Mounting of components

Industry

CPC
H05K13/04

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/04Mounting of components

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Computer system with external bypass air plenum
- Patent number 12,369,281
- Issue date Jul 22, 2025
- Amazon Technologies, Inc.
- David Edward Bryan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
- Patent number 12,363,877
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 12,347,803
- Issue date Jul 1, 2025
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information processing device and information processing method
- Patent number 12,340,331
- Issue date Jun 24, 2025
- FUJI CORPORATION
- Yukinori Nakayama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microstructure-transfer apparatus, stamp head unit, stamp component...
- Patent number 12,342,467
- Issue date Jun 24, 2025
- Shin-Etsu Chemical Co., Ltd.
- Hideo Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape guide for guiding a component tape
- Patent number 12,338,098
- Issue date Jun 24, 2025
- Mycronic AB
- Johan Bergstrom
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for manufacturing flexible printed circuit board
- Patent number 12,336,091
- Issue date Jun 17, 2025
- LG ENERGY SOLUTION, LTD.
- Ga Young Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Learning method for plug-in depth
- Patent number 12,336,108
- Issue date Jun 17, 2025
- Delta Electronics, Inc.
- Jian-Jang Lai
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Systems for dismantling of double-sided PCBA
- Patent number 12,336,110
- Issue date Jun 17, 2025
- Intelligent Memory Limited
- Ho Wai Phyllis Leung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Correction amount calculating device
- Patent number 12,336,109
- Issue date Jun 17, 2025
- FUJI CORPORATION
- Tomokatsu Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate support pin installation jig
- Patent number 12,328,822
- Issue date Jun 10, 2025
- FUJI CORPORATION
- Tomohisa Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated memory card press fixture
- Patent number 12,328,823
- Issue date Jun 10, 2025
- Tuong Vinh Ngoc Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for disassembling electronics
- Patent number 12,328,824
- Issue date Jun 10, 2025
- 3R-Cycle Oy
- Tero Rinne
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information Patent Grant
Analysis device for a component mounting device to analyze board co...
- Patent number 12,328,825
- Issue date Jun 10, 2025
- FUJI CORPORATION
- Hidetoshi Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus including a plurality of heads and a method of using the...
- Patent number 12,317,421
- Issue date May 27, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system
- Patent number 12,317,422
- Issue date May 27, 2025
- PANASONIC IP MANAGEMENT CO., LTD.
- Hideki Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated system and method for inserting memory modules into mothe...
- Patent number 12,298,822
- Issue date May 13, 2025
- Google LLC
- Suk Wong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component mounting device and correction value managing method
- Patent number 12,295,104
- Issue date May 6, 2025
- FUJI CORPORATION
- Daigo Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounter
- Patent number 12,285,874
- Issue date Apr 29, 2025
- FUJI CORPORATION
- Satoshi Iwashima
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Wireless communication device manufacturing system
- Patent number 12,288,115
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Yoshinori Yamawaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backup pin and automatic backup pin exchange system
- Patent number 12,284,764
- Issue date Apr 22, 2025
- FUJI CORPORATION
- Tomohisa Kanda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component mounting machine
- Patent number 12,284,765
- Issue date Apr 22, 2025
- FUJI CORPORATION
- Kazuya Kotani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component supply device and cover tape peeling method
- Patent number 12,280,978
- Issue date Apr 22, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshinori Isobata
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,284,763
- Issue date Apr 22, 2025
- Sony Interactive Entertainment Inc.
- Yuta Tamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting device
- Patent number 12,262,476
- Issue date Mar 25, 2025
- FUJI CORPORATION
- Mitsutaka Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating device and component mounting machine
- Patent number 12,262,480
- Issue date Mar 25, 2025
- FUJI CORPORATION
- Jinya Imura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Engaging connection structure and engaging connection method thereof
- Patent number 12,250,774
- Issue date Mar 11, 2025
- FIVEGRAND INTERNATIONAL CO., LTD.
- Ting-Jui Wang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

