of non-metallic inorganic material

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CPC
B24B9/06

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BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs Accessories therefor

Current Industry

B24B9/06of non-metallic inorganic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Angle polishing systems and methods for multi-ferrule optical conne...
- Patent number 12,265,267
- Issue date Apr 1, 2025
- Legrand DPC, LLC
- Daniel M. Smith
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for processing silicon wafers
- Patent number 12,226,873
- Issue date Feb 18, 2025
- Siltronic Corporation
- Andrei Istratov
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of helical chamfer machining silicon wafer
- Patent number 12,191,152
- Issue date Jan 7, 2025
- Sumco Corporation
- Kentarou Ishida
- B24 - GRINDING POLISHING
Information Patent Grant
Chamfer formation on data storage disc substrates
- Patent number 12,159,658
- Issue date Dec 3, 2024
- Seagate Technology, LLC
- Sideq Bin Salleh
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing device
- Patent number 12,138,743
- Issue date Nov 12, 2024
- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD.
- Yong Kang
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing semiconductor device and apparatus for man...
- Patent number 12,068,165
- Issue date Aug 20, 2024
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning module, substrate processing apparatus including cleaning...
- Patent number 12,033,847
- Issue date Jul 9, 2024
- Ebara Corporation
- Toshio Mizuno
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus
- Patent number 12,020,946
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ld.
- Yu-Ping Tseng
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer grinding wheel
- Patent number 11,931,861
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Seong Gi Jeon
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Processing method and processing device for ceramic honeycomb struc...
- Patent number 11,919,128
- Issue date Mar 5, 2024
- NGK Insulators, Ltd.
- Toshihiro Fukui
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,911,872
- Issue date Feb 27, 2024
- Ebara Corporation
- Nobuyuki Takada
- B24 - GRINDING POLISHING
Information Patent Grant
Rectangular substrate for imprint lithography and making method
- Patent number 11,904,521
- Issue date Feb 20, 2024
- Shin-Etsu Chemical Co., Ltd.
- Daiyu Okafuji
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, polishing head, and substrate proce...
- Patent number 11,787,006
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Toshimitsu Igata
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for manufacturing semiconductor device
- Patent number 11,735,411
- Issue date Aug 22, 2023
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,667,008
- Issue date Jun 6, 2023
- Ebara Corporation
- Hokuto Yamanobe
- B24 - GRINDING POLISHING
Information Patent Grant
Modular apparatus and method for machining flat sheets
- Patent number 11,565,362
- Issue date Jan 31, 2023
- Elettromeccanica Bovone S.r.l.
- Vittorio Bovone
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer edge polishing apparatus and method
- Patent number 11,559,869
- Issue date Jan 24, 2023
- Sumco Corporation
- Makoto Ando
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing silicon wafer including notch polishing process...
- Patent number 11,551,922
- Issue date Jan 10, 2023
- Sumco Corporation
- Tsuyoshi Morita
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 11,511,386
- Issue date Nov 29, 2022
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Method for evaluating edge shape of silicon wafer, apparatus for ev...
- Patent number 11,486,833
- Issue date Nov 1, 2022
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Sakurada
- B24 - GRINDING POLISHING
Information Patent Grant
Method for preparing silicon carbide wafer and silicon carbide wafer
- Patent number 11,474,012
- Issue date Oct 18, 2022
- SENIC INC.
- Jong Hwi Park
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Chemical mechanical polishing apparatus for polishing workpiece
- Patent number 11,446,784
- Issue date Sep 20, 2022
- Ebara Corporation
- Yu Ishii
- B24 - GRINDING POLISHING
Information Patent Grant
Angle polishing systems and methods for multi-ferrule optical conne...
- Patent number 11,448,833
- Issue date Sep 20, 2022
- Ortronics, Inc.
- Daniel M. Smith
- B24 - GRINDING POLISHING
Information Patent Grant
Granite polishing machine
- Patent number 11,413,721
- Issue date Aug 16, 2022
- Silvano Altamirano
- B24 - GRINDING POLISHING
Information Patent Grant
Edge processing method for display panel having irregular edge and...
- Patent number 11,260,490
- Issue date Mar 1, 2022
- Xiamen Tianma Micro-Electronics Co., Ltd.
- Quanpeng Yu
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and control method
- Patent number 11,260,493
- Issue date Mar 1, 2022
- Ebara Corporation
- Minoru Harada
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,180,853
- Issue date Nov 23, 2021
- Ebara Corporation
- Yu Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for processing a surface of a substrate
- Patent number 11,139,160
- Issue date Oct 5, 2021
- Ebara Corporation
- Yu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamfered silicon carbide substrate and method of chamfering
- Patent number 11,041,254
- Issue date Jun 22, 2021
- SICRYSTAL GMBH
- Michael Vogel
- C30 - CRYSTAL GROWTH
Information Patent Grant
Abrasive rotary tool with abrasive agglomerates
- Patent number 11,040,429
- Issue date Jun 22, 2021
