Multilayer dielectric

Industry

CPC
H01P3/082

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Parent Industries

HELECTRICITY H01Electric elements H01PWAVEGUIDES RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE H01P3/00Waveguides Transmission lines of the waveguide type

Current Industry

H01P3/082Multilayer dielectric

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Signal transmission line comprising stacked insulating layers havin...
- Patent number 12,119,531
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line structures for three-dimensional integrated circu...
- Patent number 12,100,675
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards and methods for manufacturing thereof for RF...
- Patent number 12,087,987
- Issue date Sep 10, 2024
- Ciena Corporation
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated waveguide device including a resonance region...
- Patent number 12,087,991
- Issue date Sep 10, 2024
- Fujikura Ltd.
- Yusuke Uemichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for mounting a transmission line substrate having interla...
- Patent number 11,949,144
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Takahiro Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line member including first and third transmission lin...
- Patent number 11,909,088
- Issue date Feb 20, 2024
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless module
- Patent number 11,901,317
- Issue date Feb 13, 2024
- Fujikura Ltd.
- Kohei Matsumaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated waveguide transition including an impedance tr...
- Patent number 11,894,595
- Issue date Feb 6, 2024
- Waymo LLC
- Edwin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards and methods for manufacturing thereof for RF...
- Patent number 11,791,527
- Issue date Oct 17, 2023
- Ciena Corporation
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines with stacked dielect...
- Patent number 11,791,528
- Issue date Oct 17, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antennas-in-package verification board
- Patent number 11,682,818
- Issue date Jun 20, 2023
- TMY Technology Inc.
- Su-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method, where a dielectric material direct...
- Patent number 11,664,566
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission line including a flexible resin laminate having...
- Patent number 11,658,376
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Kanto Iida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic band gap structure and package structure
- Patent number 11,658,375
- Issue date May 23, 2023
- NEC Corporation
- Masaharu Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid over-the-air production line test platform
- Patent number 11,600,894
- Issue date Mar 7, 2023
- TMY Technology Inc.
- Su-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated waveguide transition including a metallic laye...
- Patent number 11,539,107
- Issue date Dec 27, 2022
- Waymo LLC
- Edwin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstrip line structures having multiple wiring layers and includ...
- Patent number 11,532,864
- Issue date Dec 20, 2022
- GLOBALFOUNDRIES U.S. INC.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line device comprising a plurality of substrates each...
- Patent number 11,489,242
- Issue date Nov 1, 2022
- Murata Manufacturing Co., Ltd.
- Shinichi Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer region having a signal via for coupling between planar s...
- Patent number 11,445,600
- Issue date Sep 13, 2022
- SOKEN, INC.
- Kazumasa Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible cable including a transmission line having an air gap conf...
- Patent number 11,444,363
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Bumhee Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer balun
- Patent number 11,431,071
- Issue date Aug 30, 2022
- TDK Corporation
- Yuta Ashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate for a waveguide and method of manufacturing a c...
- Patent number 11,394,097
- Issue date Jul 19, 2022
- Nokia Solutions and Networks Oy
- Senad Bulja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line cable including an unbendable superimposed layer...
- Patent number 11,374,299
- Issue date Jun 28, 2022
- AAC Technologies Pte. Ltd.
- Yue Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines having l-shaped cros...
- Patent number 11,329,358
- Issue date May 10, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transition structure for coupling first and second transmission lin...
- Patent number 11,316,240
- Issue date Apr 26, 2022
- TMY Technology Inc.
- Su-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency film transmission line, antenna including the same a...
- Patent number 11,316,238
- Issue date Apr 26, 2022
- Dongwoo Fine-Chem Co., Ltd.
- Yoon Ho Huh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a high-k dielectric material disposed b...
- Patent number 11,258,151
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission line including a flexible resin laminate having...
- Patent number 11,251,511
- Issue date Feb 15, 2022
- Murata Manufacturing Co., Ltd.
