Inspect wafer

Industry

CPC
G05B2219/37224

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G05Controlling systems G05BCONTROL OR REGULATING SYSTEMS IN GENERAL FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS G05B2219/00Program-control systems

Current Industry

G05B2219/37224Inspect wafer

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for measuring a property of a substrate
- Patent number 11,977,034
- Issue date May 7, 2024
- ASML Netherlands B.V.
- Wouter Lodewijk Elings
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and apparatus for automatically processing wafers
- Patent number 11,961,772
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Peng Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for enhancing the semiconductor manufacturing yield
- Patent number 11,681,279
- Issue date Jun 20, 2023
- ASML Netherlands B.V.
- Wei Fang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
System and method for controlling semiconductor manufacturing appar...
- Patent number 11,675,340
- Issue date Jun 13, 2023
- NANYA TECHNOLOGY CORPORATION
- Wen-Hsiang Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fab management with dynamic sampling plans, optimized wafer measure...
- Patent number 11,615,974
- Issue date Mar 28, 2023
- KLA Corporation
- Amnon Manassen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing apparatus equipped with substrate scanner
- Patent number 11,551,955
- Issue date Jan 10, 2023
- United Microelectronics Corp.
- Ming-Che Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Unsupervised defect segmentation
- Patent number 11,550,309
- Issue date Jan 10, 2023
- KLA Corporation
- Erfan Soltanmohammadi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method for validating measurement data
- Patent number 11,353,324
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chui-Jung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for wafer to wafer bonding
- Patent number 11,335,607
- Issue date May 17, 2022
- Tokyo Electron Limited
- Nathan Ip
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heating processing apparatus and heating processing method
- Patent number 11,127,611
- Issue date Sep 21, 2021
- TOSHIBA MEMORY CORPORATION
- Makoto Aida
- G05 - CONTROLLING REGULATING
Information Patent Grant
Substrate processing in a process chamber for semiconductor manufac...
- Patent number 11,086,304
- Issue date Aug 10, 2021
- Kokusai Electric Corporation
- Kazuhide Asai
- G05 - CONTROLLING REGULATING
Information Patent Grant
Data management and mining to correlate wafer alignment, design, de...
- Patent number 11,088,039
- Issue date Aug 10, 2021
- Applied Materials, Inc.
- Raman K. Nurani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring a property of a substrate
- Patent number 10,996,176
- Issue date May 4, 2021
- ASML Netherlands B.V.
- Wouter Lodewijk Elings
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and machine for examining wafers
- Patent number 10,840,156
- Issue date Nov 17, 2020
- ASML Netherlands B.V.
- Chien-Hung Chou
- G05 - CONTROLLING REGULATING
Information Patent Grant
Self-contained metrology wafer carrier systems
- Patent number 10,818,528
- Issue date Oct 27, 2020
- GLOBALFOUNDRIES Inc.
- Abner Bello
- G05 - CONTROLLING REGULATING
Information Patent Grant
System, method and computer program product for generating a traini...
- Patent number 10,803,575
- Issue date Oct 13, 2020
- Applied Materials Israel Ltd.
- Ohad Shaubi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Auto defect screening using adaptive machine learning in semiconduc...
- Patent number 10,754,309
- Issue date Aug 25, 2020
- Applied Materials, Inc.
- Jason Zse-Cherng Lin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Methods and apparatus for measuring a property of a substrate
- Patent number 10,746,668
- Issue date Aug 18, 2020
- ASML Netherlands B.V.
- Wouter Lodewijk Elings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fabricating wafer by calculating process c...
- Patent number 10,739,688
- Issue date Aug 11, 2020
- Qoniac GmbH
- Boris Habets
- G05 - CONTROLLING REGULATING
Information Patent Grant
System and method for monitoring wafer handling and a wafer handlin...