Information Patent Application
JOINING WORK MACHINE
- Publication number 20250212375
- Publication date Jun 26, 2025
- FUJI CORPORATION
- Hiromitsu OKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
KITTING DEVICE EXTRACTION SYSTEM
- Publication number 20250203835
- Publication date Jun 19, 2025
- FUJI CORPORATION
- Mizuho NOZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE MATERIAL APPLICATOR DEVICE
- Publication number 20250187322
- Publication date Jun 12, 2025
- Superior Communications, Inc.
- Shraddha Patel
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COMPONENT-MOUNTING MACHINE, COMPONENT-MOUNTING METHOD, AND CALIBRAT...
- Publication number 20250194069
- Publication date Jun 12, 2025
- FUJI CORPORATION
- Yuji KAWASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURAL ENCLOSURE FOR PROTECTION AGAINST FOREIGN OBJECT DEBRIS A...
- Publication number 20250185176
- Publication date Jun 5, 2025
- Raytheon Company
- Charles Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS, SYSTEM, AND METHOD OF PROVIDING A TRAY FOR HOLDING AN OP...
- Publication number 20250172759
- Publication date May 29, 2025
- Jabil Inc.
- Wenlu WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING METHOD
- Publication number 20250176151
- Publication date May 29, 2025
- FUJI CORPORATION
- Masayoshi MORIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FEEDER REPLACEMENT
- Publication number 20250169047
- Publication date May 22, 2025
- ASMPT GmbH & Co. KG
- Johannes JUSTINGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167171
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167172
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE FEEDER AND METHOD FOR FEEDING COVER TAPE
- Publication number 20250153964
- Publication date May 15, 2025
- FUJI CORPORATION
- Norio HOSOI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
EPOXY DISPENSING DEVICE AND METHOD OF MOUNTING ELECTRONIC COMPONENT...
- Publication number 20250159854
- Publication date May 15, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- HAECHUNG KANG
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING METHOD
- Publication number 20250151252
- Publication date May 8, 2025
- FUJI CORPORATION
- Masayoshi MORIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME
- Publication number 20250151250
- Publication date May 8, 2025
- Assembleon B.V.
- Roy Brewel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PORTABLE BAKING ASSEMBLY TO CURE THERMAL INTERFACE MATERIAL FOR PRO...
- Publication number 20250151251
- Publication date May 8, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Sruti Chigullapalli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PATTERN TOOLING PLATE
- Publication number 20250126767
- Publication date Apr 17, 2025
- Illinois Tool Works Inc.
- Scott A. Reid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYNCHRONOUS MOTION SELECTIVE SOLDERING APPARATUS AND METHOD
- Publication number 20250121446
- Publication date Apr 17, 2025
- Nordson Corporation
- Gregory E. Goodell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORK DEVICE
- Publication number 20250118953
- Publication date Apr 10, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Shingo YAMASHITA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POSITIONING STRUCTURE, COMPONENT MOUNTING MACHINE, AND METHOD FOR M...
- Publication number 20250107056
- Publication date Mar 27, 2025
- FUJI CORPORATION
- Norio HOSOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FEEDER, COMPONENT MOUNTING MACHINE, AND COMPONENT MOUNTING METHOD
- Publication number 20250107057
- Publication date Mar 27, 2025
- FUJI CORPORATION
- Hiroki MURASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REEL LOADING DEVICE
- Publication number 20250098133
- Publication date Mar 20, 2025
- FUJI CORPORATION
- Daiki SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING SYSTEM AND MEMBER SUPPLY GUIDANCE METHOD
- Publication number 20250098134
- Publication date Mar 20, 2025
- FUJI CORPORATION
- Daisuke YAMANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING HEAD, MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELEC...
- Publication number 20250098135
- Publication date Mar 20, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- YUSUKE TAKECHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REEL HOLDING DEVICE AND TAPE FEEDER
- Publication number 20250098132
- Publication date Mar 20, 2025
- FUJI CORPORATION
- Hiroki MURASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS CONTROL DEVICE
- Publication number 20250098136
- Publication date Mar 20, 2025
- FUJI CORPORATION
- Teruyuki OHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND HEAD HAVING INDIVIDUALLY-DISPLACEABLE BOND ARMS
- Publication number 20250071962
- Publication date Feb 27, 2025
- ASMPT SINGAPORE PTE. LTD
- Chi Wah CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Operating an Electronics Production Line
- Publication number 20250063708
- Publication date Feb 20, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Bernd Müller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING DEVICE AND BENDING DETERMINATION METHOD
- Publication number 20250056778
- Publication date Feb 13, 2025
- FUJI CORPORATION
- Shota SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MANUFACTURING METHOD AND COMPONENT MOUNTING MACHINE
- Publication number 20250048608
- Publication date Feb 6, 2025
- FUJI CORPORATION
- Yuki HINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mounting of components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Computer system with external bypass air plenum

