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Y10T428/12715

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T428/00Stock material or miscellaneous articles

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Y10T428/12715Next to Group IB metal-base component

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Patents Grantslast 30 patents

Information Patent Grant
Metal-coated liquid-crystal polymer film
- Patent number 12,089,327
- Issue date Sep 10, 2024
- Kuraray Co., Ltd.
- Kikuo Arimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical connector
- Patent number 12,036,628
- Issue date Jul 16, 2024
- Aptiv Technologies AG
- Stephen Antaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Roll-bonded laminate and method for producing the same
- Patent number 11,999,131
- Issue date Jun 4, 2024
- Toyo Kohan Co., Ltd.
- Yusuke Hashimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sliding member
- Patent number 11,959,518
- Issue date Apr 16, 2024
- Taiho Kogyo Co., Ltd.
- Shigeyuki Suga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper-phosphorus-tin brazing wire and preparation method thereof
- Patent number 11,931,828
- Issue date Mar 19, 2024
- ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD
- Sujuan Zhong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder composition
- Patent number 11,738,412
- Issue date Aug 29, 2023
- Aptiv Technologies Limited
- Stephen C. Antaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-alloy capping layers for metallization in touch-panel displays
- Patent number 11,640,222
- Issue date May 2, 2023
- Materion Newton, Inc.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatuses for mitigating tin whisker growth on tin an...
- Patent number 11,505,874
- Issue date Nov 22, 2022
- The Boeing Company
- Thomas A. Woodrow
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 11,399,426
- Issue date Jul 26, 2022
- NGK Spark Plug Co., Ltd.
- Toshio Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper-alloy capping layers for metallization in touch-panel displays
- Patent number 11,392,257
- Issue date Jul 19, 2022
- MATERION NEWTON INC.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hot-dip Sn—Zn-based alloy-plated steel sheet
- Patent number 11,371,130
- Issue date Jun 28, 2022
- Nippon Steel Corporation
- Masahiro Fuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Slide member, bicycle component using slide member, and fishing tac...
- Patent number 11,274,260
- Issue date Mar 15, 2022
- Shimano Inc.
- Takamoto Asakawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin-plated copper terminal material, terminal, and electric-wire te...
- Patent number 11,264,750
- Issue date Mar 1, 2022
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wire material for canted coil spring and canted coil spring
- Patent number 11,186,902
- Issue date Nov 30, 2021
- Sumitomo Electric Industries, Ltd.
- Takumi Akada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical contact material, method of producing an electrical cont...
- Patent number 10,998,108
- Issue date May 4, 2021
- Furukawa Electric Co., Ltd.
- Yoshikazu Okuno
- B32 - LAYERED PRODUCTS
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 10,985,485
- Issue date Apr 20, 2021
- Dowa Metaltech Co., Ltd.
- Hiroto Narieda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Terminal material for connectors and method for producing same
- Patent number 10,923,245
- Issue date Feb 16, 2021
- Mitsubishi Materials Corporation
- Yuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor and method of forming an electrode of a thin-f...
- Patent number 10,916,569
- Issue date Feb 9, 2021
- H.C. Starck Inc.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Soldering material
- Patent number 10,888,957
- Issue date Jan 12, 2021
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal foil for electromagnetic shielding, electromagnetic shielding...
- Patent number 10,842,058
- Issue date Nov 17, 2020
- JX Nippon Mining & Metals Corporation
- Koichiro Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cu core ball, solder joint, solder paste and formed solder
- Patent number 10,639,749
- Issue date May 5, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods and apparatuses for mitigating tin whisker growth on tin an...
- Patent number 10,633,754
- Issue date Apr 28, 2020
- The Boeing Company
- Thomas A. Woodrow
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metallic material for electronic components and method for producin...
- Patent number 10,594,066
- Issue date Mar 17, 2020
- JX Nippon Mining & Metals Corporation
- Yoshitaka Shibuya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Steel sheet for container and method for producing steel sheet for...
- Patent number 10,577,705
- Issue date Mar 3, 2020
- Nippon Steel Corporation
- Akira Tachiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Steel sheet for container and method for producing steel sheet for...
- Patent number 10,563,311
- Issue date Feb 18, 2020
- Nippon Steel Corporation
- Akira Tachiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallic material for electronic components and method for producin...
- Patent number 10,530,084
- Issue date Jan 7, 2020
- JX Nippon Mining & Metals Corporation
- Yoshitaka Shibuya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper-titanium alloy foil having plated layer
- Patent number 10,495,840
- Issue date Dec 3, 2019
- JX Nippon Mining & Metals Corporation
- Kenta Tsujie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic material for electronic components and method for producin...
- Patent number 10,373,730
- Issue date Aug 6, 2019
- JX Nippon Mining & Metals Corporation
- Yoshitaka Shibuya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ceramic electronic component
- Patent number 10,354,802
- Issue date Jul 16, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Bum Chul Bae
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Enhanced techniques for production of golden bronze by inter-diffus...
- Patent number 10,266,959
- Issue date Apr 23, 2019
- MONNAIE ROYALE CANADIENNE / ROYAL CANADIAN MINT
