involving the assembly of several electronic elements

Industry

CPC
Y02P70/613

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y02Climate change prevention Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products

Current Industry

Y02P70/613involving the assembly of several electronic elements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and sensor
- Patent number 10,791,630
- Issue date Sep 29, 2020
- Vitesco Technologies GmbH
- Erich Mattmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit boards and circuit board assemblies
- Patent number 10,764,994
- Issue date Sep 1, 2020
- Hamilton Sundstrand Corporation
- Tran Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a chip component
- Patent number 10,763,016
- Issue date Sep 1, 2020
- Rohm Co., Ltd.
- Hiroshi Tamagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating stretchable electrical circuit
- Patent number 10,757,803
- Issue date Aug 25, 2020
- Seoul National University R&DB Foundation
- Yongtaek Hong
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic component, electronic component mounting substrate, and...
- Patent number 10,753,551
- Issue date Aug 25, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Toshiaki Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-containing module
- Patent number 10,707,403
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Yoshiharu Suemori
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Display carrier attached light bar for backlit displays
- Patent number 10,690,836
- Issue date Jun 23, 2020
- Intel Corporation
- Arvind Sundaram
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method of making integrated die paddle structures for bottom termin...
- Patent number 10,679,926
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Stephen M. Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing thermal cycling fatigue
- Patent number 10,678,316
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Eric J. Campbell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Placement method for circuit carrier and circuit carrier
- Patent number 10,672,672
- Issue date Jun 2, 2020
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Andreas Karch
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Integrated electro-optical module assembly
- Patent number 10,670,656
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Paul S. Andry
- G01 - MEASURING TESTING
Information Patent Grant
Accurate positioning and alignment of a component during processes...
- Patent number 10,667,387
- Issue date May 26, 2020
- ams Sensors Singapore Pte. Ltd.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of determining curing conditions, method of producing circui...
- Patent number 10,658,329
- Issue date May 19, 2020
- Sony Corporation
- Takeshi Ichimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stand-off block
- Patent number 10,638,597
- Issue date Apr 28, 2020
- Cisco Technology, Inc.
- Shih Fung Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for placing an SMD semiconductor light source component of a...
- Patent number 10,631,414
- Issue date Apr 21, 2020
- Automotive Lighting Reutlingen GmbH
- Narcis Barqueros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a substrate arrangement, substrate arrangement...
- Patent number 10,622,331
- Issue date Apr 14, 2020
- Heraeus Deutschland GmbH & Co. KG
- Andreas Hinrich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Capacitor and board having the same
- Patent number 10,617,008
- Issue date Apr 7, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jin Man Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory system
- Patent number 10,607,979
- Issue date Mar 31, 2020
- TOSHIBA MEMORY CORPORATION
- Hayato Masubuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 10,607,957
- Issue date Mar 31, 2020
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electric motor, electric apparatus, and air conditioner
- Patent number 10,601,285
- Issue date Mar 24, 2020
- Mitsubishi Electric Corporation
- Junichiro Oya
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Printed wiring board, printed circuit board, and electronic device
- Patent number 10,582,615
- Issue date Mar 3, 2020
- Canon Kabushiki Kaisha
- Koji Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shunt resistor for measuring current
- Patent number 10,578,650
- Issue date Mar 3, 2020
- LG Chem, Ltd.
- Dong Kwan Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic device having a thin film resistor f...
- Patent number 10,561,023
- Issue date Feb 11, 2020
- Harris Corporation
- Louis Joseph Rendek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated die paddle structures for bottom terminated components
- Patent number 10,559,522
- Issue date Feb 11, 2020
- International Business Machines Corporation
- Stephen M. Hugo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vehicle vision system camera with coaxial cable connector
- Patent number 10,555,423
- Issue date Feb 4, 2020
- Magna Electronics Inc.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Surface mount metal unit and electric device including same
- Patent number 10,542,646
- Issue date Jan 21, 2020
- Samsung Electronics Co., Ltd.
- Chang-Joon Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for positioning at least one electronic component on a circu...
- Patent number 10,531,571
- Issue date Jan 7, 2020
- ZKW GROUP GMBH
- Dietmar Kieslinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED lighting apparatus
- Patent number 10,522,730
- Issue date Dec 31, 2019
- Rohm Co., Ltd.
- Hiroyuki Tajiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated ceramic chip component including nano thin film layer, ma...
- Patent number 10,513,433
- Issue date Dec 24, 2019
- HONGIK UNIVERSITY INDUSTRY-ACADEMIC CORPORATION FOUNDATION
- Jin Ha Hwang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electronic assembly that includes a substrate bridge
- Patent number 10,492,299
- Issue date Nov 26, 2019
- Intel Corporation
- Eng Huat Goh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR FABRICATING STRETCHABLE ELECTRICAL CIRCUIT
- Publication number 20200344877
- Publication date Oct 29, 2020
- Seoul National University R&DB Foundation
- YONGTAEK HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly process for circuit carrier and circuit carrier
- Publication number 20200294867
- Publication date Sep 17, 2020
- A.B. Mikroelektronik Gesellschaft mit beschraenkter Haftung
- Andreas Karch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20200205291
- Publication date Jun 25, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jin Man JUNG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20200194414
- Publication date Jun 18, 2020
- Toshiba Memory Corporation
- Hayato MASUBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR
- Publication number 20200178397
- Publication date Jun 4, 2020
- MAGNA ELECTRONICS INC.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
- Publication number 20200163213
- Publication date May 21, 2020
- Canon Kabushiki Kaisha
- Koji Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20190326275
- Publication date Oct 24, 2019
- Toshiba Memory Corporation
- Hayato MASUBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...
- Publication number 20190304702
- Publication date Oct 3, 2019
- EPCOS AG
- Markus Koini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUI...
- Publication number 20190267348
- Publication date Aug 29, 2019
- SONY CORPORATION
- Takeshi Ichimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS
- Publication number 20190264073
- Publication date Aug 29, 2019
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Trace Design for Bump-on-Trace (BOT) Assembly
- Publication number 20190252347
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCING THERMAL CYCLING FATIGUE
- Publication number 20190235595
- Publication date Aug 1, 2019
- International Business Machines Corporation
- Eric J. Campbell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20190230795
- Publication date Jul 25, 2019
- Intel Corporation
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A THIN FILM RESISTOR F...
- Publication number 20190124777
- Publication date Apr 25, 2019
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF IN...
- Publication number 20190088605
- Publication date Mar 21, 2019
- Myron WALKER
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CAPACITOR COMPONENT
- Publication number 20180359859
- Publication date Dec 13, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS
- Publication number 20180301399
- Publication date Oct 18, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR COMPONENT AND BOARD HAVING THE SAME
- Publication number 20180286593
- Publication date Oct 4, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS
- Publication number 20180265751
- Publication date Sep 20, 2018
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICES
- Publication number 20180249582
- Publication date Aug 30, 2018
- AbleGo Technology Co., Ltd.
- Shu-Hui Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...
- Publication number 20180235080
- Publication date Aug 16, 2018
- HEPTAGON MICRO OPTICS PTE. LTD.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STAND-OFF BLOCK
- Publication number 20180228017
- Publication date Aug 9, 2018
- Cisco Technology, Inc.
- Shih Fung Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrates, Packaged Semiconductor Devices, and Methods of...
- Publication number 20180204815
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY
- Publication number 20180182697
- Publication date Jun 28, 2018
- Intel Corporation
- Daewoong SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
- Publication number 20180168038
- Publication date Jun 14, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
- Publication number 20180153035
- Publication date May 31, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUI...
- Publication number 20180114771
- Publication date Apr 26, 2018
- SONY CORPORATION
- Takeshi Ichimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC CAPACITOR ASSEMBLY
- Publication number 20180114646
- Publication date Apr 26, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Soon-Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND CIRCUIT BOARD HAVING THE SAME
- Publication number 20180070451
- Publication date Mar 8, 2018
- TDK Corporation
- Nobuo TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS

