Multiple polishing heads, oscillating and rotating

Follow

Industry

CPC
G05B2219/50007

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G05Controlling systems G05BCONTROL OR REGULATING SYSTEMS IN GENERAL FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS G05B2219/00Program-control systems

Current Industry

G05B2219/50007Multiple polishing heads, oscillating and rotating

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Numerical controller oscillating motion adjustment
- Patent number 10,551,816
- Issue date Feb 4, 2020
- FANUC CORPORATION
- Yousuke Koyanaka
- G05 - CONTROLLING REGULATING
Information Patent Grant
Wafer polishing method and apparatus
- Patent number 5,498,196
- Issue date Mar 12, 1996
- Speedfam Corporation
- Chris E. Karlsrud
- G05 - CONTROLLING REGULATING
Information Patent Grant
Wafer polishing method and apparatus
- Patent number 5,498,199
- Issue date Mar 12, 1996
- Speedfam Corporation
- Chris E. Karlsrud
- G05 - CONTROLLING REGULATING
Information Patent Grant
Wafer polishing method and apparatus
- Patent number 5,329,732
- Issue date Jul 19, 1994
- Speedfam Corporation
- Chris E. Karlsrud
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents