingo Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stock material for container body of insulating paper container, in...
- Publication number 20030017284
- Publication date Jan 23, 2003
- Sanyo Pax Kabushiki Kaisha
- Hiromi Watanabe
- B32 - LAYERED PRODUCTS
Information Patent Application
Wiring circuit board and method for producing same
- Publication number 20020185303
- Publication date Dec 12, 2002
- NGK SPARK PLUG CO., LTD.
- Hiroki Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring board assembly, multilayer wiring board assembly...
- Publication number 20020134584
- Publication date Sep 26, 2002
- FUJIKURA LTD.
- Reiji Higuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Through-hole wiring board
- Publication number 20020062990
- Publication date May 30, 2002
- Junichi Kikuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Circuit board electrically insulating material, circuit board and m...
- Publication number 20020053465
- Publication date May 9, 2002
- Matsushita electric Inductrial Co., Ltd.
- Yoshihiro Kawakita
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Water-metachromatic laminate, and process for its production
- Publication number 20020052161
- Publication date May 2, 2002
- Akio Nakashima
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed wiring board, and method and apparatus for manufactujring t...
- Publication number 20020020556
- Publication date Feb 21, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Toshihiro Nishii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed wiring board, and method and apparatus for manufacturing th...
- Publication number 20020020557
- Publication date Feb 21, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Toshihiro Nishii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Irreversible heat-sensitive composition
- Publication number 20010044014
- Publication date Nov 22, 2001
- NICHIYU GIKEN KOGYO CO., LTD.
- Sachie Miyata
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Connecting member of a circuit substrate and method of manufacturin...
- Publication number 20010003610
- Publication date Jun 14, 2001
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20010002294
- Publication date May 31, 2001
- Akihito Hatakeyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Ink in pores

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure indicator films for high temperature applications

Ink for ink-jet recording

Black food containers

Method of manufacturing a double-sided circuit board

Water-metachromatic laminate, and process for its production

Water-metachromatic laminate, and process for its production

Water-metachromatic laminate, and process for its production

Multilayer wiring board assembly, multilayer wiring board assembly...

Stock material for container body of insulating paper container, in...

Insulation sheet, multi-layer wiring substrate and production proce...

Multilayer wiring board assembly, multilayer wiring board assembly...

Stock material for container body of insulating paper container, in...

Circuit board having an interstitial inner via hole structure

Printed wiring board, and method and apparatus for manufacturing th...

Random microembossed receptor media

Irreversible heat-sensitive composition

Printed wiring board, and method and apparatus for manufacturing th...

Through-hole wiring board

Wiring circuit board and method for producing same

Pigmented porous material

Image-forming substrate coated with layer of microcapsules

Printing sheet for stamp

Printed circuit board

Printed wiring board and assembly of the same

Printed circuit board and method of manufacturing the same

Decorative laminated sheet

Information handling system with circuit assembly having holes fill...

Process for manufacturing a circuit board with filled holes

Polishing pad methods of manufacture and use

Circuit board with wiring sealing filled holes

Patents Applicationslast 30 patents

Ink for ink-jet recording

Multilayer wiring board assembly, multilayer wiring board assembly...

Water-metachromatic laminate, and process for its production

Water-metachromatic laminate, and process for its production

Circuit board electrically insulating material, circuit board and m...

STOCK MATERIAL FOR CONTAINER BODY OF INSULATING PAPER CONTAINER, IN...

Thermoformed food containers with colorfast high color density blac...

Insulation sheet and multi-layer wiring substrate and production pr...

Stock material for container body of insulating paper container, in...

Wiring circuit board and method for producing same

Multilayer wiring board assembly, multilayer wiring board assembly...

Through-hole wiring board

Circuit board electrically insulating material, circuit board and m...

Water-metachromatic laminate, and process for its production

Printed wiring board, and method and apparatus for manufactujring t...

Printed wiring board, and method and apparatus for manufacturing th...

Irreversible heat-sensitive composition

Connecting member of a circuit substrate and method of manufacturin...

Printed circuit board and method of manufacturing the same