One component Cu-based

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Y10T428/12514

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T428/00Stock material or miscellaneous articles

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Y10T428/12514One component Cu-based

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Carrier-attached copper foil
- Patent number 9,826,635
- Issue date Nov 21, 2017
- Axis Patent International
- Tomota Nagaura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carrier-attached copper foil and method for manufacturing the same
- Patent number 8,808,873
- Issue date Aug 19, 2014
- Industrial Technology Research Institute
- Yu-Chung Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate structure and method of manufacturing the same
- Patent number 8,759,986
- Issue date Jun 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Chul Min Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Rolled copper foil or electrolytic copper foil for electronic circu...
- Patent number 8,668,994
- Issue date Mar 11, 2014
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Rolled copper foil or electrolytic copper foil for electronic circu...
- Patent number 8,580,390
- Issue date Nov 12, 2013
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Metallic laminate and manufacturing method of light emitting diode...
- Patent number 8,568,861
- Issue date Oct 29, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Myung Gun Chong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil for printed circuit
- Patent number 8,524,378
- Issue date Sep 3, 2013
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic laminate and manufacturing method of light emitting diode...
- Patent number 8,481,171
- Issue date Jul 9, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Myung Gun Chong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric device and method of manufacturing dielectric device
- Patent number 8,435,645
- Issue date May 7, 2013
- TDK Corporation
- Akira Shibue
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Printed circuit board with multiple metallic layers and method of m...
- Patent number 8,409,726
- Issue date Apr 2, 2013
- Samsung Techwin Co., Ltd.
- Chang-han Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated article having metal thin film formed by electroless plating...
- Patent number 8,163,400
- Issue date Apr 24, 2012
- Nippon Mining & Metals Co., Ltd
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Article with a coating of electrically conductive polymer and preci...
- Patent number 8,153,271
- Issue date Apr 10, 2012
- Ormecon GmbH
- Bernhard Wessling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintered sliding member and connecting device
- Patent number 7,998,238
- Issue date Aug 16, 2011
- Komatsu Ltd.
- Takemori Takayama
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,985,488
- Issue date Jul 26, 2011
- The Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation method of metal layer on resin layer, printed wiring boar...
- Patent number 7,964,289
- Issue date Jun 21, 2011
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bearing material coated slide member and method for manufacturing t...
- Patent number 7,964,239
- Issue date Jun 21, 2011
- Toyota Jidosha Kabushiki Kaisha
- Noritaka Miyamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper alloy for electronic machinery and tools and method of produ...
- Patent number 7,946,022
- Issue date May 24, 2011
- The Furukawa Electric Co., Ltd.
- Takeo Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Formation method of metal layer on resin layer
- Patent number 7,818,877
- Issue date Oct 26, 2010
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ultra-thin copper foil with carrier and printed wiring board using...
- Patent number 7,790,269
- Issue date Sep 7, 2010
- The Furukawa Electric Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,771,841
- Issue date Aug 10, 2010
- Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peel strength enhancement of copper laminates
- Patent number 7,749,611
- Issue date Jul 6, 2010
- GBC Metals, LLC
- William L. Brenneman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a composite material including copper foil...
- Patent number 7,731,831
- Issue date Jun 8, 2010
- GBC Metals, LLC
- William L. Brenneman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microfabrication using patterned topography and self-assembled mono...
- Patent number 7,682,703
- Issue date Mar 23, 2010
- 3M Innovative Properties Company
- Matthew H. Frey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cross-linking a filled polymer based on polyethylene
- Patent number 7,632,574
- Issue date Dec 15, 2009
- Nexans
- Christele Kensicher
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Formation method of metal layer on resin layer, printed wiring boar...
- Patent number 7,615,277
- Issue date Nov 10, 2009
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin-coated printed circuit boards with low tendency to whisker form...
- Patent number 7,547,479
- Issue date Jun 16, 2009
- Ormecon GmbH
- Bernhard Wessling
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil provided with dielectric layer for forming capacitor la...
- Patent number 7,524,552
- Issue date Apr 28, 2009
- Mitsui Mining & Smelting Co., Ltd.
- Toshiko Yokota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective application of conductive material to substrates by pick...
- Patent number 7,455,915
- Issue date Nov 25, 2008
- Morgan T. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing ultra-thin copper foil with carrier, ultra-thin...
- Patent number 7,223,481
- Issue date May 29, 2007
