integral with a semiconducting diaphragm

Industry

CPC
G01L9/0054

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Parent Industries

GPHYSICS G01Measuring instruments G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE G01L9/00Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material by electric or magnetic means

Current Industry

G01L9/0054integral with a semiconducting diaphragm

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pressure sensor including a microelectromechanical transducer and r...
- Patent number 12,006,207
- Issue date Jun 11, 2024
- STMicroelectronics S.r.l.
- Mario Giuseppe Pavone
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High temperature protected wire bonded sensors
- Patent number 11,994,440
- Issue date May 28, 2024
- Kulite Semiconductor Products, Inc.
- Alexander A. Ned
- G01 - MEASURING TESTING
Information Patent Grant
MEMS strain gauge pressure sensor with mechanical symmetries
- Patent number 11,879,800
- Issue date Jan 23, 2024
- Rosemount Aerospace Inc.
- Jun Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Provision of distributed paging occasions
- Patent number 11,792,768
- Issue date Oct 17, 2023
- Telefonaktiebolaget LM Ericsson (publ)
- Johan Rune
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Versatilely mountable pressure sensing apparatus, system, and/or me...
- Patent number 11,703,408
- Issue date Jul 18, 2023
- Senva, Inc.
- Scott E. Leonard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon carbide-based combined temperature-pressure micro-electro-m...
- Patent number 11,686,637
- Issue date Jun 27, 2023
- Xi'an Jiaotong University
- Xudong Fang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor
- Patent number 11,643,324
- Issue date May 9, 2023
- Rohm Co., Ltd.
- Masahiro Sakuragi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for fabricating pressure sensors with non-silicon diaphragms
- Patent number 11,624,668
- Issue date Apr 11, 2023
- ZHEJIANG DUNAN ARTIFICIAL ENVIRONMENT CO., LTD.
- Tom Kwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor
- Patent number 11,609,139
- Issue date Mar 21, 2023
- Azbil Corporation
- Tomohisa Tokuda
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor including a microelectromechanical transducer and r...
- Patent number 11,535,508
- Issue date Dec 27, 2022
- STMicroelectronics S.r.l.
- Mario Giuseppe Pavone
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor element for a pressure sensor having a strain resis...
- Patent number 11,506,554
- Issue date Nov 22, 2022
- Azbil Corporation
- Yuki Seto
- G01 - MEASURING TESTING
Information Patent Grant
Capacitive sensor
- Patent number D970457
- Issue date Nov 22, 2022
- Mitsubishi Electric Corporation
- Toru Aramaki
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
High sensitivity MEMS pressure sensor
- Patent number 11,506,553
- Issue date Nov 22, 2022
- Iowa State University Research Foundation, Inc.
- Liang Dong
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor having a failure detection unit
- Patent number 11,415,473
- Issue date Aug 16, 2022
- Fuji Electric Co., Ltd.
- Kazuhiro Matsunami
- G01 - MEASURING TESTING
Information Patent Grant
Temperature sensor device
- Patent number 11,402,274
- Issue date Aug 2, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Kishimoto
- G01 - MEASURING TESTING
Information Patent Grant
Sensor element for measuring pressure and temperature
- Patent number 11,378,478
- Issue date Jul 5, 2022
- TDK ELECTRONICS AG
- Johnsen Tanjaya
- G01 - MEASURING TESTING
Information Patent Grant
Arrangement for a semiconductor-based pressure sensor chip and pres...
- Patent number 11,320,330
- Issue date May 3, 2022
- First Sensor AG
- Michael Pierschel
- G01 - MEASURING TESTING
Information Patent Grant
Absolute and differential pressure sensors and related methods
- Patent number 11,254,565
- Issue date Feb 22, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a dual-cavity pressure sensor die
- Patent number 11,226,251
- Issue date Jan 18, 2022
- Chinese Academy of Sciences Institute of Geology and Geophysics
- Yiming Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor package systems and methods
