Means adapted for delaminating component from building

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CPC
Y10S156/94

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10S156/94Means adapted for delaminating component from building

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Detaching a die from an adhesive tape by air ejection
- Patent number 11,764,098
- Issue date Sep 19, 2023
- ASMPT SINGAPORE PTE. LTD.
- Ngai Tat Man
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for separating a window and method for separating a windo...
- Patent number 11,458,721
- Issue date Oct 4, 2022
- Samsung Display Co., Ltd.
- Jongman Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for transferring micro device, and electronic...
- Patent number 11,417,546
- Issue date Aug 16, 2022
- Korea Institute of Machinery & Materials
- Byung-Ik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a substrate
- Patent number 11,260,646
- Issue date Mar 1, 2022
- Corning Incorporated
- Christina Sue Bennett
- B32 - LAYERED PRODUCTS
Information Patent Grant
Chip ejecting apparatus
- Patent number 11,239,104
- Issue date Feb 1, 2022
- Samsung Electronics Co., Ltd.
- Jae Ryoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser lift off systems and methods
- Patent number 11,239,116
- Issue date Feb 1, 2022
- IPG Photonics Corporation
- Jeffrey P. Sercel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing element array and apparatus for removin...
- Patent number 11,167,541
- Issue date Nov 9, 2021
- TDK Corporation
- Toshinobu Miyagoshi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing element array and method of removing specif...
- Patent number 11,101,317
- Issue date Aug 24, 2021
- TDK Corporation
- Toshinobu Miyagoshi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,062,925
- Issue date Jul 13, 2021
- Mitsubishi Electric Corporation
- Masato Negishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover structure for a light source, light illuminating apparatus ha...
- Patent number 11,011,395
- Issue date May 18, 2021
- Samsung Electronics Co., Ltd.
- Young-Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for debonding temporarily adhesive-bonded carrier-workpiece...
- Patent number 10,913,254
- Issue date Feb 9, 2021
- DIDREW TECHNOLOGY (BVI) LIMITED
- Chunbin Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Peeling bar for peeling polarizing film from panel, peeling apparat...
- Patent number 10,870,267
- Issue date Dec 22, 2020
- LG Chem, Ltd.
- San Park
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus of separating flexible panel from glass substrate and met...
- Patent number 10,868,282
- Issue date Dec 15, 2020
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Huan Xu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for separating a window and method for separating a windo...
- Patent number 10,836,151
- Issue date Nov 17, 2020
- Samsung Display Co., Ltd.
- Jongman Bae
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and device for separating different material layers of a com...
- Patent number 10,786,982
- Issue date Sep 29, 2020
- Harald Gross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate separation system and method
- Patent number 10,622,332
- Issue date Apr 14, 2020
- Princo Corp.
- Chun-Hsiung Chou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for producing flexible OLED device
- Patent number 10,607,513
- Issue date Mar 31, 2020
- SAKAI DISPLAY PRODUCTS CORPORATION
- Katsuhiko Kishimoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for handling a product substrate and a bonded substrate system
- Patent number 10,600,690
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Georg Meyer-Berg
- B32 - LAYERED PRODUCTS
Information Patent Grant
Separation apparatus and separation method for flexible display panel
- Patent number 10,518,521
- Issue date Dec 31, 2019
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Qiang Tao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device and method for at least partly dissolving a connecting layer...
- Patent number 10,475,672
- Issue date Nov 12, 2019
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Device for delaminating laminate, delamination method, and method f...
- Patent number 10,449,755
- Issue date Oct 22, 2019
- AGC Inc.
- Yasuaki Watanabe
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Temporary carrier debond initiation, and associated systems and met...
- Patent number 10,446,431
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Jonathan S. Hacker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Film separation apparatus and film separation method
- Patent number 10,406,799
- Issue date Sep 10, 2019
- BOE Technology Group Co., Ltd.
- Zhenli Zhou
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Double layer release temporary bond and debond processes and systems
- Patent number 10,381,255
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Paul S. Andry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser lift off systems and methods
- Patent number 10,297,503
- Issue date May 21, 2019
- IPG Photonics Corporation
- Jeffrey P. Sercel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer debonding using mid-wavelength infrared radiation ablation
- Patent number 10,297,479
- Issue date May 21, 2019
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peeling bar for peeling polarizing film from panel, peeling apparat...
- Patent number 10,286,643
- Issue date May 14, 2019
- LG Chem, Ltd.
- San Park
- B32 - LAYERED PRODUCTS
Information Patent Grant
Detaping machine and detaping method
- Patent number 10,283,388
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder, device and method for detaching of a first substrate