- Furukawa Circuit Foil Co., Inc.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high-density ultra-fine printed wiring board
- Patent number 7,175,920
- Issue date Feb 13, 2007
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODE PAD, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF...
- Publication number 20140087205
- Publication date Mar 27, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jung Youn PANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CARRIER-ATTACHED COPPER FOIL
- Publication number 20130216855
- Publication date Aug 22, 2013
- JX NIPPON MINING & METALS CORPORATION
- Tomota Nagaura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METALIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE P...
- Publication number 20130183479
- Publication date Jul 18, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Myung Gun CHONG
- B32 - LAYERED PRODUCTS
Information Patent Application
Substrate structure and method of manufacturing the same
- Publication number 20120171432
- Publication date Jul 5, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Chul Min Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER-ATTACHED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120097544
- Publication date Apr 26, 2012
- Yu-Chung CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110297641
- Publication date Dec 8, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110293960
- Publication date Dec 1, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil for Printed Circuit
- Publication number 20110262764
- Publication date Oct 27, 2011
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Support Layer for Thin Copper Foil
- Publication number 20110008616
- Publication date Jan 13, 2011
- William L. Brenneman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METALLIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE...
- Publication number 20100304162
- Publication date Dec 2, 2010
- Samsung Electro-Mechanics CO., LTD.
- Myung Gun CHONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...
- Publication number 20100270063
- Publication date Oct 28, 2010
- THE FURUKAWA ELECTRIC CO., LTD.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DIELECTRIC DEVICE AND METHOD OF MANUFACTURING DIELECTRIC DEVICE
- Publication number 20100260981
- Publication date Oct 14, 2010
- TDK Corporation
- Akira SHIBUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH MULTIPLE METALLIC LAYERS AND METHOD OF M...
- Publication number 20100116528
- Publication date May 13, 2010
- Samsung Techwin Co., Ltd.
- Chang-han Shim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20100044086
- Publication date Feb 25, 2010
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CROSS-LINKING A FILLED POLYMER BASED ON POLYETHYLENE
- Publication number 20100041817
- Publication date Feb 18, 2010
- Christele Kensicher
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Plated article having metal thin film formed by electroless plating...
- Publication number 20100038111
- Publication date Feb 18, 2010
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Article with a Coating of Electrically Conductive Polymer and Preci...
- Publication number 20100012359
- Publication date Jan 21, 2010
- Ormecon GmbH
- Bernhard Wessling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER AND PRINTED WIRING BOARD USING...
- Publication number 20090011271
- Publication date Jan 8, 2009
- Akitoshi SUZUKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20080138505
- Publication date Jun 12, 2008
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20070277373
- Publication date Dec 6, 2007
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of cross-linking a filled polymer based on polyethylene
- Publication number 20070154730
- Publication date Jul 5, 2007
- Christele Kensicher
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Support layer for thin copper foil
- Publication number 20070141380
- Publication date Jun 21, 2007
- Olin Corporation
- William L. Brenneman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ultrathin copper foil with carrier and printed circuit board using...
- Publication number 20070141381
- Publication date Jun 21, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROFABRICATION USING PATTERNED TOPOGRAPHY AND SELF-ASSEMBLED MONO...
- Publication number 20070098996
- Publication date May 3, 2007
- 3M Innovative Properties Company
- Matthew H. Frey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper-tin-oxygen alloy plating
- Publication number 20070082216
- Publication date Apr 12, 2007
- NIHON NEW CHROME CO., LTD.
- Kazuya Urata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper alloy for electronic machinery and tools and method of produ...
- Publication number 20070015001
- Publication date Jan 18, 2007
- THE FURUKAWA ELECTRIC CO., LTD.
- Takeo Uno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Bearing material coated slide member and method for manufacturing t...
- Publication number 20070009756
- Publication date Jan 11, 2007
- Toyota Jidosha Kabushiki Kaisha
- Noritaka Miyamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sintered sliding material, sliding member, connection device and de...
- Publication number 20070009757
- Publication date Jan 11, 2007
- Takemori Takayama
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Sintered sliding member and working implement-connecting apparatus
- Publication number 20060159376
- Publication date Jul 20, 2006
- Takemori Takayama
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Selective application of conductive material to substrates by pick...
- Publication number 20060128176
- Publication date Jun 15, 2006
- Morgan T. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