involving the assembly of several electronic elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and sensor

Circuit boards and circuit board assemblies

Method of manufacturing a chip component

Method of fabricating stretchable electrical circuit

Electronic component, electronic component mounting substrate, and...

Electronic component-containing module

Display carrier attached light bar for backlit displays

Method of making integrated die paddle structures for bottom termin...

Reducing thermal cycling fatigue

Placement method for circuit carrier and circuit carrier

Integrated electro-optical module assembly

Accurate positioning and alignment of a component during processes...

Method of determining curing conditions, method of producing circui...

Stand-off block

Method for placing an SMD semiconductor light source component of a...

Method for producing a substrate arrangement, substrate arrangement...

Capacitor and board having the same

Semiconductor memory system

Ultra-thin embedded semiconductor device package and method of manu...

Wiring board, electric motor, electric apparatus, and air conditioner

Printed wiring board, printed circuit board, and electronic device

Shunt resistor for measuring current

Method of making an electronic device having a thin film resistor f...

Integrated die paddle structures for bottom terminated components

Vehicle vision system camera with coaxial cable connector

Surface mount metal unit and electric device including same

Method for positioning at least one electronic component on a circu...

LED lighting apparatus

Laminated ceramic chip component including nano thin film layer, ma...

Electronic assembly that includes a substrate bridge

Patents Applicationslast 30 patents

APPARATUS FOR FABRICATING STRETCHABLE ELECTRICAL CIRCUIT

Assembly process for circuit carrier and circuit carrier

CAPACITOR AND BOARD HAVING THE SAME

SEMICONDUCTOR MEMORY SYSTEM

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

SEMICONDUCTOR MEMORY SYSTEM

ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...

METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUI...

THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS

Trace Design for Bump-on-Trace (BOT) Assembly

REDUCING THERMAL CYCLING FATIGUE

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A THIN FILM RESISTOR F...

SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF IN...

CAPACITOR COMPONENT

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

CAPACITOR COMPONENT AND BOARD HAVING THE SAME

THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS

METHOD FOR MANUFACTURING ELECTRONIC DEVICES

ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...

STAND-OFF BLOCK

Package Substrates, Packaged Semiconductor Devices, and Methods of...

FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY

MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION

MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION

METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUI...

MULTI-LAYER CERAMIC CAPACITOR ASSEMBLY

COIL COMPONENT AND CIRCUIT BOARD HAVING THE SAME