of copper

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CPC
C25D3/38

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D3/00Electroplating: Baths therefor

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C25D3/38of copper

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Highly compact metal-CNT composites and manufacture thereof
- Patent number 12,366,005
- Issue date Jul 22, 2025
- LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST)
- Antoine Duhain
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Copper clad laminate film and electronic device including same
- Patent number 12,359,320
- Issue date Jul 15, 2025
- Toray Advanced Materials Korea Inc.
- Jong Yong Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electroplating bath
- Patent number 12,359,332
- Issue date Jul 15, 2025
- Atotech Deutschland GmbH & Co. KG
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposition apparatus to prepare a multilayer copper foil
- Patent number 12,351,928
- Issue date Jul 8, 2025
- Dong-A University Research Foundation for Industry-Academy Cooperation
- Hyo Jong Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing method and apparatus for electronic component
- Patent number 12,351,934
- Issue date Jul 8, 2025
- SUZHOU MAXWELL TECHNOLOGIES CO., LTD.
- Cao Yu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayered nonpolar, chromium, copper material coatings of power...
- Patent number 12,342,449
- Issue date Jun 24, 2025
- The Board of Trustees of the University of Illinois
- Tarek Gebrael
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolytic copper foil and preparation method therefor, negative...
- Patent number 12,327,862
- Issue date Jun 10, 2025
- CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED
- Yukun Wu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Complex waveform for electrolytic plating
- Patent number 12,325,927
- Issue date Jun 10, 2025
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 12,320,028
- Issue date Jun 3, 2025
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Neutral pH copper plating solution for undercut reduction
- Patent number 12,312,703
- Issue date May 27, 2025
- Texas Instruments Incorporated
- Nazila Dadvand
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High density coil design and process
- Patent number 12,308,157
- Issue date May 20, 2025
- Hutchinson Technology Incorporated
- John L. Schumann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
TSV process window and fill performance enhancement by long pulsing...
- Patent number 12,305,307
- Issue date May 20, 2025
- Lam Research Corporation
- Jae Shin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite metal foil
- Patent number 12,305,309
- Issue date May 20, 2025
- Industrial Technology Research Institute
- Chiu-Yen Chiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrochemical methods, devices and compositions
- Patent number 12,286,720
- Issue date Apr 29, 2025
- Iontra Inc
- Daniel A. Konopka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,289,838
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Yasuki Kimishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electroplating nanograined copper
- Patent number 12,281,403
- Issue date Apr 22, 2025
- UMICORE SUZHOU SEMICONDUCTOR MATERIALS CO., LTD.
- Yun Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process method for controlling glossiness of electroplated nickel-l...
- Patent number 12,276,038
- Issue date Apr 15, 2025
- Luxshare Precision Industry(Chuzhou), Ltd.
- Weihua Shao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer shielding for prevention of lipseal plate-out
- Patent number 12,241,173
- Issue date Mar 4, 2025
- Lam Research Corporation
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and methods for determining horizontal position of substr...
- Patent number 12,237,220
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolytic copper foil capable of preventing tearing or wrinkle d...
- Patent number 12,227,868
- Issue date Feb 18, 2025
- SK NEXILIS CO., LTD.
- Young Tae Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing copper sulfate electrolyte
- Patent number 12,221,716
- Issue date Feb 11, 2025
- KOREA ZINC CO., LTD.
- Je Joong Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 12,221,714
- Issue date Feb 11, 2025
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing an electrolytic copper foil
- Patent number 12,199,234
- Issue date Jan 14, 2025
- Nan Ya Plastics Corporation
- Chia-Ling Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lithium ion secondary battery
- Patent number 12,199,235
- Issue date Jan 14, 2025
- Nan Ya Plastics Corporation
- Chia-Ling Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal air filter
- Patent number 12,194,476
- Issue date Jan 14, 2025
- Korea Advanced Institute of Science and Technology
- San Ha Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition systems with enhanced crystallization pr...
- Patent number 12,195,867
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical carbon oxides reduction to ethylene
- Patent number 12,188,138
- Issue date Jan 7, 2025
- TOTALENERGIES ONETECH
- Moritz Wilhelm Schreiber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
TWIN CRYSTAL COPPER MATERIAL AND HYBRID BONDING STRUCTURE
- Publication number 20250236981
- Publication date Jul 24, 2025
- SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES
- Zhi-Quan LIU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING COMPOSITE METAL FOIL
- Publication number 20250230569
- Publication date Jul 17, 2025
- Industrial Technology Research Institute
