moulding with different depths of the upper and lower mould cavity

Industry

CPC
B29C2045/14672

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B29Plastic substance processing B29CSHAPING OR JOINING OF PLASTICS SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL AFTER-TREATMENT OF THE SHAPED PRODUCTS

Current Industry

B29C2045/14672moulding with different depths of the upper and lower mould cavity

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Package including lead component having recess
- Patent number 11,043,623
- Issue date Jun 22, 2021
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including lead component having recess
- Patent number 10,505,090
- Issue date Dec 10, 2019
- Nichia Corporation
- Mayumi Fukuda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Position detector apparatus
- Patent number 9,944,002
- Issue date Apr 17, 2018
- Denso Corporation
- Tomoyuki Takiguchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Overmolding encapsulation process and encapsulated article made the...
- Patent number 7,655,508
- Issue date Feb 2, 2010
- Micron Technology, Inc.
- Mark S. Johnson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Asymmetric transfer molding method and an asymmetric encapsulation...
- Patent number 6,951,981
- Issue date Oct 4, 2005
- Micron Technology, Inc.
- Mark S. Johnson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Asymmetric transfer molding method and an asymmetric encapsulation...
- Patent number 6,605,331
- Issue date Aug 12, 2003
- Micron Technology, Inc.
- Mark S. Johnson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Asymmetric transfer molding method and an asymmetric encapsulation...
- Patent number 6,143,581
- Issue date Nov 7, 2000
- Micron Technology, Inc.
- Mark S. Johnson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE INCLUDING LEAD COMPONENT HAVING RECESS
- Publication number 20200075827
- Publication date Mar 5, 2020
- Nichia Corporation.
- Mayumi FUKUDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WAFER-LEVEL MOLDING CHASE DESIGN
- Publication number 20150364456
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
POSITION DETECTOR APPARATUS
- Publication number 20150061657
- Publication date Mar 5, 2015
- DENSO CORPORATION
- Tomoyuki TAKIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
Overmolding encapsulation process and encapsulated article made the...
- Publication number 20040266069
- Publication date Dec 30, 2004
- Mark S. Johnson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Asymmetric transfer molding method and an asymmetric encapsulation...
- Publication number 20030086994
- Publication date May 8, 2003
- Mark S. Johnson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Overmolding encapsulation process and encapsulated article made the...
- Publication number 20020076859
- Publication date Jun 20, 2002
- Mark S. Johnson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

moulding with different depths of the upper and lower mould cavity

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package including lead component having recess

Package including lead component having recess

Position detector apparatus

Overmolding encapsulation process and encapsulated article made the...

Asymmetric transfer molding method and an asymmetric encapsulation...

Asymmetric transfer molding method and an asymmetric encapsulation...

Asymmetric transfer molding method and an asymmetric encapsulation...

Patents Applicationslast 30 patents

PACKAGE INCLUDING LEAD COMPONENT HAVING RECESS

WAFER-LEVEL MOLDING CHASE DESIGN

POSITION DETECTOR APPARATUS

Overmolding encapsulation process and encapsulated article made the...

Asymmetric transfer molding method and an asymmetric encapsulation...

Overmolding encapsulation process and encapsulated article made the...