One component Cu-based

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Carrier-attached copper foil

Carrier-attached copper foil and method for manufacturing the same

Substrate structure and method of manufacturing the same

Rolled copper foil or electrolytic copper foil for electronic circu...

Rolled copper foil or electrolytic copper foil for electronic circu...

Metallic laminate and manufacturing method of light emitting diode...

Copper foil for printed circuit

Metallic laminate and manufacturing method of light emitting diode...

Dielectric device and method of manufacturing dielectric device

Printed circuit board with multiple metallic layers and method of m...

Plated article having metal thin film formed by electroless plating...

Article with a coating of electrically conductive polymer and preci...

Sintered sliding member and connecting device

Ultrathin copper foil with carrier and printed circuit board using...

Formation method of metal layer on resin layer, printed wiring boar...

Bearing material coated slide member and method for manufacturing t...

Copper alloy for electronic machinery and tools and method of produ...

Formation method of metal layer on resin layer

Ultra-thin copper foil with carrier and printed wiring board using...

Ultrathin copper foil with carrier and printed circuit board using...

Peel strength enhancement of copper laminates

Method for manufacturing a composite material including copper foil...

Microfabrication using patterned topography and self-assembled mono...

Method of cross-linking a filled polymer based on polyethylene

Formation method of metal layer on resin layer, printed wiring boar...

Tin-coated printed circuit boards with low tendency to whisker form...

Copper foil provided with dielectric layer for forming capacitor la...

Selective application of conductive material to substrates by pick...

Method of producing ultra-thin copper foil with carrier, ultra-thin...

Copper foil for high-density ultra-fine printed wiring board

Patents Applicationslast 30 patents

ELECTRODE PAD, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF...

CARRIER-ATTACHED COPPER FOIL

METALIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE P...

Substrate structure and method of manufacturing the same

CARRIER-ATTACHED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Copper Foil for Printed Circuit

Support Layer for Thin Copper Foil

METALLIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE...

ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...

DIELECTRIC DEVICE AND METHOD OF MANUFACTURING DIELECTRIC DEVICE

PRINTED CIRCUIT BOARD WITH MULTIPLE METALLIC LAYERS AND METHOD OF M...

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

METHOD OF CROSS-LINKING A FILLED POLYMER BASED ON POLYETHYLENE

Plated article having metal thin film formed by electroless plating...

Article with a Coating of Electrically Conductive Polymer and Preci...

ULTRA-THIN COPPER FOIL WITH CARRIER AND PRINTED WIRING BOARD USING...

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

Method of cross-linking a filled polymer based on polyethylene

Support layer for thin copper foil

Ultrathin copper foil with carrier and printed circuit board using...

MICROFABRICATION USING PATTERNED TOPOGRAPHY AND SELF-ASSEMBLED MONO...

Copper-tin-oxygen alloy plating

Copper alloy for electronic machinery and tools and method of produ...

Bearing material coated slide member and method for manufacturing t...

Sintered sliding material, sliding member, connection device and de...

Sintered sliding member and working implement-connecting apparatus

Selective application of conductive material to substrates by pick...