pick and place heads or apparatus

Industry

CPC
H05K13/0404

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/0404pick and place heads or apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus, system, and method of providing radial section identific...
- Patent number 12,004,300
- Issue date Jun 4, 2024
- JABIL INC.
- Mark Tudman
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Device for bonding chips
- Patent number 11,990,463
- Issue date May 21, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless gang die bonding arrangement
- Patent number 11,972,968
- Issue date Apr 30, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular-design component handling device with component gripping to...
- Patent number 11,956,901
- Issue date Apr 9, 2024
- ASMPT GMBH & CO. KG
- Sebastian Lohmeier
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wireless communication device manufacturing method and wireless com...
- Patent number 11,937,375
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Yoshinori Yamawaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component mounting machine
- Patent number 11,871,521
- Issue date Jan 9, 2024
- FUJI CORPORATION
- Yusuke Yamakage
- G01 - MEASURING TESTING
Information Patent Grant
Automatic backup pin arrangement system for component mounting machine
- Patent number 11,856,707
- Issue date Dec 26, 2023
- FUJI CORPORATION
- Hideya Kuroda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for bonding of chips
- Patent number 11,764,198
- Issue date Sep 19, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing electronic device using device chip
- Patent number 11,749,636
- Issue date Sep 5, 2023
- SHASHIN KAGAKU CO., LTD.
- Hiroyuki Kitazawa
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electrical verification of electronic components
- Patent number 11,751,372
- Issue date Sep 5, 2023
- Mycronic AB
- Bobbi Ferm
- G01 - MEASURING TESTING
Information Patent Grant
Flexural pick arm for a pick and place apparatus
- Patent number 11,622,485
- Issue date Apr 4, 2023
- ASMPT SINGAPORE PTE. LTD.
- Chak Tong Sze
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Assembly substation for assembling a cartridge for a smoking articl...
- Patent number 11,607,759
- Issue date Mar 21, 2023
- RAI Strategic Holdings, Inc.
- Quentin Paul Guenther
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test handler having multiple testing sectors
- Patent number 11,592,477
- Issue date Feb 28, 2023
- ASMPT SINGAPORE PTE. LTD.
- Chi Wah Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 11,594,432
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Methods of attaching die to substrate using compliant die attach sy...
- Patent number 11,557,567
- Issue date Jan 17, 2023
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating circuit components in matrix batches
- Patent number 11,521,862
- Issue date Dec 6, 2022
- Chih-liang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic insertion apparatus
- Patent number 11,523,552
- Issue date Dec 6, 2022
- Delta Electronics, Inc.
- Yuan-Kun Hsiao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method, system and device for identifying a bin in an SMT system
- Patent number 11,465,845
- Issue date Oct 11, 2022
- Mycronic AB
- Nils Jacobsson
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Electronic component mounting machine
- Patent number 11,464,151
- Issue date Oct 4, 2022
- FUJI CORPORATION
- Tomohisa Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gantry-type positioning device
- Patent number 11,408,554
- Issue date Aug 9, 2022
- Etel SA
- David Ingram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and control device for the throughput-optimized production o...
- Patent number 11,395,448
- Issue date Jul 19, 2022
- Siemens Aktiengesellschaft
- Alexander Pfaffinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component supply device and component mounting machine using the same
- Patent number 11,375,649
- Issue date Jun 28, 2022
- Yamaha Hatsudoki Kabushiki Kaisha
- Ryouta Masuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Picking apparatus capable of picking up target micro-elements
- Patent number 11,357,145
- Issue date Jun 7, 2022
- Lextar Electronics Corporation
- Chi-Wei Liu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Device for managing substrate processing machine
- Patent number 11,288,057
- Issue date Mar 29, 2022
- FUJI CORPORATION
- Hiroshi Oike
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and device for determining the maximum number of constant ta...
- Patent number 11,284,551
- Issue date Mar 22, 2022
- Siemens Aktiengesellschaft
- Alexander Pfaffinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Work machine and mounting method
- Patent number 11,272,647
- Issue date Mar 8, 2022
- FUJI CORPORATION
- Takaji Mukohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting machine and component mounting method
- Patent number 11,272,650
- Issue date Mar 8, 2022
- FUJI CORPORATION
- Hidetoshi Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display fabrication microassembly system
- Patent number 11,234,351
- Issue date Jan 25, 2022
- Facebook Technologies, LLC
- Pooya Saketi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting component
- Patent number 11,202,374
- Issue date Dec 14, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a cartridge for a smoking article
- Patent number 11,135,690
- Issue date Oct 5, 2021
- RAI Strategic Holdings, Inc.
- Quentin Paul Guenther
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLUXLESS GANG DIE BONDING ARRANGEMENT
- Publication number 20240304485