- 3M Innovative Properties Company
- Bruce A. Sventek
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
WORKPIECE PROCESSING METHOD AND PROCESSING APPARATUS
- Publication number 20250239443
- Publication date Jul 24, 2025
- Disco Corporation
- Kokichi MINATO
- B24 - GRINDING POLISHING
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20250222553
- Publication date Jul 10, 2025
- Disco Corporation
- Atsushi Komatsu
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD
- Publication number 20250178148
- Publication date Jun 5, 2025
- Disco Corporation
- Minoru MATSUZAWA
- B24 - GRINDING POLISHING
Information Patent Application
WORKPIECE EDGE GRINDING MACHINE AND METHOD
- Publication number 20250153300
- Publication date May 15, 2025
- Lapmaster International, LLC
- Robert Lewis Rhoades
- B24 - GRINDING POLISHING
Information Patent Application
CHAMFER FORMATION ON DATA STORAGE DISC SUBSTRATES
- Publication number 20250069625
- Publication date Feb 27, 2025
- SEAGATE TECHNOLOGY LLC
- Sideq Bin Salleh
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD AND APPARATUS FOR FORMING LEADING AND TRAILING EDGES ON AIRF...
- Publication number 20250001543
- Publication date Jan 2, 2025
- Raytheon Technologies Corporation
- William E. Meyst
- B24 - GRINDING POLISHING
Information Patent Application
CHUCK TABLE AND EDGE TRIMMING APPARATUS
- Publication number 20240429087
- Publication date Dec 26, 2024
- Disco Corporation
- Kokichi MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240416479
- Publication date Dec 19, 2024
- EBARA CORPORATION
- Kenji KODERA
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20240304455
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing, Ltd.
- Yu-Ping TSENG
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
- Publication number 20240165765
- Publication date May 23, 2024
- Shin-Etsu Handotai Co., Ltd.
- Ryo HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR FILM REMOVAL
- Publication number 20240051078
- Publication date Feb 15, 2024
- Essilor International
- Paul BUSSIERE
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF FORMING TRUER
- Publication number 20230415293
- Publication date Dec 28, 2023
- TOKYO SEIMITSU CO., LTD.
- Shinichi KISHISHITA
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD FOR PROCESSING SILICON WAFERS
- Publication number 20230339069
- Publication date Oct 26, 2023
- Siltronic Corporation
- Andrei Istratov
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DEVICE FOR POLISHING OUTER PERIPHERY OF WAFER
- Publication number 20230211449
- Publication date Jul 6, 2023
- SUMCO CORPORATION
- Kenji SATOMURA
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT...
- Publication number 20230047412
- Publication date Feb 16, 2023
- GLOBALWAFERS CO., LTD.
- Yung Hsing Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Angle Polishing Systems and Methods for Multi-Ferrule Optical Conne...
- Publication number 20220390687
- Publication date Dec 8, 2022
- Ortronics, Inc.
- Daniel M. Smith
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD
- Publication number 20220339754
- Publication date Oct 27, 2022
- Disco Corporation
- Naruto FUWA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR MAN...
- Publication number 20220293425
- Publication date Sep 15, 2022
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi YAMAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220234160
- Publication date Jul 28, 2022
- TOKYO ELECTRON LIMITED
- Yohei YAMAWAKI
- B24 - GRINDING POLISHING
Information Patent Application
EDGE TRIMMING METHOD
- Publication number 20220184768
- Publication date Jun 16, 2022
- Disco Corporation
- Takashi OKAMURA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210402562
- Publication date Dec 30, 2021
- EBARA CORPORATION
- Hokuto Yamanobe
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, POLISHING HEAD, AND SUBSTRATE PROCE...
- Publication number 20210362285
- Publication date Nov 25, 2021
- TOKYO ELECTRON LIMITED
- Toshimitsu IGATA
- B24 - GRINDING POLISHING
Information Patent Application
GRANITE POLISHING MACHINE
- Publication number 20210354264
- Publication date Nov 18, 2021
- Silvano Altamirano
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210237221
- Publication date Aug 5, 2021
- EBARA CORPORATION
- Nobuyuki TAKADA
- B24 - GRINDING POLISHING
Information Patent Application
Angle Polishing Systems and Methods for Multi-Ferrule Optical Conne...
- Publication number 20210149123
- Publication date May 20, 2021
- Ortronics, Inc.
- Daniel M. Smith
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PREPARING SILICON CARBIDE WAFER AND SILICON CARBIDE WAFER
- Publication number 20210123843
- Publication date Apr 29, 2021
- SKC CO., LTD.
- Jong Hwi PARK
- C30 - CRYSTAL GROWTH
Information Patent Application
POLISHING DEVICE
- Publication number 20210086323
- Publication date Mar 25, 2021
- Xi'an ESWIN Silicon Wafer Technology Co., Ltd.
- Yong KANG
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR EVALUATING EDGE SHAPE OF SILICON WAFER, APPARATUS FOR EV...
- Publication number 20200240929
- Publication date Jul 30, 2020
- Shin-Etsu Handotai Co., Ltd.
- Masahiro SAKURADA
- G01 - MEASURING TESTING
Information Patent Application
PROCESSING METHOD AND PROCESSING DEVICE FOR CERAMIC HONEYCOMB STRUC...
- Publication number 20200238470
- Publication date Jul 30, 2020
- NGK Insulators, Ltd.
- Toshihiro FUKUI
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
EDGE PROCESSING METHOD FOR DISPLAY PANEL AND DISPLAY PANEL
- Publication number 20200206863
- Publication date Jul 2, 2020
- Xiamen Tianma Micro-Electronics Co.,Ltd
- Quanpeng Yu
- B24 - GRINDING POLISHING