- Taixiang Jiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20230264303
- Publication date Aug 24, 2023
- Aptiv Technologies Limited
- Stephen Antaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
- Publication number 20220308705
- Publication date Sep 29, 2022
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
- Publication number 20210208738
- Publication date Jul 8, 2021
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COPPER ALLOY SHEET WITH SN COATING LAYER FOR A FITTING TYPE CONNECT...
- Publication number 20180301838
- Publication date Oct 18, 2018
- Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- Masahiro Tsuru
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
- Publication number 20180175075
- Publication date Jun 21, 2018
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Tin Whisker Mitigation Material Using Thin Film Metallic Glass Unde...
- Publication number 20140370328
- Publication date Dec 18, 2014
- National Taiwan University of Science and Technology
- Jinn Chu
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE WIRE AND CONTACT ELEMENT
- Publication number 20140353030
- Publication date Dec 4, 2014
- Feindrahtwerk Adolf Edelhoff GmbH & Co. KG
- Gerhard BÜRSTNER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METAL MATERIAL FOR ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140329107
- Publication date Nov 6, 2014
- JX NIPPON MINING & METALS CORPORATION
- Yoshitaka Shibuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATED CONTACT AND PROCESS OF MANUFACTURING PLATED CONTACT
- Publication number 20140308540
- Publication date Oct 16, 2014
- Tyco Electronics Corporation
- George Jyh-Shann CHOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCONDUCTIVE MATERIAL SUPERIOR IN RESISTANCE TO FRETTING CORRO...
- Publication number 20140295070
- Publication date Oct 2, 2014
- Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel Ltd.)
- Masahiro TSURU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSE...
- Publication number 20140287262
- Publication date Sep 25, 2014
- MITSUBISHI MATERIALS CORPORATION
- Naoki Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CORROSION RESISTANT BARRIER FORMED BY VAPOR PHASE TIN REFLOW
- Publication number 20140178711
- Publication date Jun 26, 2014
- Tyco Electronics Corporation
- George Jyh-Shann CHOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSE...
- Publication number 20140170436
- Publication date Jun 19, 2014
- MITSUBISHI MATERIALS CORPORATION
- Yuki Taninouchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SN-COATED COPPER ALLOY STRIP HAVING EXCELLENT HEAT RESISTANCE
- Publication number 20140065440
- Publication date Mar 6, 2014
- Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- Masahiro TSURU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CO-EVAPORATION ALLOY MATERIAL AND EVAPORATION COATING METHOD USING...
- Publication number 20140057054
- Publication date Feb 27, 2014
- FIH (HONG KONG) LIMITED
- DA-HUA CAO
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PA...
- Publication number 20140041219
- Publication date Feb 13, 2014
- Shinko Leadmikk Co., Ltd.
- Yasushi MASAGO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PA...
- Publication number 20140045392
- Publication date Feb 13, 2014
- Shinko Leadmikk Co., Ltd.
- Yasushi MASAGO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CORROSION RESISTANT ELECTRICAL CONDUCTOR
- Publication number 20140023880
- Publication date Jan 23, 2014
- Tyco Electronics Corporation
- GEORGE JYH-SHANN CHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
JOINT WITH FIRST AND SECOND MEMBERS WITH A JOINING LAYER LOCATED TH...
- Publication number 20140008419
- Publication date Jan 9, 2014
- Kabushiki Kaisha Toshiba
- Toshihide Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WINDSCREEN WIPER DEVICE
- Publication number 20130330572
- Publication date Dec 12, 2013
- Klaus Staschko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ZINC-FREE SPRAY POWDER, COPPER-CONTAINING THERMAL SPRAY LAYER, AS W...
- Publication number 20130319367
- Publication date Dec 5, 2013
- Bernd Distler
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BEARING PART AND THERMAL SPRAY METHOD
- Publication number 20130323528
- Publication date Dec 5, 2013
- Peter Ernst
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Pb-FREE SOLDER-CONNECTED STRUCTURE
- Publication number 20130286621
- Publication date Oct 31, 2013
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE MATERIAL FOR CONNECTION COMPONENT
- Publication number 20130260174
- Publication date Oct 3, 2013
- Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- Masahiro TSURU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
USE OF SN AND PORE SIZE CONTROL TO IMPROVE BIOCOMPATIBILITY IN POLY...
- Publication number 20130260173
- Publication date Oct 3, 2013
- Clayton F. Gardinier
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER ALLOY SHEET WITH SN COATING LAYER FOR A FITTING TYPE CONNECT...
- Publication number 20130237105
- Publication date Sep 12, 2013
- Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- Masahiro Tsuru
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH TEMPERATURE RESISTANT SILVER COATED SUBSTRATES
- Publication number 20130196174
- Publication date Aug 1, 2013
- Rohm and Haas Electronic Materials L.L.C.
- Wan ZHANG-BEGLINGER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL AND METHOD FOR PRODUC...
- Publication number 20130196171
- Publication date Aug 1, 2013
- MITSUBISHI MATERIALS CORPORATION
- Yuki Taninouchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LAMINATED HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD...
- Publication number 20130001782
- Publication date Jan 3, 2013
- Rohm Co., Ltd.
- Takukazu Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Application
CORROSION RESISTANT ELECTRICAL CONDUCTOR
- Publication number 20120285720
- Publication date Nov 15, 2012
- Tyco Electronics Corporation
- GEORGE JYH-SHANN CHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Next to Group IB metal-base component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-coated liquid-crystal polymer film