- Publication date Sep 12, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION DEVICE MANUFACTURING METHOD AND WIRELESS COM...
- Publication number 20240188271
- Publication date Jun 6, 2024
- Murata Manufacturing Co., Ltd.
- Yoshinori Yamawaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND DEVICE FOR BONDING OF CHIPS
- Publication number 20240170474
- Publication date May 23, 2024
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CONFIRMATION DEVICE AND COMPONENT CONFIRMATION METHOD
- Publication number 20240098958
- Publication date Mar 21, 2024
- FUJI CORPORATION
- Kohei SUGIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT SUPPLY DEVICE, COMPONENT SUPPLY METHOD, AND PROGRAM
- Publication number 20230389250
- Publication date Nov 30, 2023
- Konica Minolta, Inc.
- Akihiro Nakamura
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
MANUFACTURING SYSTEM, MANUFACTURING METHOD, CONTROL SYSTEM, AND CON...
- Publication number 20230292481
- Publication date Sep 14, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Junichi TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING DEVICE AND COMPONENT MOUNTING MACHINE
- Publication number 20230247772
- Publication date Aug 3, 2023
- FUJI CORPORATION
- Jinya IMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STAMP TOOL, TRANSFER DEVICE, AND ELEMENT ARRAY MANUFACTURING METHOD
- Publication number 20230187258
- Publication date Jun 15, 2023
- TDK Corporation
- Seijiro SUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECORDING COMPONENT DATA
- Publication number 20230126278
- Publication date Apr 27, 2023
- ASM Assembly Systems GmbH & Co. KG
- Sylvester DEMMEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXURAL PICK ARM FOR A PICK AND PLACE APPARATUS
- Publication number 20230085661
- Publication date Mar 23, 2023
- ASMPT SINGAPORE PTE. LTD
- Chak Tong SZE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD
- Publication number 20220174850
- Publication date Jun 2, 2022
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Hiroaki NITTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD OF PROVIDING RADIAL SECTION IDENTIFIC...
- Publication number 20220117125
- Publication date Apr 14, 2022
- Jabil Inc.
- Mark Tudman
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
COMPONENT MOUNTING MACHINE
- Publication number 20220095500
- Publication date Mar 24, 2022
- FUJI CORPORATION
- Yusuke YAMAKAGE
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL VERIFICATION OF ELECTRONIC COMPONENTS
- Publication number 20220087085
- Publication date Mar 17, 2022
- Mycronic AB
- Bobbi FERM
- G01 - MEASURING TESTING
Information Patent Application
WORK HEAD AND WORK MACHINE
- Publication number 20220072720
- Publication date Mar 10, 2022
- FUJI CORPORATION
- Junichi YAMAMURO
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...
- Publication number 20210392802
- Publication date Dec 16, 2021
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD OF PROVIDING A TRAY FOR HOLDING AN OP...
- Publication number 20210345531
- Publication date Nov 4, 2021
- Jabil Inc.
- Wenlu WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVICE CHIP
- Publication number 20210335747
- Publication date Oct 28, 2021
- SHASHIN KAGAKU CO., LTD.
- Hiroyuki KITAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOVING WORK MANAGEMENT DEVICE, MOUNTING SYSTEM, MOVING WORK DEVICE,...
- Publication number 20210315140
- Publication date Oct 7, 2021
- FUJI CORPORATION
- Yoshihiro YASUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SUBSTATION FOR ASSEMBLING A CARTRIDGE FOR A SMOKING ARTICL...
- Publication number 20210237214
- Publication date Aug 5, 2021
- RAI STRATEGIC HOLDINGS, INC.
- Quentin Paul Guenther
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS COMMUNICATION DEVICE MANUFACTURING METHOD AND WIRELESS COM...
- Publication number 20210227737
- Publication date Jul 22, 2021
- Murata Manufacturing Co., Ltd.
- Yoshinori Yamawaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20210225672
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Picking Apparatus
- Publication number 20210120711
- Publication date Apr 22, 2021
- Lextar Electronics Corporation
- Chi-Wei LIU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
DEVICE FOR MANAGING SUBSTRATE PROCESSING MACHINE
- Publication number 20210055923
- Publication date Feb 25, 2021
- FUJI CORPORATION
- Hiroshi OIKE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT SUPPLY DEVICE AND COMPONENT MOUNTING MACHINE USING THE SAME
- Publication number 20210015010
- Publication date Jan 14, 2021
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Ryouta MASUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORK MACHINE AND MOUNTING METHOD
- Publication number 20200352066
- Publication date Nov 5, 2020
- FUJI CORPORATION
- Takaji MUKOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEST HANDLER HAVING MULTIPLE TESTING SECTORS
- Publication number 20200341056
- Publication date Oct 29, 2020
- ASM Technology Singapore Pte Ltd
- Chi Wah CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD, SYSTEM AND DEVICE FOR IDENTIFYING A BIN IN AN SMT SYSTEM
- Publication number 20200255221
- Publication date Aug 13, 2020
- Mycronic AB
- Nils JACOBSSON
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING METHOD
- Publication number 20200221618
- Publication date Jul 9, 2020
- FUJI CORPORATION
- Hidetoshi KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY FABRICATION MICROASSEMBLY SYSTEM
- Publication number 20200128708
- Publication date Apr 23, 2020
- Facebook Technologies, LLC
- Pooya SAKETI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

