Peeling away backing

Industry

CPC
Y10S156/931

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10S156/931Peeling away backing

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for manufacturing element array and apparatus for removin...
- Patent number 11,167,541
- Issue date Nov 9, 2021
- TDK Corporation
- Toshinobu Miyagoshi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing element array and method of removing specif...
- Patent number 11,101,317
- Issue date Aug 24, 2021
- TDK Corporation
- Toshinobu Miyagoshi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for mount tape die release system for thin die ejection
- Patent number 10,043,688
- Issue date Aug 7, 2018
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detaching a semiconductor chip from a foil
- Patent number 9,039,867
- Issue date May 26, 2015
- Besi Switzerland AG
- Ernst Barmettler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device for releasing an interconnect layer that provides connection...
- Patent number 8,905,111
- Issue date Dec 9, 2014
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for stripping a wafer from a carrier
- Patent number 8,603,294
- Issue date Dec 10, 2013
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for stripping a wafer from a carrier
- Patent number 8,443,864
- Issue date May 21, 2013
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for thin die detachment and pick-up
- Patent number 8,141,612
- Issue date Mar 27, 2012
- ASM Assembly Automation LTD
- Man Wai Chan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Control and monitoring system for thin die detachment and pick-up
- Patent number 8,092,645
- Issue date Jan 10, 2012
- ASM Assembly Automation LTD
- Siu Ping Yip
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Tape application method and tape application device
- Patent number 8,057,627
- Issue date Nov 15, 2011
- KUKA Systems GmbH
- Frank Herz
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for joining adhesive tape to semiconductor wafer, method for...
- Patent number 7,857,029
- Issue date Dec 28, 2010
- Nitto Denko Corporation
- Masayuki Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Leveling block for semiconductor demounter
- Patent number 5,482,899
- Issue date Jan 9, 1996
- Texas Instruments Incorporated
- Robert G. McKenna
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Electronic chip supplying apparatus and method
- Patent number 4,915,770
- Issue date Apr 10, 1990
- Hitachi, Ltd.
- Yoshio Haeda
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION...
- Publication number 20130327485
- Publication date Dec 12, 2013
- EV GROUP GMBH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20130255889
- Publication date Oct 3, 2013
- Besi Switzerland AG
- Ernst Barmettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRIPPING A WAFER FROM A CARRIER
- Publication number 20130139972
- Publication date Jun 6, 2013
- EV GROUP GMBH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A WAFER FROM A CARRIER
- Publication number 20120000613
- Publication date Jan 5, 2012
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
CONTROL AND MONITORING SYSTEM FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20110192547
- Publication date Aug 11, 2011
- Siu Ping YIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20100252205
- Publication date Oct 7, 2010
- Man Wai CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE APPLICATION METHOD AND TAPE APPLICATION DEVICE
- Publication number 20090320997
- Publication date Dec 31, 2009
- Frank Herz
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Method for joining adhesive tape to semiconductor wafer, method for...
- Publication number 20080023134
- Publication date Jan 31, 2008
- Nitto Denko Corporation
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Peeling away backing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for manufacturing element array and apparatus for removin...

Method of manufacturing element array and method of removing specif...

Method for mount tape die release system for thin die ejection

Method for detaching a semiconductor chip from a foil

Device for releasing an interconnect layer that provides connection...

Method for stripping a wafer from a carrier

Device for stripping a wafer from a carrier

Device for thin die detachment and pick-up

Control and monitoring system for thin die detachment and pick-up

Tape application method and tape application device

Method for joining adhesive tape to semiconductor wafer, method for...

Leveling block for semiconductor demounter

Electronic chip supplying apparatus and method

Patents Applicationslast 30 patents

DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION...

Method For Detaching A Semiconductor Chip From A Foil

METHOD FOR STRIPPING A WAFER FROM A CARRIER

DEVICE AND METHOD FOR STRIPPING A WAFER FROM A CARRIER

CONTROL AND MONITORING SYSTEM FOR THIN DIE DETACHMENT AND PICK-UP

DEVICE FOR THIN DIE DETACHMENT AND PICK-UP

TAPE APPLICATION METHOD AND TAPE APPLICATION DEVICE

Method for joining adhesive tape to semiconductor wafer, method for...