of thin, brittle parts

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CPC
B24B9/065

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BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs Accessories therefor

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B24B9/065of thin, brittle parts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of helical chamfer machining silicon wafer
- Patent number 12,191,152
- Issue date Jan 7, 2025
- Sumco Corporation
- Kentarou Ishida
- B24 - GRINDING POLISHING
Information Patent Grant
Chamfer formation on data storage disc substrates
- Patent number 12,159,658
- Issue date Dec 3, 2024
- Seagate Technology, LLC
- Sideq Bin Salleh
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing device
- Patent number 12,138,743
- Issue date Nov 12, 2024
- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD.
- Yong Kang
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing semiconductor device and apparatus for man...
- Patent number 12,068,165
- Issue date Aug 20, 2024
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning module, substrate processing apparatus including cleaning...
- Patent number 12,033,847
- Issue date Jul 9, 2024
- Ebara Corporation
- Toshio Mizuno
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus
- Patent number 12,020,946
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ld.
- Yu-Ping Tseng
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer grinding wheel
- Patent number 11,931,861
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Seong Gi Jeon
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,911,872
- Issue date Feb 27, 2024
- Ebara Corporation
- Nobuyuki Takada
- B24 - GRINDING POLISHING
Information Patent Grant
Rectangular substrate for imprint lithography and making method
- Patent number 11,904,521
- Issue date Feb 20, 2024
- Shin-Etsu Chemical Co., Ltd.
- Daiyu Okafuji
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, polishing head, and substrate proce...
- Patent number 11,787,006
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Toshimitsu Igata
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for manufacturing semiconductor device
- Patent number 11,735,411
- Issue date Aug 22, 2023
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,667,008
- Issue date Jun 6, 2023
- Ebara Corporation
- Hokuto Yamanobe
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer edge polishing apparatus and method
- Patent number 11,559,869
- Issue date Jan 24, 2023
- Sumco Corporation
- Makoto Ando
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing silicon wafer including notch polishing process...
- Patent number 11,551,922
- Issue date Jan 10, 2023
- Sumco Corporation
- Tsuyoshi Morita
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 11,511,386
- Issue date Nov 29, 2022
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Method for evaluating edge shape of silicon wafer, apparatus for ev...
- Patent number 11,486,833
- Issue date Nov 1, 2022
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Sakurada
- B24 - GRINDING POLISHING
Information Patent Grant
Method for preparing silicon carbide wafer and silicon carbide wafer
- Patent number 11,474,012
- Issue date Oct 18, 2022
- SENIC INC.
- Jong Hwi Park
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Substrate processing apparatus and control method
- Patent number 11,260,493
- Issue date Mar 1, 2022
- Ebara Corporation
- Minoru Harada
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,180,853
- Issue date Nov 23, 2021
- Ebara Corporation
- Yu Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for processing a surface of a substrate
- Patent number 11,139,160
- Issue date Oct 5, 2021
- Ebara Corporation
- Yu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamfered silicon carbide substrate and method of chamfering
- Patent number 11,041,254
- Issue date Jun 22, 2021
- SICRYSTAL GMBH
- Michael Vogel
- C30 - CRYSTAL GROWTH
Information Patent Grant
Abrasive rotary tool with abrasive agglomerates
- Patent number 11,040,429
- Issue date Jun 22, 2021
- 3M Innovative Properties Company
- Bruce A. Sventek
- B24 - GRINDING POLISHING
Information Patent Grant
Method of producing silicon elements and integrated circuits
- Patent number 10,930,513
- Issue date Feb 23, 2021
- Unitool Consulting Co.
- Alex Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible abrasive rotary tool
- Patent number 10,906,156
- Issue date Feb 2, 2021
- 3M Innovative Properties Company
- Bruce A. Sventek
- B24 - GRINDING POLISHING
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 10,908,468
- Issue date Feb 2, 2021
- Samsung Display Co., Ltd.
- Chansol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide single crystal substrate and method for manufacturi...
- Patent number 10,872,759
- Issue date Dec 22, 2020
- Sumitomo Electric Industries, Ltd.
- Kyoko Okita
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method and apparatus for performing a polishing process in semicond...
- Patent number 10,857,649
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-I Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing method
- Patent number 10,854,462
- Issue date Dec 1, 2020
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
LED wafer processing method
- Patent number 10,843,381
- Issue date Nov 24, 2020