pick and place heads or apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus, system, and method of providing radial section identific...

Device for bonding chips

Fluxless gang die bonding arrangement

Modular-design component handling device with component gripping to...

Wireless communication device manufacturing method and wireless com...

Component mounting machine

Automatic backup pin arrangement system for component mounting machine

Method and device for bonding of chips

Apparatus for manufacturing electronic device using device chip

Electrical verification of electronic components

Flexural pick arm for a pick and place apparatus

Assembly substation for assembling a cartridge for a smoking articl...

Test handler having multiple testing sectors

Cold fluid semiconductor device release during pick and place opera...

Methods of attaching die to substrate using compliant die attach sy...

Process for fabricating circuit components in matrix batches

Automatic insertion apparatus

Method, system and device for identifying a bin in an SMT system

Electronic component mounting machine

Gantry-type positioning device

Method and control device for the throughput-optimized production o...

Component supply device and component mounting machine using the same

Picking apparatus capable of picking up target micro-elements

Device for managing substrate processing machine

Method and device for determining the maximum number of constant ta...

Work machine and mounting method

Component mounting machine and component mounting method

Display fabrication microassembly system

Method of mounting component

Method for assembling a cartridge for a smoking article

Patents Applicationslast 30 patents

FLUXLESS GANG DIE BONDING ARRANGEMENT

WIRELESS COMMUNICATION DEVICE MANUFACTURING METHOD AND WIRELESS COM...

METHOD AND DEVICE FOR BONDING OF CHIPS

COMPONENT CONFIRMATION DEVICE AND COMPONENT CONFIRMATION METHOD

COMPONENT SUPPLY DEVICE, COMPONENT SUPPLY METHOD, AND PROGRAM

MANUFACTURING SYSTEM, MANUFACTURING METHOD, CONTROL SYSTEM, AND CON...

COATING DEVICE AND COMPONENT MOUNTING MACHINE

STAMP TOOL, TRANSFER DEVICE, AND ELEMENT ARRAY MANUFACTURING METHOD

RECORDING COMPONENT DATA

FLEXURAL PICK ARM FOR A PICK AND PLACE APPARATUS

COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD

APPARATUS, SYSTEM, AND METHOD OF PROVIDING RADIAL SECTION IDENTIFIC...

COMPONENT MOUNTING MACHINE

ELECTRICAL VERIFICATION OF ELECTRONIC COMPONENTS

WORK HEAD AND WORK MACHINE

COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...

APPARATUS, SYSTEM, AND METHOD OF PROVIDING A TRAY FOR HOLDING AN OP...

APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVICE CHIP

MOVING WORK MANAGEMENT DEVICE, MOUNTING SYSTEM, MOVING WORK DEVICE,...

ASSEMBLY SUBSTATION FOR ASSEMBLING A CARTRIDGE FOR A SMOKING ARTICL...

WIRELESS COMMUNICATION DEVICE MANUFACTURING METHOD AND WIRELESS COM...

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

Picking Apparatus

DEVICE FOR MANAGING SUBSTRATE PROCESSING MACHINE

COMPONENT SUPPLY DEVICE AND COMPONENT MOUNTING MACHINE USING THE SAME

WORK MACHINE AND MOUNTING METHOD

TEST HANDLER HAVING MULTIPLE TESTING SECTORS

METHOD, SYSTEM AND DEVICE FOR IDENTIFYING A BIN IN AN SMT SYSTEM

COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING METHOD

DISPLAY FABRICATION MICROASSEMBLY SYSTEM