Piercing layer during delaminating [e.g., cutting, etc.]

Industry

CPC
Y10T156/1184

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10T156/1184Piercing layer during delaminating [e.g., cutting, etc.]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Winder unit for vehicle glazing panel cut out
- Patent number 12,128,578
- Issue date Oct 29, 2024
- Belron International Limited
- William Finck
- B32 - LAYERED PRODUCTS
Information Patent Grant
Solar panel cutting unit
- Patent number 12,129,144
- Issue date Oct 29, 2024
- Won Kwang S&T Co., Ltd.
- Sang Hun Lee
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information Patent Grant
Stand-alone cutting apparatus
- Patent number 12,036,688
- Issue date Jul 16, 2024
- AVERY DENNISON RETAIL INFORMATION SERVICES LLC
- Donald J. Ward
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method for producing GaN layered substrate
- Patent number 11,967,530
- Issue date Apr 23, 2024
- Shin-Etsu Chemical Co., Ltd.
- Sumio Sekiyama
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hand-held liner removal tool for pressure sensitive tape
- Patent number 11,939,182
- Issue date Mar 26, 2024
- Eurotech Distributors, Inc.
- Paul J. Waszkowski
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Processing apparatus
- Patent number 11,764,085
- Issue date Sep 19, 2023
- Disco Corporation
- Yukiyasu Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of automated film removal
- Patent number 11,648,738
- Issue date May 16, 2023
- General Electric Company
- Wendy Wenling Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermoplastic laminate induction welding system and method
- Patent number 11,571,883
- Issue date Feb 7, 2023
- Rohr, Inc.
- Noushin Bahramshahi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier plate removing method
- Patent number 11,538,710
- Issue date Dec 27, 2022
- Disco Corporation
- Takatoshi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar panel disassembling apparatus
- Patent number 11,491,774
- Issue date Nov 8, 2022
- Won Kwang S&T Co., Ltd.
- Sang Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar module exterior disassembling apparatus
- Patent number 11,491,775
- Issue date Nov 8, 2022
- Won Kwang S&T Co., Ltd.
- Sang Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Winder unit for vehicle glazing panel cut out
- Patent number 11,472,054
- Issue date Oct 18, 2022
- Belron International Limited
- William Finck
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of dismantling a stack of at least three substrates
- Patent number 11,335,584
- Issue date May 17, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material removal apparatus, system, and method
- Patent number 11,279,057
- Issue date Mar 22, 2022
- The Boeing Company
- Christopher R. Loesche
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and method for decoupling an element that is bonded to a...
- Patent number 11,260,647
- Issue date Mar 1, 2022
- Gulfstream Aerospace Corporation
- Kyle Biezenbos
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of removing carrier plate
- Patent number 11,222,808
- Issue date Jan 11, 2022
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for separating label assembly
- Patent number 11,176,850
- Issue date Nov 16, 2021
- Timothy J. Flynn
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method of debonding work-carrier pair with thin devices
- Patent number 11,177,153
- Issue date Nov 16, 2021
- CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
- Chunbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing label waste using a cutting apparatus
- Patent number 11,148,846
- Issue date Oct 19, 2021
- AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
- João Pedro Gomes da Costa
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Grant
Method and apparatus for display screen shield replacement
- Patent number 11,097,439
- Issue date Aug 24, 2021
- SAXUM, LLC
- Teo Chong Teck
- B32 - LAYERED PRODUCTS
Information Patent Grant
Support for bonding a workpiece and method thereof
- Patent number 11,097,306
- Issue date Aug 24, 2021
- Micro Materials Inc.
- Hao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination printer and cutting apparatus
- Patent number 11,052,559
- Issue date Jul 6, 2021
- Avery Dennison Retail Information Servives, LLC
- John D. Mistyurik
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Stand-alone cutting apparatus
- Patent number 11,045,966
- Issue date Jun 29, 2021
- AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
- Donald J. Ward
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Grant
Peel-off device
- Patent number 11,001,044
- Issue date May 11, 2021
- Nikkiso Co., Ltd.
- Toru Makino
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier plate removing method
- Patent number 10,933,618
- Issue date Mar 2, 2021
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Removal method of carrier plate
- Patent number 10,926,524
- Issue date Feb 23, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for debonding temporarily adhesive-bonded carrier-workpiece...
- Patent number 10,913,254
- Issue date Feb 9, 2021
- DIDREW TECHNOLOGY (BVI) LIMITED
- Chunbin Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cryogenic-assisted adhesive removal tool
- Patent number 10,894,398
- Issue date Jan 19, 2021
- The Boeing Company
- Denise Alexandra Blohowiak
- B32 - LAYERED PRODUCTS
Information Patent Grant
Film-peeling apparatus
- Patent number 10,882,296
- Issue date Jan 5, 2021
- Kinsus Interconnect Technology Corp.
- Shang-Chi Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods for processing a first substrate bonded to a second substrate
- Patent number 10,814,603
- Issue date Oct 27, 2020
- Corning Incorporated
- Leena Kumari Sahoo
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
WINDER UNIT FOR VEHICLE GLAZING PANEL CUT OUT
- Publication number 20230075826
- Publication date Mar 9, 2023
- Belron International Limited
- William Finck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Method and Apparatus for Display Screen Shield Replacement
- Publication number 20200391399
- Publication date Dec 17, 2020
- SAXUM LLC
- Teo Chong Teck
- B32 - LAYERED PRODUCTS
Information Patent Application
Winder Unit for Vehicle Glazing Panel Cut Out
- Publication number 20200338774
- Publication date Oct 29, 2020
- Belron International Limited
- William Finck
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Method and Apparatus for Display Screen Shield Replacement
- Publication number 20190270212
- Publication date Sep 5, 2019
- SAXUM, LLC
- Teo Chong Teck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Carpet Divider System
- Publication number 20180126719
- Publication date May 10, 2018
- Antero Rodarte Garcia
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD OF STACK
- Publication number 20170334187
- Publication date Nov 23, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo KUMAKURA
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
METHOD FOR THE PRODUCTION OF AN ELASTIC COMPOSITE MATERIAL WITH A T...
- Publication number 20140367032
- Publication date Dec 18, 2014
- Mondi Consumer Packaging Technologies GmbH
- Dieter HOMOELLE
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE SEPARATION APPARATUS AND METHODKASN03436 US
- Publication number 20140352892
- Publication date Dec 4, 2014
- SAMSUNG DISPLAY CO. LTD.
- Seung Jun LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE SEPARATION APPARATUS AND METHOD
- Publication number 20140338828
- Publication date Nov 20, 2014
- SAMSUNG DISPLAY CO., LTD.
- Seung Jun LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
System and Method for Label Matrix Stripping
- Publication number 20140299278
- Publication date Oct 9, 2014
- Avery Dennison Corporation
- Richard A. PREVITY
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
CONTAINER LABEL AND RELATED METHODS
- Publication number 20140202642
- Publication date Jul 24, 2014
- GENERAL MILLS, INC.
- Ali EL-AFANDI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEPARATING APPARATUS
- Publication number 20140196855
- Publication date Jul 17, 2014
- Disco Corporation
- Kentaro Iizuka
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEM AND METHOD OF REMOVING BEADS FROM TIRES
- Publication number 20140196852
- Publication date Jul 17, 2014
- EAGLE INTERNATIONAL, LLC
- Julie K. Prochello
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Polarizing Sheet Removing Tool and Removing Method
- Publication number 20140144302
- Publication date May 29, 2014
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Yizhuang Zhuang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
FILM STRIPPING MECHANISM
- Publication number 20140130987
- Publication date May 15, 2014
- BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.
- Peng LI
- B32 - LAYERED PRODUCTS
Information Patent Application
Method and Apparatus for Display Screen Shield Replacement
- Publication number 20140103022
- Publication date Apr 17, 2014
- Saxum LLC
- Teo Chong Teck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Method and Apparatus for Display Screen Shield Replacement
- Publication number 20140102145
- Publication date Apr 17, 2014
- Saxum LLC
- Teo Chong Teck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Method and Apparatus for Display Screen Shield Replacement
- Publication number 20140102270
- Publication date Apr 17, 2014
- Saxum LLC
- Teo Chong Teck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Cartridge and tubular container triming and refinishing apparatus f...
- Publication number 20140096914
- Publication date Apr 10, 2014
- Paul J. Flood
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
FILM PEELING METHOD AND FILM PEELING DEVICE FOR FILM-COATED FLAT WIRE
- Publication number 20140076498
- Publication date Mar 20, 2014
- Toyota Jidosha Kabushiki Kaisha
- Kazuhiro SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...
- Publication number 20130340947
- Publication date Dec 26, 2013
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
System and Method for Removing the Outer Layer of a Layered Article
- Publication number 20130255888
- Publication date Oct 3, 2013
- NIKE, Inc.
- Arthur Molinari
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHODS FOR CLEAVING A BONDED WAFER STRUCTURE
- Publication number 20130105538
- Publication date May 2, 2013
- MEMC Electronic Materials, Inc.
- Gregory A. Young
- B32 - LAYERED PRODUCTS
Information Patent Application
CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE
- Publication number 20130105539
- Publication date May 2, 2013
- MEMC Electronic Materials, Inc.
- Gregory A. Young
- B32 - LAYERED PRODUCTS
Information Patent Application
PAPER STRIPPING MEMBER AND IMAGE FORMING APPARATUS
- Publication number 20130105091
- Publication date May 2, 2013
- Sharp Kabushiki Kaisha
- Hirokazu YAMAUCHI
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Systems and Methods for Cleaving A Bonded Wafer Pair
- Publication number 20130062020
- Publication date Mar 14, 2013
- MEMC Electronic Materials, Inc.
- Michael John Ries
- B32 - LAYERED PRODUCTS
Information Patent Application
Debonding Temporarily Bonded Semiconductor Wafers
- Publication number 20130048224
- Publication date Feb 28, 2013
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Application
Wire Handling for Vehicle Glazing Panel Cut Out
- Publication number 20130037648
- Publication date Feb 14, 2013
- William Finck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
ADHESIVE FASTENING ELEMENTS FOR HOLDING A WORKPIECE AND METHODS OF...
- Publication number 20130008583
- Publication date Jan 10, 2013
- Rolls-Royce plc
- Helen L. LLEWELLYN-POWELL
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR REMOVING A FILM FROM A SURFACE
- Publication number 20120318464
- Publication date Dec 20, 2012
- DIVERSEY, INC.
- Ryan E. Kron
- E04 - BUILDING