- Kanto Iida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line device comprising a plurality of substrates each...
- Patent number 11,245,171
- Issue date Feb 8, 2022
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards and methods for manufacturing thereof for RF...
- Patent number 11,217,869
- Issue date Jan 4, 2022
- Ciena Corporation
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Transmission Line Structures for Three-Dimensional Integrated Circu...
- Publication number 20240379592
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE SUBSTRATE
- Publication number 20240356191
- Publication date Oct 24, 2024
- Nippon Telegraph and Telephone Corporation
- Miwa Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit boards and methods for manufacturing thereof for RF...
- Publication number 20240021970
- Publication date Jan 18, 2024
- CIENA CORPORATION
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20230319980
- Publication date Oct 5, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230318160
- Publication date Oct 5, 2023
- Murata Manufacturing Co., Ltd.
- Yushi SOETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TRANSMISSION LINES AND METHOD OF FOR...
- Publication number 20230307813
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20230299453
- Publication date Sep 21, 2023
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE AND ELECTRONIC DEVICE
- Publication number 20230291086
- Publication date Sep 14, 2023
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Integrated Waveguide Transition
- Publication number 20230107707
- Publication date Apr 6, 2023
- WAYMO LLC
- Edwin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS
- Publication number 20220231394
- Publication date Jul 21, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Integrated Waveguide Transition
- Publication number 20220209385
- Publication date Jun 30, 2022
- WAYMO LLC
- Edwin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODULE
- Publication number 20220189891
- Publication date Jun 16, 2022
- FUJIKURA LTD.
- Kohei MATSUMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit boards and methods for manufacturing thereof for RF...
- Publication number 20220181761
- Publication date Jun 9, 2022
- CIENA CORPORATION
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC BAND GAP STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20220166121
- Publication date May 26, 2022
- NEC Corporation
- Masaharu ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TRANSMISSION LINES AND METHOD OF FOR...
- Publication number 20220158319
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION LINE
- Publication number 20220131250
- Publication date Apr 28, 2022
- Murata Manufacturing Co., Ltd.
- Kanto IIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE DEVICE
- Publication number 20220013880
- Publication date Jan 13, 2022
- FUJIKURA LTD.
- Yusuke UEMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER WITH SHIELDED TRANSMISSION LINES
- Publication number 20210013572
- Publication date Jan 14, 2021
- NXP. B.V.
- Ning ZHU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Printed circuit boards and methods for manufacturing thereof for RF...
- Publication number 20200303800
- Publication date Sep 24, 2020
- CIENA CORPORATION
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DIRECTIVITY COMPACT SIZE INTER LAYER COUPLER
- Publication number 20200295428
- Publication date Sep 17, 2020
- Jabil Inc.
- Lintao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY TRANSMISSION LINE
- Publication number 20200251798
- Publication date Aug 6, 2020
- SOKEN, INC.
- Kazumasa SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRANSMISSION LINE
- Publication number 20200235451
- Publication date Jul 23, 2020
- Murata Manufacturing Co., Ltd.
- Kanto IIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TRANSMISSION LINES AND METHOD OF FOR...
- Publication number 20200153073
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE
- Publication number 20200099118
- Publication date Mar 26, 2020
- FUJIKURA LTD.
- Kohei MATSUMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY FILM TRANSMISSION LINE, ANTENNA INCLUDING THE SAME A...
- Publication number 20200076035
- Publication date Mar 5, 2020
- DONGWOO FINE-CHEM CO., LTD.
- Yoon Ho HUH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit boards and methods for manufacturing thereof for RF...
- Publication number 20200006836
- Publication date Jan 2, 2020
- CIENA CORPORATION
- Kaisheng Hu
- G02 - OPTICS
Information Patent Application
LOW LOSS ARCHITECTURE FOR SUPERCONDUCTING QUBIT CIRCUITS
- Publication number 20190237649
- Publication date Aug 1, 2019
- International Business Machines Corporation
- Markus BRINK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSMISSION LINE, FLAT CABLE, AND ELECTRONIC DEVICE
- Publication number 20190198195
- Publication date Jun 27, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS ARCHITECTURE FOR SUPERCONDUCTING QUBIT CIRCUITS
- Publication number 20190165242
- Publication date May 30, 2019
- International Business Machines Corporation
- Markus BRINK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20190029108
- Publication date Jan 24, 2019
- NIPPON MEKTRON, LTD.
- Fumihiko Matsuda
- H01 - BASIC ELECTRIC ELEMENTS