- Patent number 10,593,575
- Issue date Mar 17, 2020
- GLOBALFOUNDRIES, INC.
- Stephen B. Miner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid inspection system for efficient process window discovery
- Patent number 10,551,827
- Issue date Feb 4, 2020
- KLA-Tencor Corporation
- Brian Duffy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of inspecting a specimen and system thereof
- Patent number 10,545,490
- Issue date Jan 28, 2020
- Applied Materials Israel Ltd.
- Michele Dalla-Torre
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for validating measurement data
- Patent number 10,520,303
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chui-Jung Chiu
- G05 - CONTROLLING REGULATING
Information Patent Grant
Automatic recipe stability monitoring and reporting
- Patent number 10,514,685
- Issue date Dec 24, 2019
- KLA-Tencor Corp.
- Hucheng Lee
- G05 - CONTROLLING REGULATING
Information Patent Grant
Identifying registration errors of DSA lines
- Patent number 10,401,841
- Issue date Sep 3, 2019
- KLA-Tencor Corporation
- Roie Volkovich
- G05 - CONTROLLING REGULATING
Information Patent Grant
Auto defect screening using adaptive machine learning in semiconduc...
- Patent number 10,365,617
- Issue date Jul 30, 2019
- DMO Systems Limited
- Jason Zse-Cherng Lin
- G05 - CONTROLLING REGULATING
Information Patent Grant
Feature selection and automated process window monitoring through o...
- Patent number 10,365,639
- Issue date Jul 30, 2019
- KLA-Tencor Corporation
- Shabnam Ghadar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatus for measuring a property of a substrate
- Patent number 10,317,191
- Issue date Jun 11, 2019
- ASML Netherlands B.V.
- Wouter Lodewijk Elings
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and apparatus for fabricating wafer by calculating process c...
- Patent number 10,295,914
- Issue date May 21, 2019
- Qoniac GmbH
- Boris Habets
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Self-contained metrology wafer carrier systems
- Patent number 10,242,895
- Issue date Mar 26, 2019
- GLOBALFOUNDRIES Inc.
- Abner Bello
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
DYNAMIC SAMPLING METHOD AND DEVICE FOR SEMICONDUCTOR MANUFACTURE
- Publication number 20240045408
- Publication date Feb 8, 2024
- WINBOND ELECTRONICS CORP.
- Kazuhiro Segawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR AUTOMATICALLY PROCESSING WAFERS
- Publication number 20230197535
- Publication date Jun 22, 2023
- ChangXin Memory Technologies, Inc.
- Peng YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MONITORING PROCESS VARIATION INDEX
- Publication number 20220397829
- Publication date Dec 15, 2022
- Samsung Electronics Co., Ltd.
- Dahan Kang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MULTICOMPONENT MODULE DESIGN AND FABRICATION
- Publication number 20220308564
- Publication date Sep 29, 2022
- International Business Machines Corporation
- Kirk D. Peterson
- G05 - CONTROLLING REGULATING
Information Patent Application
Apparatus and Methods for Wafer to Wafer Bonding
- Publication number 20220013416
- Publication date Jan 13, 2022
- TOKYO ELECTRON LIMITED
- Nathan Ip
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FAB MANAGEMENT WITH DYNAMIC SAMPLING PLANS, OPTIMIZED WAFER MEASURE...
- Publication number 20210335638
- Publication date Oct 28, 2021
- KLA Corporation
- Amnon MANASSEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING SEMICONDUCTOR MANUFACTURING APPAR...
- Publication number 20210320021
- Publication date Oct 14, 2021
- NANYA TECHNOLOGY CORPORATION
- WEN-HSIANG LAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS EQUIPPED WITH SUBSTRATE SCANNER
- Publication number 20210280444
- Publication date Sep 9, 2021
- UNITED MICROELECTRONICS CORP.
- Ming-Che Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210280445
- Publication date Sep 9, 2021
- TOKYO ELECTRON LIMITED
- Wataru NAKAGOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Measuring a Property of a Substrate
- Publication number 20210215622
- Publication date Jul 15, 2021
- ASML NETHERLANDS B.V.
- Wouter Lodewijk ELINGS
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD AND MACHINE FOR EXAMINING WAFERS
- Publication number 20210193537