Thermocompression bonding with passivated silver-based contacting m...

Thermocompression bonding with passivated gold contacting metal

Thermocompression bonding with passivated tin-based contacting metal

Mounting device and mounting method

Resin shaping device

Information processing device and information processing method

Microstructure-transfer apparatus, stamp head unit, stamp component...

Tape guide for guiding a component tape

Method for manufacturing flexible printed circuit board

Learning method for plug-in depth

Systems for dismantling of double-sided PCBA

Correction amount calculating device

Substrate support pin installation jig

Automated memory card press fixture

Method and device for disassembling electronics

Analysis device for a component mounting device to analyze board co...

Apparatus including a plurality of heads and a method of using the...

Component mounting system

Automated system and method for inserting memory modules into mothe...

Component mounting device and correction value managing method

Component mounter

Wireless communication device manufacturing system

Backup pin and automatic backup pin exchange system

Component mounting machine

Component supply device and cover tape peeling method

Printed circuit board and method for manufacturing the same

Mounting device

Coating device and component mounting machine

Engaging connection structure and engaging connection method thereof

Patents Applicationslast 30 patents

JOINING WORK MACHINE

KITTING DEVICE EXTRACTION SYSTEM

PROTECTIVE MATERIAL APPLICATOR DEVICE

COMPONENT-MOUNTING MACHINE, COMPONENT-MOUNTING METHOD, AND CALIBRAT...

STRUCTURAL ENCLOSURE FOR PROTECTION AGAINST FOREIGN OBJECT DEBRIS A...

APPARATUS, SYSTEM, AND METHOD OF PROVIDING A TRAY FOR HOLDING AN OP...

SELECTIVE TRANSFER OF MICRO DEVICES

COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING METHOD

FEEDER REPLACEMENT

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

TAPE FEEDER AND METHOD FOR FEEDING COVER TAPE

EPOXY DISPENSING DEVICE AND METHOD OF MOUNTING ELECTRONIC COMPONENT...

COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING METHOD

COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME

PORTABLE BAKING ASSEMBLY TO CURE THERMAL INTERFACE MATERIAL FOR PRO...

MULTI-PATTERN TOOLING PLATE

SYNCHRONOUS MOTION SELECTIVE SOLDERING APPARATUS AND METHOD

WORK DEVICE

POSITIONING STRUCTURE, COMPONENT MOUNTING MACHINE, AND METHOD FOR M...

FEEDER, COMPONENT MOUNTING MACHINE, AND COMPONENT MOUNTING METHOD

REEL LOADING DEVICE

MOUNTING SYSTEM AND MEMBER SUPPLY GUIDANCE METHOD

MOUNTING HEAD, MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELEC...

REEL HOLDING DEVICE AND TAPE FEEDER

PROCESS CONTROL DEVICE

BOND HEAD HAVING INDIVIDUALLY-DISPLACEABLE BOND ARMS

Operating an Electronics Production Line

MOUNTING DEVICE AND BENDING DETERMINATION METHOD

SUBSTRATE MANUFACTURING METHOD AND COMPONENT MOUNTING MACHINE