Poking delaminating means

Industry

CPC
Y10T156/1983

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10T156/1983Poking delaminating means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,901,201
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Shunichi Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,894,246
- Issue date Feb 6, 2024
- Tokyo Electron Limited
- Norio Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mobile dismantling system for dismantling solar cell module
- Patent number 11,845,239
- Issue date Dec 19, 2023
- TSGC Technologies, Inc.
- Yao-Hsien Fu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Detaching a die from an adhesive tape by air ejection
- Patent number 11,764,098
- Issue date Sep 19, 2023
- ASMPT SINGAPORE PTE. LTD.
- Ngai Tat Man
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of automated film removal
- Patent number 11,648,738
- Issue date May 16, 2023
- General Electric Company
- Wendy Wenling Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 11,594,432
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for separating a window and method for separating a windo...
- Patent number 11,458,721
- Issue date Oct 4, 2022
- Samsung Display Co., Ltd.
- Jongman Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip ejecting apparatus
- Patent number 11,239,104
- Issue date Feb 1, 2022
- Samsung Electronics Co., Ltd.
- Jae Ryoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,062,925
- Issue date Jul 13, 2021
- Mitsubishi Electric Corporation
- Masato Negishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,998,208
- Issue date May 4, 2021
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
De-bonding leveling device and de-bonding method
- Patent number 10,971,380
- Issue date Apr 6, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Yuying Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for separating a window and method for separating a windo...
- Patent number 10,836,151
- Issue date Nov 17, 2020
- Samsung Display Co., Ltd.
- Jongman Bae
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photovoltaic structure cleaving system
- Patent number 10,672,938
- Issue date Jun 2, 2020
- SolarCity Corporation
- Pablo Gonzalez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for handling carrier-film-equipped gasket
- Patent number 10,514,099
- Issue date Dec 24, 2019
- NOK Corporation
- Takuro Nishimura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,410,891
- Issue date Sep 10, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Film separation apparatus and film separation method
- Patent number 10,406,799
- Issue date Sep 10, 2019
- BOE Technology Group Co., Ltd.
- Zhenli Zhou
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Detaping machine and detaping method
- Patent number 10,283,388
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for disassembling display device and method for disassemblin...
- Patent number 10,272,662
- Issue date Apr 30, 2019
- Samsung Display Co., Ltd.
- Chang-Mo Park
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flat file
- Patent number 10,144,075
- Issue date Dec 4, 2018
- Georg Martin GMBH
- Christoph Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-layer bonding material process for temporary bonding of microe...
- Patent number 10,103,048
- Issue date Oct 16, 2018
- Brewer Science, Inc.
- Tony D. Flaim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Assembly for handling a semiconductor die and method of handling a...
- Patent number 10,096,508
- Issue date Oct 9, 2018
- Infineon Technologies AG
- Ronald Paramio Joves
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,090,177
- Issue date Oct 2, 2018
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for peeling a semiconductor chip from a tape usin...
- Patent number 9,929,036
- Issue date Mar 27, 2018
- Manufacturing Integration Technology Ltd
- Kim Mone Kwong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate collecting device
- Patent number 9,869,612
- Issue date Jan 16, 2018
- Olympus Corporation
- Nobuhiko Morimoto
- G02 - OPTICS
Information Patent Grant
Apparatus and method for the dry removal of labels from containers...
- Patent number 9,796,004
- Issue date Oct 24, 2017
- PREVIERO N. S.R.L.
- Flavio Previero
- B08 - CLEANING
Information Patent Grant
Evaporation device and evaporation method
- Patent number 9,713,918
- Issue date Jul 25, 2017
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Junying Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding apparatus
- Patent number 9,698,117
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Yongdae Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic structure cleaving system
- Patent number 9,685,579
- Issue date Jun 20, 2017
- SolarCity Corporation
- Pablo Gonzalez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Peeling device, peeling system, and peeling method
- Patent number 9,601,365
- Issue date Mar 21, 2017
- Tokyo Electron Limited
- Masaru Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for transferring electronic components from a fir...
- Patent number 9,555,979
- Issue date Jan 31, 2017
- Muehlbauer GmbH & Co. KG
- Thomas Courts
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR SEPARATING A WINDOW AND METHOD FOR SEPARATING A WINDO...
- Publication number 20210070030
- Publication date Mar 11, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jongman Bae
- B32 - LAYERED PRODUCTS
Information Patent Application
LABEL APPLICATION DEVICES
- Publication number 20140311664
- Publication date Oct 23, 2014
- Computype, Inc.
- Richard Jackson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WAFER-RELATED DATA MANAGEMENT METHOD AND WAFER-RELATED DATA CREATIO...
- Publication number 20140299277
- Publication date Oct 9, 2014
- FUJI MACHINE MFG CO., LTD.
- Hideki Hosaka
- B32 - LAYERED PRODUCTS
Information Patent Application
DIE EJECT ASSEMBLY FOR DIE BONDER
- Publication number 20140251760