- Chiu-Yen Chiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cosmetic zinc alloy massage head formula and preparation technology...
- Publication number 20250230525
- Publication date Jul 17, 2025
- Guangzhou Candear Packing Products Co., LTD
- Guoxiang Cai
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PLATING ADDITIVE COMPOSITIONS, COPPER PLATING SOLUTIONS, AND...
- Publication number 20250223717
- Publication date Jul 10, 2025
- JIANGYIN NANOPORE INNOVATIVE MATERIALS TECHNOLOGY LTD
- Guochun LIU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL, ELECTRODE COMPRISING THE SAME, SECONDARY BATTERY COMPR...
- Publication number 20250215594
- Publication date Jul 3, 2025
- SK NEXILIS CO., LTD.
- Shan Hua JIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER PLATING SOLUTION FOR PR PULSE ELECTROLYSIS AND COPPER PLATIN...
- Publication number 20250215597
- Publication date Jul 3, 2025
- OKUNO CHEMICAL INDUSTRIES CO., LTD.
- Ryota Naka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL, ELECTRODE COMPRISING THE SAME, SECONDARY BATTERY COMPR...
- Publication number 20250219098
- Publication date Jul 3, 2025
- SK NEXILIS CO., LTD.
- Shan Hua JIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELING AGENT, COMPOSITION, AND APPLICATION THEREOF
- Publication number 20250215598
- Publication date Jul 3, 2025
- Huawei Technologies Co., Ltd
- Xinyu Liu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL, ELECTRODE COMPRISING THE SAME, SECONDARY BATTERY COMPR...
- Publication number 20250215595
- Publication date Jul 3, 2025
- SK NEXILIS CO., LTD.
- Shan Hua JIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION AND APPLICATION THEREOF, AND LEVELING AGENT AND PREPARA...
- Publication number 20250198036
- Publication date Jun 19, 2025
- Huawei Technologies Co., Ltd
- Li ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN PRODUCT
- Publication number 20250188265
- Publication date Jun 12, 2025
- Toyoda Gosei Co., Ltd.
- Kenjiro MORIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SOLUTION CONTAINING SULFONIO GROUP-CONTAINING ETHER COMPOUND
- Publication number 20250179676
- Publication date Jun 5, 2025
- JCU CORPORATION
- Kazuki KISHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER-GRAPHENE MULTILAYER COMPOSITE COATED COPPER FOIL FOR ANODE C...
- Publication number 20250183321
- Publication date Jun 5, 2025
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Yi Liu
- B60 - VEHICLES IN GENERAL
Information Patent Application
EASILY CRUSHABLE ELECTRODEPOSITED COPPER
- Publication number 20250154677
- Publication date May 15, 2025
- JX ADVANCED METALS CORPORATION
- Ayaka FUKUNARI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS
- Publication number 20250146159
- Publication date May 8, 2025
- STMicroelectronics International N.V.
- Paolo CREMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLEXIBLE COPPER CLAD LAMINATE
- Publication number 20250146135
- Publication date May 8, 2025
- POMIRAN METALIZATION RESEARCH CO., LTD.
- CHUNG-YI CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER-ATTACHED ULTRA-THIN COPPER FOIL AND METHOD FOR PRODUCING TH...
- Publication number 20250137155
- Publication date May 1, 2025
- Nan Ya Plastics Corporation
- Te-Chao LIAO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTE COMPRISING AN ACCELERATOR AGENT FOR BOTTOM-UP COPPER EL...
- Publication number 20250137157
- Publication date May 1, 2025
- MacDermid Enthone Inc.
- Hermine Marie BERTHON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COPPER ELECTRODEPOSITION COMPRISING A POLYAMINOAMID...
- Publication number 20250129503
- Publication date Apr 24, 2025
- BASF SE
- Marco ARNOLD
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL WITH HIGH ELONGATION RATE AND METHOD OF MANUFACTURING SAME
- Publication number 20250129501
- Publication date Apr 24, 2025
- DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY ACADEMY COOPERATION
- Hyo Jong LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Glow In The Dark Blanket And Flat Screen Printing Method
- Publication number 20250127315
- Publication date Apr 24, 2025
- Carrie Knapp
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...
- Publication number 20250125151
- Publication date Apr 17, 2025
- Louis Caillard
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Anode Array and Controller for Electrochemical Layer Deposition
- Publication number 20250122638
- Publication date Apr 17, 2025
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ULTRA-MICRO ELECTRODE FOR ELECTROCHEMICAL ANALYSIS AND METHOD OF MA...
- Publication number 20250125072
- Publication date Apr 17, 2025
- DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY ACADEMY COOPERATION
- Hyo Jong LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CLADS HAVING POLYMER FILMS AND METAL LAYERS
- Publication number 20250109265
- Publication date Apr 3, 2025
- DUPONT ELECTRONICS, INC.
- ROSA IRENE GONZALEZ
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEPOSITION MASK AND METHOD OF FABRICATING THE SAME
- Publication number 20250101626
- Publication date Mar 27, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jeong Kuk KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...
- Publication number 20250092559
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD OF ROUGHENED COPPER FOIL
- Publication number 20250092555
- Publication date Mar 20, 2025
- NAN YA PLASTICS CORPORATION
- Te-Chao Liao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GEOTHERMALLY POWERED HYDROMETALLURGICAL COPPER PRODUCTION
- Publication number 20250066874
- Publication date Feb 27, 2025
- EnhancedGEO Holdings, LLC
- Greg Lindberg
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Highly compact metal-CNT composites and manufacture thereof