Electrical connector

Roll-bonded laminate and method for producing the same

Sliding member

Copper-phosphorus-tin brazing wire and preparation method thereof

Lead-free solder composition

Copper-alloy capping layers for metallization in touch-panel displays

Methods and apparatuses for mitigating tin whisker growth on tin an...

Wiring board and method for manufacturing same

Copper-alloy capping layers for metallization in touch-panel displays

Hot-dip Sn—Zn-based alloy-plated steel sheet

Slide member, bicycle component using slide member, and fishing tac...

Tin-plated copper terminal material, terminal, and electric-wire te...

Wire material for canted coil spring and canted coil spring

Electrical contact material, method of producing an electrical cont...

Tin-plated product and method for producing same

Terminal material for connectors and method for producing same

Thin-film transistor and method of forming an electrode of a thin-f...

Soldering material

Metal foil for electromagnetic shielding, electromagnetic shielding...

Cu core ball, solder joint, solder paste and formed solder

Methods and apparatuses for mitigating tin whisker growth on tin an...

Metallic material for electronic components and method for producin...

Steel sheet for container and method for producing steel sheet for...

Steel sheet for container and method for producing steel sheet for...

Metallic material for electronic components and method for producin...

Copper-titanium alloy foil having plated layer

Metallic material for electronic components and method for producin...

Ceramic electronic component

Enhanced techniques for production of golden bronze by inter-diffus...

Patents Applicationslast 30 patents

ELECTRICAL CONNECTOR

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

COPPER ALLOY SHEET WITH SN COATING LAYER FOR A FITTING TYPE CONNECT...

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

Tin Whisker Mitigation Material Using Thin Film Metallic Glass Unde...

COMPOSITE WIRE AND CONTACT ELEMENT

METAL MATERIAL FOR ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURIN...

PLATED CONTACT AND PROCESS OF MANUFACTURING PLATED CONTACT

ELECTROCONDUCTIVE MATERIAL SUPERIOR IN RESISTANCE TO FRETTING CORRO...

TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSE...

CORROSION RESISTANT BARRIER FORMED BY VAPOR PHASE TIN REFLOW

TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSE...

SN-COATED COPPER ALLOY STRIP HAVING EXCELLENT HEAT RESISTANCE

CO-EVAPORATION ALLOY MATERIAL AND EVAPORATION COATING METHOD USING...

COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PA...

COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PA...

CORROSION RESISTANT ELECTRICAL CONDUCTOR

JOINT WITH FIRST AND SECOND MEMBERS WITH A JOINING LAYER LOCATED TH...

WINDSCREEN WIPER DEVICE

ZINC-FREE SPRAY POWDER, COPPER-CONTAINING THERMAL SPRAY LAYER, AS W...

BEARING PART AND THERMAL SPRAY METHOD

Pb-FREE SOLDER-CONNECTED STRUCTURE

ELECTROCONDUCTIVE MATERIAL FOR CONNECTION COMPONENT

USE OF SN AND PORE SIZE CONTROL TO IMPROVE BIOCOMPATIBILITY IN POLY...

COPPER ALLOY SHEET WITH SN COATING LAYER FOR A FITTING TYPE CONNECT...

HIGH TEMPERATURE RESISTANT SILVER COATED SUBSTRATES

TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL AND METHOD FOR PRODUC...

LAMINATED HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD...

CORROSION RESISTANT ELECTRICAL CONDUCTOR