- Patent number 11,192,777
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Bernhard Winkler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor device and method of sensing pressure
- Patent number 11,169,039
- Issue date Nov 9, 2021
- Melexis Technologies NV
- Laurent Otte
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor with a potential adjustment member
- Patent number 11,131,594
- Issue date Sep 28, 2021
- Saginomiya Seisakusho, Inc.
- Kazuya Takimoto
- G01 - MEASURING TESTING
Information Patent Grant
Method for assembling force sensor, involves applying sense die adh...
- Patent number 11,085,837
- Issue date Aug 10, 2021
- Honeywell International Inc.
- Jason Dennis Patch
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
MEMS pressure sensor with multiple sensitivity and small dimensions
- Patent number 11,079,298
- Issue date Aug 3, 2021
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pulse wave sensor unit
- Patent number 11,058,310
- Issue date Jul 13, 2021
- Advantest Corporation
- Hirokazu Sanpei
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Strain gauge with mechanically decoupled temperature sensor
- Patent number 11,054,319
- Issue date Jul 6, 2021
- STMicroelectronics S.r.l.
- Daniele Caltabiano
- G01 - MEASURING TESTING
Information Patent Grant
Multi-device transducer modulus, electronic apparatus including the...
- Patent number 11,053,115
- Issue date Jul 6, 2021
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor
- Patent number 11,054,326
- Issue date Jul 6, 2021
- Denso Corporation
- Yutaka Hayakawa
- G01 - MEASURING TESTING
Information Patent Grant
Microelectromechanical piezoresistive pressure sensor with self-tes...
- Patent number 11,054,327
- Issue date Jul 6, 2021
- STMicroelectronics S.r.l.
- Enri Duqi
- G01 - MEASURING TESTING
Information Patent Grant
CSOI MEMS pressure sensing element with stress equalizers
- Patent number 11,029,227
- Issue date Jun 8, 2021
- Vitesco Technologies USA, LLC.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SENSOR MODULE AND DISPENSING DEVICE INCLUDING PRESSURE SEN...
- Publication number 20240408560
- Publication date Dec 12, 2024
- HITACHI HIGH-TECH CORPORATION
- Masatoshi KANAMARU
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR RESISTOR CONFIGURATION FOR STRESS COMPENSATION
- Publication number 20240288325
- Publication date Aug 29, 2024
- MELEXIS TECHNOLOGIES NV
- Ben MAES
- G01 - MEASURING TESTING
Information Patent Application
Pressure Sensor Module and Dispensing Device
- Publication number 20240230441
- Publication date Jul 11, 2024
- Hitachi High-Tech Corporation
- Masatoshi KANAMARU
- G01 - MEASURING TESTING
Information Patent Application
Pressure Sensor Module and Dispensing Device
- Publication number 20240133757
- Publication date Apr 25, 2024
- Hitachi High-Tech Corporation
- Masatoshi KANAMARU
- G01 - MEASURING TESTING
Information Patent Application
PROVISION OF DISTRIBUTED PAGING OCCASIONS
- Publication number 20240049173
- Publication date Feb 8, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Johan RUNE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRESSURE DETECTION DEVICE AND MANUFACTURING METHOD
- Publication number 20240011856
- Publication date Jan 11, 2024
- Fuji Electric Co., Ltd.
- Yuichi ITO
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR AND ELECTRONIC DEVICE
- Publication number 20230324245
- Publication date Oct 12, 2023
- Honor Device Co., Ltd.
- Yabin AN
- G01 - MEASURING TESTING
Information Patent Application
PACKAGED PRESSURE SENSOR DEVICE AND CORRESPONDING METHOD FOR DETECT...
- Publication number 20230273084
- Publication date Aug 31, 2023
- STMicroelectronics S.r.l.
- Domenico GIUSTI
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR INCLUDING A MICROELECTROMECHANICAL TRANSDUCER AND R...
- Publication number 20230104798
- Publication date Apr 6, 2023
- STMicroelectronics S.r.l.
- Mario Giuseppe PAVONE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON CARBIDE-BASED COMBINED TEMPERATURE-PRESSURE MICRO-ELECTRO-M...
- Publication number 20220146352
- Publication date May 12, 2022
- XI'AN JIAOTONG UNIVERSITY
- Xudong FANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DIE WITH PRESSURE AND ACCELERATION SENSOR ELEMENTS
- Publication number 20220074803
- Publication date Mar 10, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Steffen BIESELT
- G01 - MEASURING TESTING
Information Patent Application
PROVISION OF DISTRIBUTED PAGING OCCASIONS
- Publication number 20220050000
- Publication date Feb 17, 2022
- Telefonaktiebolaget LM Ericsson (publ)
- Johan RUNE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR AND MANUFACTURING METHOD THEREFOR
- Publication number 20220011186
- Publication date Jan 13, 2022
- Mitsubishi Electric Corporation
- Kimitoshi SATO
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR AND PRESSURE SENSOR ELEMENT
- Publication number 20210372875
- Publication date Dec 2, 2021
- AZBIL CORPORATION
- Yuki SETO
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR
- Publication number 20210239555
- Publication date Aug 5, 2021
- AZBIL CORPORATION
- Tomohisa TOKUDA
- G01 - MEASURING TESTING
Information Patent Application
INTRAVASCULAR PRESSURE DEVICES INCORPORATING SENSORS MANUFACTURED U...
- Publication number 20210219851
- Publication date Jul 22, 2021
- PHILIPS IMAGE GUIDED THERAPY CORPORATION
- Paul Douglas CORL
- G01 - MEASURING TESTING
Information Patent Application
MEMS SENSOR
- Publication number 20210039946
- Publication date Feb 11, 2021
- Rohm Co., Ltd.
- Masahiro SAKURAGI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS
- Publication number 20210041318
- Publication date Feb 11, 2021
- Kulite Semiconductor Products, Inc.
- Alexander A. Ned
- G01 - MEASURING TESTING
Information Patent Application
Sensor Element for Measuring Pressure and Temperature
- Publication number 20210025776
- Publication date Jan 28, 2021
- TDK Electronics AG
- Johnsen Tanjaya
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR
- Publication number 20210010885
- Publication date Jan 14, 2021
- Fuji Electric Co., Ltd.
- Kazuhiro MATSUNAMI
- G01 - MEASURING TESTING
Information Patent Application
Method of Making a Dual-Cavity Pressure Sensor Die
- Publication number 20210003468
- Publication date Jan 7, 2021
- Chinese Academy of Sciences Institute of Geology and Geophysics
- Yiming ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ARRANGEMENT FOR A SEMICONDUCTOR-BASED PRESSURE SENSOR CHIP AND PRES...
- Publication number 20200408629
- Publication date Dec 31, 2020
- FIRST SENSOR AG
- Michael Pierschel
- G01 - MEASURING TESTING
Information Patent Application
STRAIN GAUGE WITH MECHANICALLY DECOUPLED TEMPERATURE SENSOR
- Publication number 20200408621
- Publication date Dec 31, 2020
- STMicroelectronics S.r.l.
- Daniele Caltabiano
- G01 - MEASURING TESTING
Information Patent Application
DETECTING CONTAMINATION OF A PRESSURE SENSOR BASED ON CROSS-SENSITI...
- Publication number 20200284821
- Publication date Sep 10, 2020
- INFINEON TECHNOLOGIES AG
- Christoph STEINER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR INCLUDING A MICROELECTROMECHANICAL TRANSDUCER AND R...
- Publication number 20200270118
- Publication date Aug 27, 2020
- STMicroelectronics S.r.l.
- Mario Giuseppe PAVONE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR
- Publication number 20200182724
- Publication date Jun 11, 2020
- Saginomiya Seisakusho, Inc.
- Kazuya Takimoto
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE SENSOR DEVICE
- Publication number 20200132553
- Publication date Apr 30, 2020
- Mitsubishi Electric Corporation
- Hiroyuki KISHIMOTO
- G01 - MEASURING TESTING
Information Patent Application
ABSOLUTE AND DIFFERENTIAL PRESSURE SENSORS AND RELATED METHODS
- Publication number 20200123002
- Publication date Apr 23, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Dual Pressure Sensing Module with a Shared Electrical Substrate
- Publication number 20200103302
- Publication date Apr 2, 2020
- Apple Inc.
- Gregory B. Arndt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR DEVICE AND METHOD OF SENSING PRESSURE
- Publication number 20200072692
- Publication date Mar 5, 2020
- MELEXIS TECHNOLOGIES NV
- Laurent OTTE
- G01 - MEASURING TESTING