- Publication date Jun 24, 2021
- ASML NETHERLANDS B.V.
- Chien-Hung CHOU
- G01 - MEASURING TESTING
Information Patent Application
Methods and Apparatus for Measuring a Property of a Substrate
- Publication number 20200319118
- Publication date Oct 8, 2020
- ASML NETHERLANDS B.V.
- Wouter Lodewijk ELINGS
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Unsupervised Defect Segmentation
- Publication number 20200218241
- Publication date Jul 9, 2020
- KLA-Tencor Corporation
- Erfan Soltanmohammadi
- G05 - CONTROLLING REGULATING
Information Patent Application
Method for Validating Measurement Data
- Publication number 20200124411
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chui-Jung Chiu
- G05 - CONTROLLING REGULATING
Information Patent Application
HEATING PROCESSING APPARATUS AND HEATING PROCESSING METHOD
- Publication number 20200075365
- Publication date Mar 5, 2020
- Toshiba Memory Corporation
- Makoto AIDA
- G05 - CONTROLLING REGULATING
Information Patent Application
AUTO DEFECT SCREENING USING ADAPTIVE MACHINE LEARNING IN SEMICONDUC...
- Publication number 20190384236
- Publication date Dec 19, 2019
- Applied Materials, Inc.
- Jason Zse-Cherng LIN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods and Apparatus for Measuring a Property of a Substrate
- Publication number 20190301850
- Publication date Oct 3, 2019
- ASML NETHERLANDS B.V.
- Wouter Lodewijk ELINGS
- G01 - MEASURING TESTING
Information Patent Application
Method and Apparatus for Fabricating Wafer By Calculating Process C...
- Publication number 20190243255
- Publication date Aug 8, 2019
- Quoniac GmbH
- Boris Habets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENHANCING THE SEMICONDUCTOR MANUFACTURING YIELD
- Publication number 20190187670
- Publication date Jun 20, 2019
- ASML Netherlands B.V.
- Wei FANG
- G05 - CONTROLLING REGULATING
Information Patent Application
Hybrid Inspection System for Efficient Process Window Discovery
- Publication number 20190033838
- Publication date Jan 31, 2019
- KLA-Tencor Corporation
- Brian Duffy
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD AND MACHINE FOR EXAMINING WAFERS
- Publication number 20180076099
- Publication date Mar 15, 2018
- HERMES MICROVISION, INC.
- CHIEN-HUNG CHOU
- G01 - MEASURING TESTING
Information Patent Application
Method for Validating Measurement Data
- Publication number 20180066939
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chui-Jung Chiu
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND APPARATUS MANAGEMENT CONTROLLER
- Publication number 20170300044
- Publication date Oct 19, 2017
- Hitachi Kokusai Electric Inc.
- Kazuhide ASAI
- G05 - CONTROLLING REGULATING
Information Patent Application
Method and Apparatus for Fabricating Wafer By Calculating Process C...
- Publication number 20170075230
- Publication date Mar 16, 2017
- Boris Habets
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF INSPECTING A SPECIMEN AND SYSTEM THEREOF
- Publication number 20160349742
- Publication date Dec 1, 2016
- APPLIED MATERIALS ISRAEL LTD.
- Michele DALLA-TORRE
- G05 - CONTROLLING REGULATING
Information Patent Application
SYSTEM AND METHOD FOR MONITORING WAFER HANDLING AND A WAFER HANDLIN...
- Publication number 20160336206
- Publication date Nov 17, 2016
- GLOBALFOUNDRIES, Inc.
- Stephen B. Miner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR AUTONOMOUS IDENTIFICATION OF PARTICLE CONT...
- Publication number 20160334782
- Publication date Nov 17, 2016
- TOKYO ELECTRON LIMITED
- Aaron Archer Waterman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IDENTIFYING REGISTRATION ERRORS OF DSA LINES
- Publication number 20160018819
- Publication date Jan 21, 2016
- KLA-Tencor Corporation
- Roie VOLKOVICH
- G05 - CONTROLLING REGULATING
Information Patent Application
MANUFACTURING SUPPORTING SYSTEM, MANUFACTURING SUPPORTING METHOD, A...
- Publication number 20160011589
- Publication date Jan 14, 2016
- KABUSHIKI KAISHA TOSHIBA
- Muneyoshi YAMADA
- G05 - CONTROLLING REGULATING
Information Patent Application
Automatic Recipe Stability Monitoring and Reporting
- Publication number 20150362908
- Publication date Dec 17, 2015
- KLA-Tencor Corporation
- Hucheng Lee
- G05 - CONTROLLING REGULATING