Piercing layer during delaminating [e.g., cutting, etc.]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Winder unit for vehicle glazing panel cut out

Solar panel cutting unit

Stand-alone cutting apparatus

Method for producing GaN layered substrate

Hand-held liner removal tool for pressure sensitive tape

Processing apparatus

Systems and methods of automated film removal

Thermoplastic laminate induction welding system and method

Carrier plate removing method

Solar panel disassembling apparatus

Solar module exterior disassembling apparatus

Winder unit for vehicle glazing panel cut out

Method of dismantling a stack of at least three substrates

Material removal apparatus, system, and method

Apparatus and method for decoupling an element that is bonded to a...

Method of removing carrier plate

Method for separating label assembly

Method of debonding work-carrier pair with thin devices

Method for reducing label waste using a cutting apparatus

Method and apparatus for display screen shield replacement

Support for bonding a workpiece and method thereof

Combination printer and cutting apparatus

Stand-alone cutting apparatus

Peel-off device

Carrier plate removing method

Removal method of carrier plate

Method for debonding temporarily adhesive-bonded carrier-workpiece...

Cryogenic-assisted adhesive removal tool

Film-peeling apparatus

Methods for processing a first substrate bonded to a second substrate

Patents Applicationslast 30 patents

WINDER UNIT FOR VEHICLE GLAZING PANEL CUT OUT

Method and Apparatus for Display Screen Shield Replacement

Winder Unit for Vehicle Glazing Panel Cut Out

Method and Apparatus for Display Screen Shield Replacement

Carpet Divider System

PROCESSING APPARATUS AND PROCESSING METHOD OF STACK

METHOD FOR THE PRODUCTION OF AN ELASTIC COMPOSITE MATERIAL WITH A T...

SUBSTRATE SEPARATION APPARATUS AND METHODKASN03436 US

SUBSTRATE SEPARATION APPARATUS AND METHOD

System and Method for Label Matrix Stripping

CONTAINER LABEL AND RELATED METHODS

SEPARATING APPARATUS

SYSTEM AND METHOD OF REMOVING BEADS FROM TIRES

Polarizing Sheet Removing Tool and Removing Method

FILM STRIPPING MECHANISM

Method and Apparatus for Display Screen Shield Replacement

Method and Apparatus for Display Screen Shield Replacement

Method and Apparatus for Display Screen Shield Replacement

Cartridge and tubular container triming and refinishing apparatus f...

FILM PEELING METHOD AND FILM PEELING DEVICE FOR FILM-COATED FLAT WIRE

DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...

System and Method for Removing the Outer Layer of a Layered Article

METHODS FOR CLEAVING A BONDED WAFER STRUCTURE

CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE

PAPER STRIPPING MEMBER AND IMAGE FORMING APPARATUS

Systems and Methods for Cleaving A Bonded Wafer Pair

Debonding Temporarily Bonded Semiconductor Wafers

Wire Handling for Vehicle Glazing Panel Cut Out

ADHESIVE FASTENING ELEMENTS FOR HOLDING A WORKPIECE AND METHODS OF...

METHOD AND APPARATUS FOR REMOVING A FILM FROM A SURFACE