integral with a semiconducting diaphragm

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure sensor including a microelectromechanical transducer and r...

High temperature protected wire bonded sensors

MEMS strain gauge pressure sensor with mechanical symmetries

Provision of distributed paging occasions

Versatilely mountable pressure sensing apparatus, system, and/or me...

Silicon carbide-based combined temperature-pressure micro-electro-m...

MEMS sensor

Methods for fabricating pressure sensors with non-silicon diaphragms

Pressure sensor

Pressure sensor including a microelectromechanical transducer and r...

Pressure sensor element for a pressure sensor having a strain resis...

Capacitive sensor

High sensitivity MEMS pressure sensor

Pressure sensor having a failure detection unit

Temperature sensor device

Sensor element for measuring pressure and temperature

Arrangement for a semiconductor-based pressure sensor chip and pres...

Absolute and differential pressure sensors and related methods

Method of making a dual-cavity pressure sensor die

MEMS sensor package systems and methods

Pressure sensor device and method of sensing pressure

Pressure sensor with a potential adjustment member

Method for assembling force sensor, involves applying sense die adh...

MEMS pressure sensor with multiple sensitivity and small dimensions

Pulse wave sensor unit

Strain gauge with mechanically decoupled temperature sensor

Multi-device transducer modulus, electronic apparatus including the...

Physical quantity sensor

Microelectromechanical piezoresistive pressure sensor with self-tes...

CSOI MEMS pressure sensing element with stress equalizers

Patents Applicationslast 30 patents

PRESSURE SENSOR MODULE AND DISPENSING DEVICE INCLUDING PRESSURE SEN...

PRESSURE SENSOR RESISTOR CONFIGURATION FOR STRESS COMPENSATION

Pressure Sensor Module and Dispensing Device

Pressure Sensor Module and Dispensing Device

PROVISION OF DISTRIBUTED PAGING OCCASIONS

PRESSURE DETECTION DEVICE AND MANUFACTURING METHOD

PRESSURE SENSOR AND ELECTRONIC DEVICE

PACKAGED PRESSURE SENSOR DEVICE AND CORRESPONDING METHOD FOR DETECT...

PRESSURE SENSOR INCLUDING A MICROELECTROMECHANICAL TRANSDUCER AND R...

SILICON CARBIDE-BASED COMBINED TEMPERATURE-PRESSURE MICRO-ELECTRO-M...

SEMICONDUCTOR DIE WITH PRESSURE AND ACCELERATION SENSOR ELEMENTS

PROVISION OF DISTRIBUTED PAGING OCCASIONS

SEMICONDUCTOR PRESSURE SENSOR AND MANUFACTURING METHOD THEREFOR

PRESSURE SENSOR AND PRESSURE SENSOR ELEMENT

PRESSURE SENSOR

INTRAVASCULAR PRESSURE DEVICES INCORPORATING SENSORS MANUFACTURED U...

MEMS SENSOR

HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS

Sensor Element for Measuring Pressure and Temperature

PRESSURE SENSOR

Method of Making a Dual-Cavity Pressure Sensor Die

ARRANGEMENT FOR A SEMICONDUCTOR-BASED PRESSURE SENSOR CHIP AND PRES...

STRAIN GAUGE WITH MECHANICALLY DECOUPLED TEMPERATURE SENSOR

DETECTING CONTAMINATION OF A PRESSURE SENSOR BASED ON CROSS-SENSITI...

PRESSURE SENSOR INCLUDING A MICROELECTROMECHANICAL TRANSDUCER AND R...

PRESSURE SENSOR

TEMPERATURE SENSOR DEVICE

ABSOLUTE AND DIFFERENTIAL PRESSURE SENSORS AND RELATED METHODS

Dual Pressure Sensing Module with a Shared Electrical Substrate

PRESSURE SENSOR DEVICE AND METHOD OF SENSING PRESSURE