of non-metallic inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Angle polishing systems and methods for multi-ferrule optical conne...

System and method for processing silicon wafers

Method of helical chamfer machining silicon wafer

Chamfer formation on data storage disc substrates

Polishing device

Method for manufacturing semiconductor device and apparatus for man...

Cleaning module, substrate processing apparatus including cleaning...

Chemical mechanical polishing apparatus

Wafer grinding wheel

Processing method and processing device for ceramic honeycomb struc...

Substrate processing apparatus and substrate processing method

Rectangular substrate for imprint lithography and making method

Substrate processing apparatus, polishing head, and substrate proce...

Method and apparatus for manufacturing semiconductor device

Substrate processing apparatus and substrate processing method

Modular apparatus and method for machining flat sheets

Wafer edge polishing apparatus and method

Method of polishing silicon wafer including notch polishing process...

Polishing apparatus and polishing method

Method for evaluating edge shape of silicon wafer, apparatus for ev...

Method for preparing silicon carbide wafer and silicon carbide wafer

Chemical mechanical polishing apparatus for polishing workpiece

Angle polishing systems and methods for multi-ferrule optical conne...

Granite polishing machine

Edge processing method for display panel having irregular edge and...

Substrate processing apparatus and control method

Substrate processing apparatus and substrate processing method

Apparatus and method for processing a surface of a substrate

Chamfered silicon carbide substrate and method of chamfering

Abrasive rotary tool with abrasive agglomerates

Patents Applicationslast 30 patents

WORKPIECE PROCESSING METHOD AND PROCESSING APPARATUS

WORKPIECE PROCESSING METHOD

GRINDING METHOD

WORKPIECE EDGE GRINDING MACHINE AND METHOD

CHAMFER FORMATION ON DATA STORAGE DISC SUBSTRATES

METHOD AND APPARATUS FOR FORMING LEADING AND TRAILING EDGES ON AIRF...

CHUCK TABLE AND EDGE TRIMMING APPARATUS

POLISHING APPARATUS AND POLISHING METHOD

CHEMICAL MECHANICAL POLISHING APPARATUS

METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER

APPARATUS FOR FILM REMOVAL

METHOD OF FORMING TRUER

SYSTEM AND METHOD FOR PROCESSING SILICON WAFERS

DEVICE FOR POLISHING OUTER PERIPHERY OF WAFER

SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT...

Angle Polishing Systems and Methods for Multi-Ferrule Optical Conne...

POLISHING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR MAN...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

EDGE TRIMMING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS, POLISHING HEAD, AND SUBSTRATE PROCE...

GRANITE POLISHING MACHINE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Angle Polishing Systems and Methods for Multi-Ferrule Optical Conne...

METHOD FOR PREPARING SILICON CARBIDE WAFER AND SILICON CARBIDE WAFER

POLISHING DEVICE

METHOD FOR EVALUATING EDGE SHAPE OF SILICON WAFER, APPARATUS FOR EV...

PROCESSING METHOD AND PROCESSING DEVICE FOR CERAMIC HONEYCOMB STRUC...

EDGE PROCESSING METHOD FOR DISPLAY PANEL AND DISPLAY PANEL