Multilayer dielectric

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Signal transmission line comprising stacked insulating layers havin...

Transmission line structures for three-dimensional integrated circu...

Printed circuit boards and methods for manufacturing thereof for RF...

Substrate integrated waveguide device including a resonance region...

Structure for mounting a transmission line substrate having interla...

Transmission line member including first and third transmission lin...

Wireless module

Substrate integrated waveguide transition including an impedance tr...

Printed circuit boards and methods for manufacturing thereof for RF...

Low loss and low cross talk transmission lines with stacked dielect...

Antennas-in-package verification board

Semiconductor device and method, where a dielectric material direct...

Signal transmission line including a flexible resin laminate having...

Electromagnetic band gap structure and package structure

Rapid over-the-air production line test platform

Substrate integrated waveguide transition including a metallic laye...

Microstrip line structures having multiple wiring layers and includ...

Transmission line device comprising a plurality of substrates each...

Interlayer region having a signal via for coupling between planar s...

Flexible cable including a transmission line having an air gap conf...

Multilayer balun

Composite substrate for a waveguide and method of manufacturing a c...

Transmission line cable including an unbendable superimposed layer...

Low loss and low cross talk transmission lines having l-shaped cros...

Transition structure for coupling first and second transmission lin...

High frequency film transmission line, antenna including the same a...

Semiconductor device having a high-k dielectric material disposed b...

Signal transmission line including a flexible resin laminate having...

Transmission line device comprising a plurality of substrates each...

Printed circuit boards and methods for manufacturing thereof for RF...

Patents Applicationslast 30 patents

Transmission Line Structures for Three-Dimensional Integrated Circu...

TRANSMISSION LINE SUBSTRATE

Printed circuit boards and methods for manufacturing thereof for RF...

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE INCLUDING TRANSMISSION LINES AND METHOD OF FOR...

MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE

TRANSMISSION LINE AND ELECTRONIC DEVICE

Substrate Integrated Waveguide Transition

LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS

Substrate Integrated Waveguide Transition

WIRELESS MODULE

Printed circuit boards and methods for manufacturing thereof for RF...

ELECTROMAGNETIC BAND GAP STRUCTURE AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING TRANSMISSION LINES AND METHOD OF FOR...

SIGNAL TRANSMISSION LINE

WAVEGUIDE DEVICE

POWER AMPLIFIER WITH SHIELDED TRANSMISSION LINES

Printed circuit boards and methods for manufacturing thereof for RF...

HIGH DIRECTIVITY COMPACT SIZE INTER LAYER COUPLER

HIGH-FREQUENCY TRANSMISSION LINE

SIGNAL TRANSMISSION LINE

SEMICONDUCTOR DEVICE INCLUDING TRANSMISSION LINES AND METHOD OF FOR...

TRANSMISSION LINE

HIGH FREQUENCY FILM TRANSMISSION LINE, ANTENNA INCLUDING THE SAME A...

Printed circuit boards and methods for manufacturing thereof for RF...

LOW LOSS ARCHITECTURE FOR SUPERCONDUCTING QUBIT CIRCUITS

TRANSMISSION LINE, FLAT CABLE, AND ELECTRONIC DEVICE

LOW LOSS ARCHITECTURE FOR SUPERCONDUCTING QUBIT CIRCUITS

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD