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C25D3/38

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D3/00Electroplating: Baths therefor

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C25D3/38of copper

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer shielding for prevention of lipseal plate-out
- Patent number 12,241,173
- Issue date Mar 4, 2025
- Lam Research Corporation
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and methods for determining horizontal position of substr...
- Patent number 12,237,220
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolytic copper foil capable of preventing tearing or wrinkle d...
- Patent number 12,227,868
- Issue date Feb 18, 2025
- SK NEXILIS CO., LTD.
- Young Tae Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing copper sulfate electrolyte
- Patent number 12,221,716
- Issue date Feb 11, 2025
- KOREA ZINC CO., LTD.
- Je Joong Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 12,221,714
- Issue date Feb 11, 2025
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing an electrolytic copper foil
- Patent number 12,199,234
- Issue date Jan 14, 2025
- Nan Ya Plastics Corporation
- Chia-Ling Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lithium ion secondary battery
- Patent number 12,199,235
- Issue date Jan 14, 2025
- Nan Ya Plastics Corporation
- Chia-Ling Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal air filter
- Patent number 12,194,476
- Issue date Jan 14, 2025
- Korea Advanced Institute of Science and Technology
- San Ha Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition systems with enhanced crystallization pr...
- Patent number 12,195,867
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical carbon oxides reduction to ethylene
- Patent number 12,188,138
- Issue date Jan 7, 2025
- TOTALENERGIES ONETECH
- Moritz Wilhelm Schreiber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Probe sheet with contact tip on stacked multi-layer and method of m...
- Patent number 12,181,494
- Issue date Dec 31, 2024
- PROTEC MEMS TECHNOLOGY INC
- Yong Ho Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Articles including surface coatings and methods to produce them
- Patent number 12,173,166
- Issue date Dec 24, 2024
- Maxterial, Inc.
- Atieh Haghdoost
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper foil having excellent heat resistance property
- Patent number 12,170,375
- Issue date Dec 17, 2024
- Chang Chun Petrochemical Co., Ltd.
- Yao-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal foil with carrier and preparation method thereof
- Patent number 12,167,533
- Issue date Dec 10, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photosensitive resin composition, method for forming resist pattern...
- Patent number 12,158,700
- Issue date Dec 3, 2024
- JSR Corporation
- Hirokazu Sakakibara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Carrier foil-attached metal foil, method of manufacturing the same,...
- Patent number 12,139,811
- Issue date Nov 12, 2024
- YMT CO., LTD.
- Hyun Woo Jeon
- B32 - LAYERED PRODUCTS
Information Patent Grant
Low-roughness surface-treated copper foil with low bending deformat...
- Patent number 12,144,124
- Issue date Nov 12, 2024
- Lotte Energy Materials Corporation
- Chang Yol Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for copper bump electrodeposition comprising a polyamin...
- Patent number 12,134,834
- Issue date Nov 5, 2024
- BASF SE
- Marco Arnold
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas-solid separation structure, feeding device and electrochemical...
- Patent number 12,121,873
- Issue date Oct 22, 2024
- BOE Technology Group Co., Ltd.
- Shaodong Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Layered product
- Patent number 12,115,754
- Issue date Oct 15, 2024
- DIC Corporation
- Takamichi Aoki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Acid mist suppression in copper electrowinning
- Patent number 12,098,474
- Issue date Sep 24, 2024
- Freeport Minerals Corporation
- Scot Philip Sandoval
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Graphene/copper composite deformed copper-chromium-zirconium alloy...
- Patent number 12,098,452
- Issue date Sep 24, 2024
- CHANGZHOU UNIVERSITY
- Wei Wei
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrolytic copper foil and method for producing same
- Patent number 12,091,766
- Issue date Sep 17, 2024
- NIPPON DENKAI, LTD.
- Toshio Kawasaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and methods for determining horizontal position of substr...
- Patent number 12,087,625
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating with a polycarboxylate ether supressor
- Patent number 12,071,700
- Issue date Aug 27, 2024
- BASF SE
- Tobias Urban
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 12,071,702
- Issue date Aug 27, 2024
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
CLADS HAVING POLYMER FILMS AND METAL LAYERS
- Publication number 20250109265
- Publication date Apr 3, 2025
- DUPONT ELECTRONICS, INC.
- ROSA IRENE GONZALEZ
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEPOSITION MASK AND METHOD OF FABRICATING THE SAME
- Publication number 20250101626
- Publication date Mar 27, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jeong Kuk KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...
- Publication number 20250092559
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD OF ROUGHENED COPPER FOIL
- Publication number 20250092555
- Publication date Mar 20, 2025
- NAN YA PLASTICS CORPORATION
- Te-Chao Liao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GEOTHERMALLY POWERED HYDROMETALLURGICAL COPPER PRODUCTION
- Publication number 20250066874
- Publication date Feb 27, 2025
- EnhancedGEO Holdings, LLC
- Greg Lindberg
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...
- Publication number 20250051949
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrochemical Layer Deposition by Anode Array Using Measurement I...
- Publication number 20250043453
- Publication date Feb 6, 2025
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MASKING MEMBER AND FILM FORMING APPARATUS FOR METAL FILM USING SAME
- Publication number 20250034743
- Publication date Jan 30, 2025
- Toyota Jidosha Kabushiki Kaisha
- Haruki KONDOH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONTROLLING PROPERTIES OF ELECTROLYTIC COPPER FOIL AND MA...
- Publication number 20250019852
- Publication date Jan 16, 2025
- KZAM Corporation
- Jeong Hwan KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACIDIC ELECTROLYTIC COPPER PLATING LIQUID, METHOD FOR FORMING PREFO...
- Publication number 20250003102
- Publication date Jan 2, 2025
- MITSUBISHI MATERIALS CORPORATION
- Junta Inoue
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL CARBON OXIDES REDUCTION TO ETHYLENE
- Publication number 20240417863
- Publication date Dec 19, 2024
- TOTALENERGIES ONETECH
- Moritz Wilhelm SCHREIBER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRATHIN COPPER FOIL, A METHOD FOR MANUFACTURING THE SAME, AND AN...
- Publication number 20240417877
- Publication date Dec 19, 2024
- DUPONT ELECTRONICS, INC.
- LIN SHIH-CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE CARBON NANOTUBE STRUCTURES
- Publication number 20240410075
- Publication date Dec 12, 2024
- University of Dayton Research Institute
- Paul Kladitis
- B82 - NANO-TECHNOLOGY
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HO...
- Publication number 20240407091
- Publication date Dec 5, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACID MIST SUPPRESSION IN COPPER ELECTROWINNING
- Publication number 20240392459
- Publication date Nov 28, 2024
- Freeport Minerals Corporation
- Scot Philip Sandoval
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUSES AND SYSTEMS FOR ELECTROPLATING
- Publication number 20240363406
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND SYSTEM FOR REGENERATING ELECTROLYTIC COPPER PLATING SOLU...
- Publication number 20240360586
- Publication date Oct 31, 2024
- C. Uyemura & Co., Ltd.
- Takuya OKAMACHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CATHODE ELECTRODE, AND COMPOSITE OF CATHODE ELECTRODE AND SUBSTRATE
- Publication number 20240360577
- Publication date Oct 31, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Takahiro YAMAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PRODUCING PLATING DEPOSIT
- Publication number 20240351943
- Publication date Oct 24, 2024
- C. Uyemura & Co., Ltd.
- Takuya Komeda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PHOTODEFINED APERTURE PLATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240344226
- Publication date Oct 17, 2024
- Stamford Devices Limited
- Hong XU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240341039
- Publication date Oct 10, 2024
- Resonac Corporation
- Kei TOGASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR COARSENING COPPER CRYSTAL GRAINS IN OBJECTS TO BE PLATED...
- Publication number 20240337039
- Publication date Oct 10, 2024
- JCU CORPORATION
- Masahiro SAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
QUANTITATION OF UNSTABLE REACTION PRODUCT OR BREAKDOWN PRODUCT WITH...
- Publication number 20240337628
- Publication date Oct 10, 2024
- ECI Technology, Inc.
- Jake Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM
- Publication number 20240328023
- Publication date Oct 3, 2024
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DURABLE POROUS STRUCTURES AND ELECTRONICS DEVICES INCORPORATING THE...
- Publication number 20240328024
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sujan Dewanjee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITIONS AND METHODS FOR THE ELETRODEPOSITION OF NANOTWINNED CO...
- Publication number 20240318342
- Publication date Sep 26, 2024
- MacDermid Enthone Inc.
- Jianwen Han
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF LIQUID MANAGEMENT IN ANODE CHAMBER AND APPARATUS FOR PLATING
- Publication number 20240318347
- Publication date Sep 26, 2024
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGHLY COMPACT METAL-CNT COMPOSITES AND MANUFACTURE THEREOF
- Publication number 20240309535
- Publication date Sep 19, 2024
- Luxembourg Institute of Science and Technology (LIST)
- Antoine DUHAIN
- C01 - INORGANIC CHEMISTRY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of preparing a high density interconnect printed circuit boa...

