of copper

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C25D3/38

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D3/00Electroplating: Baths therefor

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C25D3/38of copper

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 12,320,028
- Issue date Jun 3, 2025
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Neutral pH copper plating solution for undercut reduction
- Patent number 12,312,703
- Issue date May 27, 2025
- Texas Instruments Incorporated
- Nazila Dadvand
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High density coil design and process
- Patent number 12,308,157
- Issue date May 20, 2025
- Hutchinson Technology Incorporated
- John L. Schumann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
TSV process window and fill performance enhancement by long pulsing...
- Patent number 12,305,307
- Issue date May 20, 2025
- Lam Research Corporation
- Jae Shin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite metal foil
- Patent number 12,305,309
- Issue date May 20, 2025
- Industrial Technology Research Institute
- Chiu-Yen Chiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrochemical methods, devices and compositions
- Patent number 12,286,720
- Issue date Apr 29, 2025
- Iontra Inc
- Daniel A. Konopka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,289,838
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Yasuki Kimishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electroplating nanograined copper
- Patent number 12,281,403
- Issue date Apr 22, 2025
- UMICORE SUZHOU SEMICONDUCTOR MATERIALS CO., LTD.
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process method for controlling glossiness of electroplated nickel-l...
- Patent number 12,276,038
- Issue date Apr 15, 2025
- Luxshare Precision Industry(Chuzhou), Ltd.
- Weihua Shao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer shielding for prevention of lipseal plate-out
- Patent number 12,241,173
- Issue date Mar 4, 2025
- Lam Research Corporation
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and methods for determining horizontal position of substr...
- Patent number 12,237,220
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolytic copper foil capable of preventing tearing or wrinkle d...
- Patent number 12,227,868
- Issue date Feb 18, 2025
- SK NEXILIS CO., LTD.
- Young Tae Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing copper sulfate electrolyte
- Patent number 12,221,716
- Issue date Feb 11, 2025
- KOREA ZINC CO., LTD.
- Je Joong Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 12,221,714
- Issue date Feb 11, 2025
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing an electrolytic copper foil
- Patent number 12,199,234
- Issue date Jan 14, 2025
- Nan Ya Plastics Corporation
- Chia-Ling Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal air filter
- Patent number 12,194,476
- Issue date Jan 14, 2025
- Korea Advanced Institute of Science and Technology
- San Ha Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lithium ion secondary battery
- Patent number 12,199,235
- Issue date Jan 14, 2025
- Nan Ya Plastics Corporation
- Chia-Ling Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition systems with enhanced crystallization pr...
- Patent number 12,195,867
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical carbon oxides reduction to ethylene
- Patent number 12,188,138
- Issue date Jan 7, 2025
- TOTALENERGIES ONETECH
- Moritz Wilhelm Schreiber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Probe sheet with contact tip on stacked multi-layer and method of m...
- Patent number 12,181,494
- Issue date Dec 31, 2024
- PROTEC MEMS TECHNOLOGY INC
- Yong Ho Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Articles including surface coatings and methods to produce them
- Patent number 12,173,166
- Issue date Dec 24, 2024
- Maxterial, Inc.
- Atieh Haghdoost
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper foil having excellent heat resistance property
- Patent number 12,170,375
- Issue date Dec 17, 2024
- Chang Chun Petrochemical Co., Ltd.
- Yao-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal foil with carrier and preparation method thereof
- Patent number 12,167,533
- Issue date Dec 10, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photosensitive resin composition, method for forming resist pattern...
- Patent number 12,158,700
- Issue date Dec 3, 2024
- JSR Corporation
- Hirokazu Sakakibara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Low-roughness surface-treated copper foil with low bending deformat...
- Patent number 12,144,124
- Issue date Nov 12, 2024
- Lotte Energy Materials Corporation
- Chang Yol Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Carrier foil-attached metal foil, method of manufacturing the same,...
- Patent number 12,139,811
- Issue date Nov 12, 2024
- YMT CO., LTD.
- Hyun Woo Jeon
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
PLATING SOLUTION CONTAINING SULFONIO GROUP-CONTAINING ETHER COMPOUND
- Publication number 20250179676
- Publication date Jun 5, 2025
- JCU CORPORATION
- Kazuki KISHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER-GRAPHENE MULTILAYER COMPOSITE COATED COPPER FOIL FOR ANODE C...
- Publication number 20250183321
- Publication date Jun 5, 2025
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Yi Liu