- Patent number 10,276,409
- Issue date Apr 30, 2019
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing apparatus for flexible electronics
- Patent number 10,236,446
- Issue date Mar 19, 2019
- SHENZHEN ROYOLE TECHNOLOGIES CO. LTD.
- Xiaojun Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR SEPARATING A WINDOW AND METHOD FOR SEPARATING A WINDO...
- Publication number 20210070030
- Publication date Mar 11, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jongman Bae
- B32 - LAYERED PRODUCTS
Information Patent Application
Laser Lift Off Systems and Methods
- Publication number 20190279905
- Publication date Sep 12, 2019
- IPG Photonics Corporation
- Jeffrey P. Sercel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER
- Publication number 20140367015
- Publication date Dec 18, 2014
- Mathias VAUPEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-RELATED DATA MANAGEMENT METHOD AND WAFER-RELATED DATA CREATIO...
- Publication number 20140299277
- Publication date Oct 9, 2014
- FUJI MACHINE MFG CO., LTD.
- Hideki Hosaka
- B32 - LAYERED PRODUCTS
Information Patent Application
DIE EJECT ASSEMBLY FOR DIE BONDER
- Publication number 20140251760
- Publication date Sep 11, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Ali Imran Amin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SORTING APPARATUS
- Publication number 20140202627
- Publication date Jul 24, 2014
- EPISTAR CORPORATION
- Chen-Ke HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20140196853
- Publication date Jul 17, 2014
- Besi Switzerland AG
- Ernst Barmettler
- B32 - LAYERED PRODUCTS
Information Patent Application
DELAMINATION SYSTEM
- Publication number 20140069588
- Publication date Mar 13, 2014
- TOKYO ELECTRON LIMITED
- Osamu HIRAKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up...
- Publication number 20140060751
- Publication date Mar 6, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Keita Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...
- Publication number 20130340947
- Publication date Dec 26, 2013
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION...
- Publication number 20130327485
- Publication date Dec 12, 2013
- EV GROUP GMBH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND DEVICE FOR PEELING OFF SILICON WAFERS
- Publication number 20130319619
- Publication date Dec 5, 2013
- PANASONIC CORPORATION
- Koso MATSUNO
- B32 - LAYERED PRODUCTS
Information Patent Application
PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD
- Publication number 20130269879
- Publication date Oct 17, 2013
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICO...
- Publication number 20130272837
- Publication date Oct 17, 2013
- Motoki Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20130255889
- Publication date Oct 3, 2013
- Besi Switzerland AG
- Ernst Barmettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE FEEDER AND METHOD OF MOUNTING TAPE ONTO TAPE FEEDER
- Publication number 20130153619
- Publication date Jun 20, 2013
- PANASONIC CORPORATION
- Kazuhide Nagao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR STRIPPING A WAFER FROM A CARRIER
- Publication number 20130139972
- Publication date Jun 6, 2013
- EV GROUP GMBH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF DETACHING PLATES
- Publication number 20130118692
- Publication date May 16, 2013
- Nitto Denko Corporation
- Kaori Miki
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR CLEAVING A BONDED WAFER STRUCTURE
- Publication number 20130105538
- Publication date May 2, 2013
- MEMC Electronic Materials, Inc.
- Gregory A. Young
- B32 - LAYERED PRODUCTS
Information Patent Application
CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE
- Publication number 20130105539
- Publication date May 2, 2013
- MEMC Electronic Materials, Inc.
- Gregory A. Young
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE
- Publication number 20130098542
- Publication date Apr 25, 2013
- Shoichi KUGA
- B32 - LAYERED PRODUCTS
Information Patent Application
Systems and Methods for Cleaving A Bonded Wafer Pair
- Publication number 20130062020
- Publication date Mar 14, 2013
- MEMC Electronic Materials, Inc.
- Michael John Ries
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE SEPARATING APPARATUS, LOAD LOCK APPARATUS, SUBSTRATE BOND...
- Publication number 20130048222
- Publication date Feb 28, 2013
- Keiichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE FEEDER AND METHOD OF MOUNTING TAPE ON TAPE FEEDER
- Publication number 20120305585
- Publication date Dec 6, 2012
- PANASONIC CORPORATION
- Kazuhide Nagao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC-CIRCUIT-COMPONENT SUPPLYING DEVICE
- Publication number 20120285628
- Publication date Nov 15, 2012
- FUJI MACHINE MFG. CO., LTD.
- Hiroshi Katsumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY, MANUFACTURING METHOD THEREFOR AND TRANSPARENT RESIN CHARGI...
- Publication number 20120263956
- Publication date Oct 18, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Yuki Watanabe
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Pick-Up Method of Die Bonder and Die Bonder
- Publication number 20120244647
- Publication date Sep 27, 2012
- Hitachi High-Tech Instruments Co., Ltd.
- Naoki OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR DETACHING A SEMICONDUCTOR WAFER FROM A SUBSTRATE
- Publication number 20120152465
- Publication date Jun 21, 2012
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20120111496
- Publication date May 10, 2012
- International Business Machines Corporation
- Maxime Cadotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A WAFER FROM A CARRIER
- Publication number 20120000613
- Publication date Jan 5, 2012
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS

Means adapted for delaminating component from building

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Detaching a die from an adhesive tape by air ejection

Apparatus for separating a window and method for separating a windo...

Method and apparatus for transferring micro device, and electronic...

Methods for processing a substrate

Chip ejecting apparatus

Laser lift off systems and methods

Apparatus for manufacturing element array and apparatus for removin...

Method of manufacturing element array and method of removing specif...

Semiconductor manufacturing apparatus and method of manufacturing s...

Cover structure for a light source, light illuminating apparatus ha...

Method for debonding temporarily adhesive-bonded carrier-workpiece...

Peeling bar for peeling polarizing film from panel, peeling apparat...

Apparatus of separating flexible panel from glass substrate and met...

Apparatus for separating a window and method for separating a windo...

Method and device for separating different material layers of a com...

Substrate separation system and method

Method and apparatus for producing flexible OLED device

Method for handling a product substrate and a bonded substrate system

Separation apparatus and separation method for flexible display panel

Device and method for at least partly dissolving a connecting layer...

Device for delaminating laminate, delamination method, and method f...

Temporary carrier debond initiation, and associated systems and met...

Film separation apparatus and film separation method

Double layer release temporary bond and debond processes and systems

Laser lift off systems and methods

Wafer debonding using mid-wavelength infrared radiation ablation

Peeling bar for peeling polarizing film from panel, peeling apparat...

Detaping machine and detaping method

Sample holder, device and method for detaching of a first substrate

Manufacturing apparatus for flexible electronics

Patents Applicationslast 30 patents

APPARATUS FOR SEPARATING A WINDOW AND METHOD FOR SEPARATING A WINDO...

Laser Lift Off Systems and Methods

METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER

WAFER-RELATED DATA MANAGEMENT METHOD AND WAFER-RELATED DATA CREATIO...

DIE EJECT ASSEMBLY FOR DIE BONDER

CHIP SORTING APPARATUS

Method For Detaching A Semiconductor Chip From A Foil

DELAMINATION SYSTEM

Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up...

DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...

DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION...

METHOD AND DEVICE FOR PEELING OFF SILICON WAFERS

PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD

SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICO...

Method For Detaching A Semiconductor Chip From A Foil

TAPE FEEDER AND METHOD OF MOUNTING TAPE ONTO TAPE FEEDER

METHOD FOR STRIPPING A WAFER FROM A CARRIER

METHOD OF DETACHING PLATES

METHODS FOR CLEAVING A BONDED WAFER STRUCTURE

CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE

METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE

Systems and Methods for Cleaving A Bonded Wafer Pair

SUBSTRATE SEPARATING APPARATUS, LOAD LOCK APPARATUS, SUBSTRATE BOND...

TAPE FEEDER AND METHOD OF MOUNTING TAPE ON TAPE FEEDER

ELECTRONIC-CIRCUIT-COMPONENT SUPPLYING DEVICE

DISPLAY, MANUFACTURING METHOD THEREFOR AND TRANSPARENT RESIN CHARGI...

Pick-Up Method of Die Bonder and Die Bonder

DEVICE AND METHOD FOR DETACHING A SEMICONDUCTOR WAFER FROM A SUBSTRATE

LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING

DEVICE AND METHOD FOR STRIPPING A WAFER FROM A CARRIER