- Disco Corporation
- Makiko Ohmae
- B24 - GRINDING POLISHING
Information Patent Grant
Method for wafer trimming
- Patent number 10,818,500
- Issue date Oct 27, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Franck Fournel
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CHUCK TABLE AND EDGE TRIMMING APPARATUS
- Publication number 20240429087
- Publication date Dec 26, 2024
- Disco Corporation
- Kokichi MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240416479
- Publication date Dec 19, 2024
- EBARA CORPORATION
- Kenji KODERA
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20240304455
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing, Ltd.
- Yu-Ping TSENG
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
- Publication number 20240165765
- Publication date May 23, 2024
- Shin-Etsu Handotai Co., Ltd.
- Ryo HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR FILM REMOVAL
- Publication number 20240051078
- Publication date Feb 15, 2024
- Essilor International
- Paul BUSSIERE
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF FORMING TRUER
- Publication number 20230415293
- Publication date Dec 28, 2023
- TOKYO SEIMITSU CO., LTD.
- Shinichi KISHISHITA
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD FOR PROCESSING SILICON WAFERS
- Publication number 20230339069
- Publication date Oct 26, 2023
- Siltronic Corporation
- Andrei Istratov
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DEVICE FOR POLISHING OUTER PERIPHERY OF WAFER
- Publication number 20230211449
- Publication date Jul 6, 2023
- SUMCO CORPORATION
- Kenji SATOMURA
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT...
- Publication number 20230047412
- Publication date Feb 16, 2023
- GLOBALWAFERS CO., LTD.
- Yung Hsing Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING METHOD
- Publication number 20220339754
- Publication date Oct 27, 2022
- Disco Corporation
- Naruto FUWA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR MAN...
- Publication number 20220293425
- Publication date Sep 15, 2022
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi YAMAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220234160
- Publication date Jul 28, 2022
- TOKYO ELECTRON LIMITED
- Yohei YAMAWAKI
- B24 - GRINDING POLISHING
Information Patent Application
EDGE TRIMMING METHOD
- Publication number 20220184768
- Publication date Jun 16, 2022
- Disco Corporation
- Takashi OKAMURA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210402562
- Publication date Dec 30, 2021
- EBARA CORPORATION
- Hokuto Yamanobe
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, POLISHING HEAD, AND SUBSTRATE PROCE...
- Publication number 20210362285
- Publication date Nov 25, 2021
- TOKYO ELECTRON LIMITED
- Toshimitsu IGATA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210237221
- Publication date Aug 5, 2021
- EBARA CORPORATION
- Nobuyuki TAKADA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PREPARING SILICON CARBIDE WAFER AND SILICON CARBIDE WAFER
- Publication number 20210123843
- Publication date Apr 29, 2021
- SKC CO., LTD.
- Jong Hwi PARK
- C30 - CRYSTAL GROWTH
Information Patent Application
POLISHING DEVICE
- Publication number 20210086323
- Publication date Mar 25, 2021
- Xi'an ESWIN Silicon Wafer Technology Co., Ltd.
- Yong KANG
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR EVALUATING EDGE SHAPE OF SILICON WAFER, APPARATUS FOR EV...
- Publication number 20200240929
- Publication date Jul 30, 2020
- Shin-Etsu Handotai Co., Ltd.
- Masahiro SAKURADA
- G01 - MEASURING TESTING
Information Patent Application
WAFER GRINDING WHEEL
- Publication number 20200198084
- Publication date Jun 25, 2020
- Samsung Electronics Co., Ltd.
- Seong Gi Jeon
- C01 - INORGANIC CHEMISTRY
Information Patent Application
GRINDING METHOD AND OGS SUBSTRATE
- Publication number 20200070304
- Publication date Mar 5, 2020
- HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Wenlong ZHU
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200066507
- Publication date Feb 27, 2020
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi YAMAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20200043746
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ping TSENG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD FOR POLISHING A PERIPHERY...
- Publication number 20200023490
- Publication date Jan 23, 2020
- EBARA CORPORATION
- Masayuki NAKANISHI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20200023486
- Publication date Jan 23, 2020
- EBARA CORPORATION
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200004093
- Publication date Jan 2, 2020
- SAMSUNG DISPLAY CO., LTD.
- Chansol Yoo
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20190385834
- Publication date Dec 19, 2019
- EBARA CORPORATION
- Masayuki NAKANISHI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF POLISHING SILICON WAFER AND METHOD OF PRODUCING SILICON W...
- Publication number 20190348270
- Publication date Nov 14, 2019
- SUMCO CORPORATION
- Tsuyoshi MORITA
- B24 - GRINDING POLISHING
Information Patent Application
WAFER EDGE POLISHING APPARATUS AND METHOD
- Publication number 20190299354
- Publication date Oct 3, 2019
- SUMCO CORPORATION
- Makoto ANDO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20190054589
- Publication date Feb 21, 2019
- EBARA CORPORATION
- Masaya SEKI
- B24 - GRINDING POLISHING