- B60 - VEHICLES IN GENERAL
Information Patent Application
EASILY CRUSHABLE ELECTRODEPOSITED COPPER
- Publication number 20250154677
- Publication date May 15, 2025
- JX ADVANCED METALS CORPORATION
- Ayaka FUKUNARI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS
- Publication number 20250146159
- Publication date May 8, 2025
- STMicroelectronics International N.V.
- Paolo CREMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLEXIBLE COPPER CLAD LAMINATE
- Publication number 20250146135
- Publication date May 8, 2025
- POMIRAN METALIZATION RESEARCH CO., LTD.
- CHUNG-YI CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER-ATTACHED ULTRA-THIN COPPER FOIL AND METHOD FOR PRODUCING TH...
- Publication number 20250137155
- Publication date May 1, 2025
- Nan Ya Plastics Corporation
- Te-Chao LIAO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTE COMPRISING AN ACCELERATOR AGENT FOR BOTTOM-UP COPPER EL...
- Publication number 20250137157
- Publication date May 1, 2025
- MacDermid Enthone Inc.
- Hermine Marie BERTHON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COPPER ELECTRODEPOSITION COMPRISING A POLYAMINOAMID...
- Publication number 20250129503
- Publication date Apr 24, 2025
- BASF SE
- Marco ARNOLD
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL WITH HIGH ELONGATION RATE AND METHOD OF MANUFACTURING SAME
- Publication number 20250129501
- Publication date Apr 24, 2025
- DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY ACADEMY COOPERATION
- Hyo Jong LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Glow In The Dark Blanket And Flat Screen Printing Method
- Publication number 20250127315
- Publication date Apr 24, 2025
- Carrie Knapp
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...
- Publication number 20250125151
- Publication date Apr 17, 2025
- Louis Caillard
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Anode Array and Controller for Electrochemical Layer Deposition
- Publication number 20250122638
- Publication date Apr 17, 2025
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ULTRA-MICRO ELECTRODE FOR ELECTROCHEMICAL ANALYSIS AND METHOD OF MA...
- Publication number 20250125072
- Publication date Apr 17, 2025
- DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY ACADEMY COOPERATION
- Hyo Jong LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CLADS HAVING POLYMER FILMS AND METAL LAYERS
- Publication number 20250109265
- Publication date Apr 3, 2025
- DUPONT ELECTRONICS, INC.
- ROSA IRENE GONZALEZ
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEPOSITION MASK AND METHOD OF FABRICATING THE SAME
- Publication number 20250101626
- Publication date Mar 27, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jeong Kuk KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...
- Publication number 20250092559
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD OF ROUGHENED COPPER FOIL
- Publication number 20250092555
- Publication date Mar 20, 2025
- NAN YA PLASTICS CORPORATION
- Te-Chao Liao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GEOTHERMALLY POWERED HYDROMETALLURGICAL COPPER PRODUCTION
- Publication number 20250066874
- Publication date Feb 27, 2025
- EnhancedGEO Holdings, LLC
- Greg Lindberg
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...
- Publication number 20250051949
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrochemical Layer Deposition by Anode Array Using Measurement I...
- Publication number 20250043453
- Publication date Feb 6, 2025
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MASKING MEMBER AND FILM FORMING APPARATUS FOR METAL FILM USING SAME
- Publication number 20250034743
- Publication date Jan 30, 2025
- Toyota Jidosha Kabushiki Kaisha
- Haruki KONDOH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONTROLLING PROPERTIES OF ELECTROLYTIC COPPER FOIL AND MA...
- Publication number 20250019852
- Publication date Jan 16, 2025
- KZAM Corporation
- Jeong Hwan KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACIDIC ELECTROLYTIC COPPER PLATING LIQUID, METHOD FOR FORMING PREFO...
- Publication number 20250003102
- Publication date Jan 2, 2025
- MITSUBISHI MATERIALS CORPORATION
- Junta Inoue
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL CARBON OXIDES REDUCTION TO ETHYLENE
- Publication number 20240417863
- Publication date Dec 19, 2024
- TOTALENERGIES ONETECH
- Moritz Wilhelm SCHREIBER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRATHIN COPPER FOIL, A METHOD FOR MANUFACTURING THE SAME, AND AN...
- Publication number 20240417877
- Publication date Dec 19, 2024
- DUPONT ELECTRONICS, INC.
- LIN SHIH-CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE CARBON NANOTUBE STRUCTURES
- Publication number 20240410075
- Publication date Dec 12, 2024
- University of Dayton Research Institute
- Paul Kladitis
- B82 - NANO-TECHNOLOGY
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HO...
- Publication number 20240407091
- Publication date Dec 5, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACID MIST SUPPRESSION IN COPPER ELECTROWINNING
- Publication number 20240392459
- Publication date Nov 28, 2024
- Freeport Minerals Corporation
- Scot Philip Sandoval
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUSES AND SYSTEMS FOR ELECTROPLATING
- Publication number 20240363406
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrochemical three-dimensional printing and soldering