Inspect wafer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and apparatus for measuring a property of a substrate

Method and apparatus for automatically processing wafers

Method for enhancing the semiconductor manufacturing yield

System and method for controlling semiconductor manufacturing appar...

Fab management with dynamic sampling plans, optimized wafer measure...

Substrate processing apparatus equipped with substrate scanner

Unsupervised defect segmentation

Method for validating measurement data

Apparatus and methods for wafer to wafer bonding

Heating processing apparatus and heating processing method

Substrate processing in a process chamber for semiconductor manufac...

Data management and mining to correlate wafer alignment, design, de...

Methods and apparatus for measuring a property of a substrate

Method and machine for examining wafers

Self-contained metrology wafer carrier systems

System, method and computer program product for generating a traini...

Auto defect screening using adaptive machine learning in semiconduc...

Methods and apparatus for measuring a property of a substrate

Method and apparatus for fabricating wafer by calculating process c...

System and method for monitoring wafer handling and a wafer handlin...

Hybrid inspection system for efficient process window discovery

Method of inspecting a specimen and system thereof

Method for validating measurement data

Automatic recipe stability monitoring and reporting

Identifying registration errors of DSA lines

Auto defect screening using adaptive machine learning in semiconduc...

Feature selection and automated process window monitoring through o...

Methods and apparatus for measuring a property of a substrate

Method and apparatus for fabricating wafer by calculating process c...

Self-contained metrology wafer carrier systems

Patents Applicationslast 30 patents

DYNAMIC SAMPLING METHOD AND DEVICE FOR SEMICONDUCTOR MANUFACTURE

METHOD AND APPARATUS FOR AUTOMATICALLY PROCESSING WAFERS

METHOD FOR MONITORING PROCESS VARIATION INDEX

MULTICOMPONENT MODULE DESIGN AND FABRICATION

Apparatus and Methods for Wafer to Wafer Bonding

FAB MANAGEMENT WITH DYNAMIC SAMPLING PLANS, OPTIMIZED WAFER MEASURE...

SYSTEM AND METHOD FOR CONTROLLING SEMICONDUCTOR MANUFACTURING APPAR...

SUBSTRATE PROCESSING APPARATUS EQUIPPED WITH SUBSTRATE SCANNER

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Methods and Apparatus for Measuring a Property of a Substrate

METHOD AND MACHINE FOR EXAMINING WAFERS

Methods and Apparatus for Measuring a Property of a Substrate

Unsupervised Defect Segmentation

Method for Validating Measurement Data

HEATING PROCESSING APPARATUS AND HEATING PROCESSING METHOD

AUTO DEFECT SCREENING USING ADAPTIVE MACHINE LEARNING IN SEMICONDUC...

Methods and Apparatus for Measuring a Property of a Substrate

Method and Apparatus for Fabricating Wafer By Calculating Process C...

METHOD FOR ENHANCING THE SEMICONDUCTOR MANUFACTURING YIELD

Hybrid Inspection System for Efficient Process Window Discovery

METHOD AND MACHINE FOR EXAMINING WAFERS

Method for Validating Measurement Data

SUBSTRATE PROCESSING APPARATUS AND APPARATUS MANAGEMENT CONTROLLER

Method and Apparatus for Fabricating Wafer By Calculating Process C...

METHOD OF INSPECTING A SPECIMEN AND SYSTEM THEREOF

SYSTEM AND METHOD FOR MONITORING WAFER HANDLING AND A WAFER HANDLIN...

METHOD AND APPARATUS FOR AUTONOMOUS IDENTIFICATION OF PARTICLE CONT...

IDENTIFYING REGISTRATION ERRORS OF DSA LINES

MANUFACTURING SUPPORTING SYSTEM, MANUFACTURING SUPPORTING METHOD, A...

Automatic Recipe Stability Monitoring and Reporting