of copper

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CPC
C25D3/38

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D3/00Electroplating: Baths therefor

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C25D3/38of copper

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Patents Grantslast 30 patents

Information Patent Grant
Articles including surface coatings and methods to produce them
- Patent number 12,173,166
- Issue date Dec 24, 2024
- Maxterial, Inc.
- Atieh Haghdoost
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper foil having excellent heat resistance property
- Patent number 12,170,375
- Issue date Dec 17, 2024
- Chang Chun Petrochemical Co., Ltd.
- Yao-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal foil with carrier and preparation method thereof
- Patent number 12,167,533
- Issue date Dec 10, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photosensitive resin composition, method for forming resist pattern...
- Patent number 12,158,700
- Issue date Dec 3, 2024
- JSR Corporation
- Hirokazu Sakakibara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Carrier foil-attached metal foil, method of manufacturing the same,...
- Patent number 12,139,811
- Issue date Nov 12, 2024
- YMT CO., LTD.
- Hyun Woo Jeon
- B32 - LAYERED PRODUCTS
Information Patent Grant
Low-roughness surface-treated copper foil with low bending deformat...
- Patent number 12,144,124
- Issue date Nov 12, 2024
- Lotte Energy Materials Corporation
- Chang Yol Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for copper bump electrodeposition comprising a polyamin...
- Patent number 12,134,834
- Issue date Nov 5, 2024
- BASF SE
- Marco Arnold
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas-solid separation structure, feeding device and electrochemical...
- Patent number 12,121,873
- Issue date Oct 22, 2024
- BOE Technology Group Co., Ltd.
- Shaodong Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Layered product
- Patent number 12,115,754
- Issue date Oct 15, 2024
- DIC Corporation
- Takamichi Aoki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Acid mist suppression in copper electrowinning
- Patent number 12,098,474
- Issue date Sep 24, 2024
- Freeport Minerals Corporation
- Scot Philip Sandoval
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Graphene/copper composite deformed copper-chromium-zirconium alloy...
- Patent number 12,098,452
- Issue date Sep 24, 2024
- CHANGZHOU UNIVERSITY
- Wei Wei
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrolytic copper foil and method for producing same
- Patent number 12,091,766
- Issue date Sep 17, 2024
- NIPPON DENKAI, LTD.
- Toshio Kawasaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and methods for determining horizontal position of substr...
- Patent number 12,087,625
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating with a polycarboxylate ether supressor
- Patent number 12,071,700
- Issue date Aug 27, 2024
- BASF SE
- Tobias Urban
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 12,071,702
- Issue date Aug 27, 2024
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating for thermal management
- Patent number 12,068,221
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing sequences for high density interconnect printed circu...
- Patent number 12,063,751
- Issue date Aug 13, 2024
- Atotech Deutschland GmbH & Co. KG
- Akif Özkök
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 12,058,818
- Issue date Aug 6, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Acidic aqueous composition for electrolytically depositing a copper...
- Patent number 12,054,843
- Issue date Aug 6, 2024
- Atotech Deutschland GmbH & Co. KG
- Ralf Schmidt
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method and process for creating high-performance coax sockets
- Patent number 12,052,830
- Issue date Jul 30, 2024
- Advantest America, Inc
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Reactor for electrochemical deposition
- Patent number 12,049,704
- Issue date Jul 30, 2024
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing LCP-based flexible copper-clad plate, and...
- Patent number 12,012,660
- Issue date Jun 18, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Nianqun Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electrofill on non-copper liner layers
- Patent number 12,012,667
- Issue date Jun 18, 2024
- Lam Research Corporation
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing a threaded nut of a threaded drive, in particu...
- Patent number 12,007,003
- Issue date Jun 11, 2024
- Schaeffler Technologies AG & Co. KG
- Mario Kreutzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for improving mechanical properties by changing gradient nan...
- Patent number 12,000,057
- Issue date Jun 4, 2024
- Institute of Metal Research, Chinese Academy of Sciences
- Lei Lu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Copper alloy film with high strength and high conductivity
- Patent number 12,000,030
- Issue date Jun 4, 2024
- Apple Inc.
- Herng-Jeng Jou
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Mask and method of manufacturing the same, and mask assembly
- Patent number 11,993,839
- Issue date May 28, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Yong Zheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure including copper plating layer or copper alloy plating layer
- Patent number 11,993,862
- Issue date May 28, 2024
- Ishihara Chemical Co., LTD
- Masaru Hatabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCHEMICAL CARBON OXIDES REDUCTION TO ETHYLENE