Neutral pH copper plating solution for undercut reduction

High density coil design and process

TSV process window and fill performance enhancement by long pulsing...

Composite metal foil

Conductive structure including copper-phosphorous alloy and a metho...

Electrochemical methods, devices and compositions

Wiring substrate and method for manufacturing wiring substrate

Method for electroplating nanograined copper

Process method for controlling glossiness of electroplated nickel-l...

Method of preparing a high density interconnect printed circuit boa...

Wafer shielding for prevention of lipseal plate-out

Apparatus and methods for determining horizontal position of substr...

Electrolytic copper foil capable of preventing tearing or wrinkle d...

Printed circuit board and method of fabricating the same

Method of manufacturing copper sulfate electrolyte

Plating method and plating apparatus

Method for producing an electrolytic copper foil

Metal air filter

Lithium ion secondary battery

Electrochemical deposition systems with enhanced crystallization pr...

Electrochemical carbon oxides reduction to ethylene

Probe sheet with contact tip on stacked multi-layer and method of m...

Articles including surface coatings and methods to produce them

Copper foil having excellent heat resistance property

Metal foil with carrier and preparation method thereof

Photosensitive resin composition, method for forming resist pattern...

Method of controlling chemical concentration in electrolyte

Low-roughness surface-treated copper foil with low bending deformat...

Carrier foil-attached metal foil, method of manufacturing the same,...

Patents Applicationslast 30 patents

PLATING SOLUTION CONTAINING SULFONIO GROUP-CONTAINING ETHER COMPOUND

COPPER-GRAPHENE MULTILAYER COMPOSITE COATED COPPER FOIL FOR ANODE C...

EASILY CRUSHABLE ELECTRODEPOSITED COPPER

METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS

FLEXIBLE COPPER CLAD LAMINATE

CARRIER-ATTACHED ULTRA-THIN COPPER FOIL AND METHOD FOR PRODUCING TH...

ELECTROLYTE COMPRISING AN ACCELERATOR AGENT FOR BOTTOM-UP COPPER EL...

COMPOSITION FOR COPPER ELECTRODEPOSITION COMPRISING A POLYAMINOAMID...

COPPER FOIL WITH HIGH ELONGATION RATE AND METHOD OF MANUFACTURING SAME

Glow In The Dark Blanket And Flat Screen Printing Method

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...

Anode Array and Controller for Electrochemical Layer Deposition

ULTRA-MICRO ELECTRODE FOR ELECTROCHEMICAL ANALYSIS AND METHOD OF MA...

CLADS HAVING POLYMER FILMS AND METAL LAYERS

DEPOSITION MASK AND METHOD OF FABRICATING THE SAME

ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...

MANUFACTURING METHOD OF ROUGHENED COPPER FOIL

GEOTHERMALLY POWERED HYDROMETALLURGICAL COPPER PRODUCTION

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...

Electrochemical Layer Deposition by Anode Array Using Measurement I...

MASKING MEMBER AND FILM FORMING APPARATUS FOR METAL FILM USING SAME

METHOD OF CONTROLLING PROPERTIES OF ELECTROLYTIC COPPER FOIL AND MA...

ACIDIC ELECTROLYTIC COPPER PLATING LIQUID, METHOD FOR FORMING PREFO...

ELECTROCHEMICAL CARBON OXIDES REDUCTION TO ETHYLENE

ULTRATHIN COPPER FOIL, A METHOD FOR MANUFACTURING THE SAME, AND AN...

COMPOSITE CARBON NANOTUBE STRUCTURES

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HO...

ACID MIST SUPPRESSION IN COPPER ELECTROWINNING

APPARATUSES AND SYSTEMS FOR ELECTROPLATING