Wafer shielding for prevention of lipseal plate-out

Apparatus and methods for determining horizontal position of substr...

Electrolytic copper foil capable of preventing tearing or wrinkle d...

Printed circuit board and method of fabricating the same

Method of manufacturing copper sulfate electrolyte

Plating method and plating apparatus

Method for producing an electrolytic copper foil

Lithium ion secondary battery

Metal air filter

Electrochemical deposition systems with enhanced crystallization pr...

Electrochemical carbon oxides reduction to ethylene

Probe sheet with contact tip on stacked multi-layer and method of m...

Articles including surface coatings and methods to produce them

Copper foil having excellent heat resistance property

Metal foil with carrier and preparation method thereof

Photosensitive resin composition, method for forming resist pattern...

Method of controlling chemical concentration in electrolyte

Carrier foil-attached metal foil, method of manufacturing the same,...

Low-roughness surface-treated copper foil with low bending deformat...

Composition for copper bump electrodeposition comprising a polyamin...

Hermetic metallized via with improved reliability

Gas-solid separation structure, feeding device and electrochemical...

Layered product

Acid mist suppression in copper electrowinning

Graphene/copper composite deformed copper-chromium-zirconium alloy...

Electrolytic copper foil and method for producing same

Apparatus and methods for determining horizontal position of substr...

Electroplating with a polycarboxylate ether supressor

Acidic aqueous composition for electrolytic copper plating

Patents Applicationslast 30 patents

CLADS HAVING POLYMER FILMS AND METAL LAYERS

DEPOSITION MASK AND METHOD OF FABRICATING THE SAME

ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...

MANUFACTURING METHOD OF ROUGHENED COPPER FOIL

GEOTHERMALLY POWERED HYDROMETALLURGICAL COPPER PRODUCTION

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...

Electrochemical Layer Deposition by Anode Array Using Measurement I...

MASKING MEMBER AND FILM FORMING APPARATUS FOR METAL FILM USING SAME

METHOD OF CONTROLLING PROPERTIES OF ELECTROLYTIC COPPER FOIL AND MA...

ACIDIC ELECTROLYTIC COPPER PLATING LIQUID, METHOD FOR FORMING PREFO...

ELECTROCHEMICAL CARBON OXIDES REDUCTION TO ETHYLENE

ULTRATHIN COPPER FOIL, A METHOD FOR MANUFACTURING THE SAME, AND AN...

COMPOSITE CARBON NANOTUBE STRUCTURES

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HO...

ACID MIST SUPPRESSION IN COPPER ELECTROWINNING

APPARATUSES AND SYSTEMS FOR ELECTROPLATING

METHOD AND SYSTEM FOR REGENERATING ELECTROLYTIC COPPER PLATING SOLU...

CATHODE ELECTRODE, AND COMPOSITE OF CATHODE ELECTRODE AND SUBSTRATE

METHOD OF PRODUCING PLATING DEPOSIT

PHOTODEFINED APERTURE PLATE AND METHOD FOR PRODUCING THE SAME

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

METHOD FOR COARSENING COPPER CRYSTAL GRAINS IN OBJECTS TO BE PLATED...

QUANTITATION OF UNSTABLE REACTION PRODUCT OR BREAKDOWN PRODUCT WITH...

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM

DURABLE POROUS STRUCTURES AND ELECTRONICS DEVICES INCORPORATING THE...

COMPOSITIONS AND METHODS FOR THE ELETRODEPOSITION OF NANOTWINNED CO...

METHOD OF LIQUID MANAGEMENT IN ANODE CHAMBER AND APPARATUS FOR PLATING

HIGHLY COMPACT METAL-CNT COMPOSITES AND MANUFACTURE THEREOF