- Publication number 20240417863
- Publication date Dec 19, 2024
- TOTALENERGIES ONETECH
- Moritz Wilhelm SCHREIBER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRATHIN COPPER FOIL, A METHOD FOR MANUFACTURING THE SAME, AND AN...
- Publication number 20240417877
- Publication date Dec 19, 2024
- DUPONT ELECTRONICS, INC.
- LIN SHIH-CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE CARBON NANOTUBE STRUCTURES
- Publication number 20240410075
- Publication date Dec 12, 2024
- University of Dayton Research Institute
- Paul Kladitis
- B82 - NANO-TECHNOLOGY
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HO...
- Publication number 20240407091
- Publication date Dec 5, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACID MIST SUPPRESSION IN COPPER ELECTROWINNING
- Publication number 20240392459
- Publication date Nov 28, 2024
- Freeport Minerals Corporation
- Scot Philip Sandoval
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUSES AND SYSTEMS FOR ELECTROPLATING
- Publication number 20240363406
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND SYSTEM FOR REGENERATING ELECTROLYTIC COPPER PLATING SOLU...
- Publication number 20240360586
- Publication date Oct 31, 2024
- C. Uyemura & Co., Ltd.
- Takuya OKAMACHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CATHODE ELECTRODE, AND COMPOSITE OF CATHODE ELECTRODE AND SUBSTRATE
- Publication number 20240360577
- Publication date Oct 31, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Takahiro YAMAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PRODUCING PLATING DEPOSIT
- Publication number 20240351943
- Publication date Oct 24, 2024
- C. Uyemura & Co., Ltd.
- Takuya Komeda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PHOTODEFINED APERTURE PLATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240344226
- Publication date Oct 17, 2024
- Stamford Devices Limited
- Hong XU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240341039
- Publication date Oct 10, 2024
- Resonac Corporation
- Kei TOGASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR COARSENING COPPER CRYSTAL GRAINS IN OBJECTS TO BE PLATED...
- Publication number 20240337039
- Publication date Oct 10, 2024
- JCU CORPORATION
- Masahiro SAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
QUANTITATION OF UNSTABLE REACTION PRODUCT OR BREAKDOWN PRODUCT WITH...
- Publication number 20240337628
- Publication date Oct 10, 2024
- ECI Technology, Inc.
- Jake Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM
- Publication number 20240328023
- Publication date Oct 3, 2024
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DURABLE POROUS STRUCTURES AND ELECTRONICS DEVICES INCORPORATING THE...
- Publication number 20240328024
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sujan Dewanjee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITIONS AND METHODS FOR THE ELETRODEPOSITION OF NANOTWINNED CO...
- Publication number 20240318342
- Publication date Sep 26, 2024
- MacDermid Enthone Inc.
- Jianwen Han
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF LIQUID MANAGEMENT IN ANODE CHAMBER AND APPARATUS FOR PLATING
- Publication number 20240318347
- Publication date Sep 26, 2024
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGHLY COMPACT METAL-CNT COMPOSITES AND MANUFACTURE THEREOF
- Publication number 20240309535
- Publication date Sep 19, 2024
- Luxembourg Institute of Science and Technology (LIST)
- Antoine DUHAIN
- C01 - INORGANIC CHEMISTRY
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE
- Publication number 20240304462
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POROUS METAL STRUCTURE FOR PRODUCING ETHANOL FROM CARBON DIOXIDE AN...
- Publication number 20240287690
- Publication date Aug 29, 2024
- Korea Advanced Institute of Science and Technology
- Hye Ryung BYON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING LAMINATE
- Publication number 20240279813
- Publication date Aug 22, 2024
- NATIONAL UNIVERSITY CORPORATION, IWATE UNIVERSITY
- Hidetoshi HIRAHARA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER ALLOY FILM WITH HIGH STRENGTH AND HIGH CONDUCTIVITY
- Publication number 20240279777
- Publication date Aug 22, 2024
- Apple Inc.
- Herng-Jeng Jou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION
- Publication number 20240279835
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING
- Publication number 20240271307
- Publication date Aug 15, 2024
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS METHOD FOR CONTROLLING GLOSSINESS OF ELECTROPLATED NICKEL-L...
- Publication number 20240263334
- Publication date Aug 8, 2024
- Luxshare Precision Industry(Chuzhou), Ltd.
- Weihua SHAO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT
- Publication number 20240254646
- Publication date Aug 1, 2024
- SUZHOU MAXWELL TECHNOLOGIES CO., LTD.
- Cao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE/COPPER COMPOSITE DEFORMED COPPER-CHROMIUM-ZIRCONIUM ALLOY...
- Publication number 20240254593
- Publication date Aug 1, 2024
- CHANGZHOU UNIVERSITY
- Wei WEI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POLYMER, LEVELING AGENT AND PREPARATION METHOD THEREOF, ELECTROPLAT...
- Publication number 20240254277
- Publication date Aug 1, 2024
- Huawei Technologies Co., Ltd
- Li ZHENG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LOW TEMPERATURE HYBRID BONDING METALLIZATION
- Publication number 20240254645
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Jing Xu
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Articles including surface coatings and methods to produce them