Copper clad laminate film and electronic device including same

Copper electroplating bath

Electrodeposition apparatus to prepare a multilayer copper foil

Manufacturing method and apparatus for electronic component

Multilayered nonpolar, chromium, copper material coatings of power...

Electrolytic copper foil and preparation method therefor, negative...

Complex waveform for electrolytic plating

Electrochemical three-dimensional printing and soldering

Neutral pH copper plating solution for undercut reduction

High density coil design and process

TSV process window and fill performance enhancement by long pulsing...

Composite metal foil

Conductive structure including copper-phosphorous alloy and a metho...

Electrochemical methods, devices and compositions

Wiring substrate and method for manufacturing wiring substrate

Method for electroplating nanograined copper

Process method for controlling glossiness of electroplated nickel-l...

Method of preparing a high density interconnect printed circuit boa...

Wafer shielding for prevention of lipseal plate-out

Apparatus and methods for determining horizontal position of substr...

Electrolytic copper foil capable of preventing tearing or wrinkle d...

Printed circuit board and method of fabricating the same

Method of manufacturing copper sulfate electrolyte

Plating method and plating apparatus

Method for producing an electrolytic copper foil

Lithium ion secondary battery

Metal air filter

Electrochemical deposition systems with enhanced crystallization pr...

Electrochemical carbon oxides reduction to ethylene

Patents Applicationslast 30 patents

TWIN CRYSTAL COPPER MATERIAL AND HYBRID BONDING STRUCTURE

METHOD OF MANUFACTURING COMPOSITE METAL FOIL

Cosmetic zinc alloy massage head formula and preparation technology...

COPPER PLATING ADDITIVE COMPOSITIONS, COPPER PLATING SOLUTIONS, AND...

COPPER FOIL, ELECTRODE COMPRISING THE SAME, SECONDARY BATTERY COMPR...

COPPER PLATING SOLUTION FOR PR PULSE ELECTROLYSIS AND COPPER PLATIN...

COPPER FOIL, ELECTRODE COMPRISING THE SAME, SECONDARY BATTERY COMPR...

LEVELING AGENT, COMPOSITION, AND APPLICATION THEREOF

COPPER FOIL, ELECTRODE COMPRISING THE SAME, SECONDARY BATTERY COMPR...

COMPOSITION AND APPLICATION THEREOF, AND LEVELING AGENT AND PREPARA...

RESIN PRODUCT

PLATING SOLUTION CONTAINING SULFONIO GROUP-CONTAINING ETHER COMPOUND

COPPER-GRAPHENE MULTILAYER COMPOSITE COATED COPPER FOIL FOR ANODE C...

EASILY CRUSHABLE ELECTRODEPOSITED COPPER

METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS

FLEXIBLE COPPER CLAD LAMINATE

CARRIER-ATTACHED ULTRA-THIN COPPER FOIL AND METHOD FOR PRODUCING TH...

ELECTROLYTE COMPRISING AN ACCELERATOR AGENT FOR BOTTOM-UP COPPER EL...

COMPOSITION FOR COPPER ELECTRODEPOSITION COMPRISING A POLYAMINOAMID...

COPPER FOIL WITH HIGH ELONGATION RATE AND METHOD OF MANUFACTURING SAME

Glow In The Dark Blanket And Flat Screen Printing Method

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...

Anode Array and Controller for Electrochemical Layer Deposition

ULTRA-MICRO ELECTRODE FOR ELECTROCHEMICAL ANALYSIS AND METHOD OF MA...

CLADS HAVING POLYMER FILMS AND METAL LAYERS

DEPOSITION MASK AND METHOD OF FABRICATING THE SAME

ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...

MANUFACTURING METHOD OF ROUGHENED COPPER FOIL

GEOTHERMALLY POWERED HYDROMETALLURGICAL COPPER PRODUCTION

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...