of thin, brittle parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of helical chamfer machining silicon wafer

Chamfer formation on data storage disc substrates

Polishing device

Method for manufacturing semiconductor device and apparatus for man...

Cleaning module, substrate processing apparatus including cleaning...

Chemical mechanical polishing apparatus

Wafer grinding wheel

Substrate processing apparatus and substrate processing method

Rectangular substrate for imprint lithography and making method

Substrate processing apparatus, polishing head, and substrate proce...

Method and apparatus for manufacturing semiconductor device

Substrate processing apparatus and substrate processing method

Wafer edge polishing apparatus and method

Method of polishing silicon wafer including notch polishing process...

Polishing apparatus and polishing method

Method for evaluating edge shape of silicon wafer, apparatus for ev...

Method for preparing silicon carbide wafer and silicon carbide wafer

Substrate processing apparatus and control method

Substrate processing apparatus and substrate processing method

Apparatus and method for processing a surface of a substrate

Chamfered silicon carbide substrate and method of chamfering

Abrasive rotary tool with abrasive agglomerates

Method of producing silicon elements and integrated circuits

Flexible abrasive rotary tool

Display device and method for manufacturing the same

Silicon carbide single crystal substrate and method for manufacturi...

Method and apparatus for performing a polishing process in semicond...

Wafer processing method

LED wafer processing method

Method for wafer trimming

Patents Applicationslast 30 patents

CHUCK TABLE AND EDGE TRIMMING APPARATUS

POLISHING APPARATUS AND POLISHING METHOD

CHEMICAL MECHANICAL POLISHING APPARATUS

METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER

APPARATUS FOR FILM REMOVAL

METHOD OF FORMING TRUER

SYSTEM AND METHOD FOR PROCESSING SILICON WAFERS

DEVICE FOR POLISHING OUTER PERIPHERY OF WAFER

SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT...

POLISHING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR MAN...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

EDGE TRIMMING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS, POLISHING HEAD, AND SUBSTRATE PROCE...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHOD FOR PREPARING SILICON CARBIDE WAFER AND SILICON CARBIDE WAFER

POLISHING DEVICE

METHOD FOR EVALUATING EDGE SHAPE OF SILICON WAFER, APPARATUS FOR EV...

WAFER GRINDING WHEEL

GRINDING METHOD AND OGS SUBSTRATE

METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

CHEMICAL MECHANICAL POLISHING APPARATUS

POLISHING APPARATUS AND POLISHING METHOD FOR POLISHING A PERIPHERY...

POLISHING APPARATUS AND POLISHING METHOD

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE PROCESSING METHOD

METHOD OF POLISHING SILICON WAFER AND METHOD OF PRODUCING SILICON W...

WAFER EDGE POLISHING APPARATUS AND METHOD

POLISHING METHOD AND POLISHING APPARATUS