Copper foil having excellent heat resistance property

Metal foil with carrier and preparation method thereof

Photosensitive resin composition, method for forming resist pattern...

Method of controlling chemical concentration in electrolyte

Carrier foil-attached metal foil, method of manufacturing the same,...

Low-roughness surface-treated copper foil with low bending deformat...

Composition for copper bump electrodeposition comprising a polyamin...

Hermetic metallized via with improved reliability

Gas-solid separation structure, feeding device and electrochemical...

Layered product

Acid mist suppression in copper electrowinning

Graphene/copper composite deformed copper-chromium-zirconium alloy...

Electrolytic copper foil and method for producing same

Apparatus and methods for determining horizontal position of substr...

Electroplating with a polycarboxylate ether supressor

Acidic aqueous composition for electrolytic copper plating

Plating for thermal management

Manufacturing sequences for high density interconnect printed circu...

Method for manufacturing printed wiring board

Acidic aqueous composition for electrolytically depositing a copper...

Method and process for creating high-performance coax sockets

Reactor for electrochemical deposition

Method for manufacturing LCP-based flexible copper-clad plate, and...

Copper electrofill on non-copper liner layers

Method for producing a threaded nut of a threaded drive, in particu...

Method for improving mechanical properties by changing gradient nan...

Copper alloy film with high strength and high conductivity

Mask and method of manufacturing the same, and mask assembly

Structure including copper plating layer or copper alloy plating layer

Patents Applicationslast 30 patents

ELECTROCHEMICAL CARBON OXIDES REDUCTION TO ETHYLENE

ULTRATHIN COPPER FOIL, A METHOD FOR MANUFACTURING THE SAME, AND AN...

COMPOSITE CARBON NANOTUBE STRUCTURES

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HO...

ACID MIST SUPPRESSION IN COPPER ELECTROWINNING

APPARATUSES AND SYSTEMS FOR ELECTROPLATING

METHOD AND SYSTEM FOR REGENERATING ELECTROLYTIC COPPER PLATING SOLU...

CATHODE ELECTRODE, AND COMPOSITE OF CATHODE ELECTRODE AND SUBSTRATE

METHOD OF PRODUCING PLATING DEPOSIT

PHOTODEFINED APERTURE PLATE AND METHOD FOR PRODUCING THE SAME

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

METHOD FOR COARSENING COPPER CRYSTAL GRAINS IN OBJECTS TO BE PLATED...

QUANTITATION OF UNSTABLE REACTION PRODUCT OR BREAKDOWN PRODUCT WITH...

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM

DURABLE POROUS STRUCTURES AND ELECTRONICS DEVICES INCORPORATING THE...

COMPOSITIONS AND METHODS FOR THE ELETRODEPOSITION OF NANOTWINNED CO...

METHOD OF LIQUID MANAGEMENT IN ANODE CHAMBER AND APPARATUS FOR PLATING

HIGHLY COMPACT METAL-CNT COMPOSITES AND MANUFACTURE THEREOF

METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE

POROUS METAL STRUCTURE FOR PRODUCING ETHANOL FROM CARBON DIOXIDE AN...

METHOD FOR MANUFACTURING LAMINATE

COPPER ALLOY FILM WITH HIGH STRENGTH AND HIGH CONDUCTIVITY

NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION

COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING

PROCESS METHOD FOR CONTROLLING GLOSSINESS OF ELECTROPLATED NICKEL-L...

MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

GRAPHENE/COPPER COMPOSITE DEFORMED COPPER-CHROMIUM-ZIRCONIUM ALLOY...

POLYMER, LEVELING AGENT AND PREPARATION METHOD THEREOF, ELECTROPLAT...

LOW TEMPERATURE HYBRID BONDING METALLIZATION