- Publication date Sep 11, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Ali Imran Amin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LABEL APPLICATION DEVICES
- Publication number 20140216629
- Publication date Aug 7, 2014
- Computype, Inc.
- Richard Jackson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CHIP SORTING APPARATUS
- Publication number 20140202627
- Publication date Jul 24, 2014
- EPISTAR CORPORATION
- Chen-Ke HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20140196853
- Publication date Jul 17, 2014
- Besi Switzerland AG
- Ernst Barmettler
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR STRIPPING RELEASE PAPER FROM WORKPIECE
- Publication number 20140174671
- Publication date Jun 26, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- JIE NI
- B32 - LAYERED PRODUCTS
Information Patent Application
FILM PEELING APPARATUS AND FILM PEELING METHOD USING THE SAME
- Publication number 20140060748
- Publication date Mar 6, 2014
- Il-Young JEONG
- B32 - LAYERED PRODUCTS
Information Patent Application
Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up...
- Publication number 20140060751
- Publication date Mar 6, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Keita Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER S...
- Publication number 20130276990
- Publication date Oct 24, 2013
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICO...
- Publication number 20130272837
- Publication date Oct 17, 2013
- Motoki Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20130255889
- Publication date Oct 3, 2013
- Besi Switzerland AG
- Ernst Barmettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Removing the Outer Layer of a Layered Article
- Publication number 20130255888
- Publication date Oct 3, 2013
- NIKE, Inc.
- Arthur Molinari
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PAPER STRIPPING MEMBER AND IMAGE FORMING APPARATUS
- Publication number 20130105091
- Publication date May 2, 2013
- Sharp Kabushiki Kaisha
- Hirokazu YAMAUCHI
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE
- Publication number 20130098542
- Publication date Apr 25, 2013
- Shoichi KUGA
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE SEPARATING APPARATUS, LOAD LOCK APPARATUS, SUBSTRATE BOND...
- Publication number 20130048222
- Publication date Feb 28, 2013
- Keiichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER S...
- Publication number 20130025796
- Publication date Jan 31, 2013
- Jürgen Burggraf
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR PEELING ELECTRONIC COMPONENT
- Publication number 20120312482
- Publication date Dec 13, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Yoshito KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pick-Up Method of Die Bonder and Die Bonder
- Publication number 20120244647
- Publication date Sep 27, 2012
- Hitachi High-Tech Instruments Co., Ltd.
- Naoki OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR FASTENING AND DETACHING A COMPONENT, AND METHOD THEREFOR
- Publication number 20120211151
- Publication date Aug 23, 2012
- MTU Aero Engines GmbH
- Martin Fessler-Knobel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and Method to Remove At Least One Chip-Like Semiconductor...
- Publication number 20120211172
- Publication date Aug 23, 2012
- Semikron Elektronik GmbH & Ko. KG
- Armin STUDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE
- Publication number 20120145332
- Publication date Jun 14, 2012
- Jack Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape Removal Apparatus and Process for Use with an Automated Compos...
- Publication number 20120018099
- Publication date Jan 26, 2012
- The Boeing Company
- PETER D. MC COWIN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DIE BONDER, PICKUP METHOD, AND PICKUP DEVICE
- Publication number 20110308738
- Publication date Dec 22, 2011
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE REMOVAL APPARATUS AND PROCESS
- Publication number 20110277941
- Publication date Nov 17, 2011
- The Boeing Company
- Thomas J. Hagman
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE
- Publication number 20110220296
- Publication date Sep 15, 2011
- MITSUBISHI ELECTRIC CORPORATION
- Shoichi KUGA
- B32 - LAYERED PRODUCTS
Information Patent Application
Method For Detaching And Removing A Semiconductor Chip From A Foil
- Publication number 20110214819
- Publication date Sep 8, 2011
- ESEC AG
- Stefan Behler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL DIE DETACHMENT APPARATUS
- Publication number 20110088845
- Publication date Apr 21, 2011
- Chi Ming CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE
- Publication number 20110084377
- Publication date Apr 14, 2011
- Jack Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS

Poking delaminating means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus and method of manufacturing s...

Bonding apparatus and bonding method

Mobile dismantling system for dismantling solar cell module

Detaching a die from an adhesive tape by air ejection

Systems and methods of automated film removal

Cold fluid semiconductor device release during pick and place opera...

Apparatus for separating a window and method for separating a windo...

Chip ejecting apparatus

Semiconductor manufacturing apparatus and method of manufacturing s...

Cold fluid semiconductor device release during pick and place opera...

De-bonding leveling device and de-bonding method

Apparatus for separating a window and method for separating a windo...

Photovoltaic structure cleaving system

Method for handling carrier-film-equipped gasket

Cold fluid semiconductor device release during pick and place opera...

Film separation apparatus and film separation method

Detaping machine and detaping method

System for disassembling display device and method for disassemblin...

Flat file

Dual-layer bonding material process for temporary bonding of microe...

Assembly for handling a semiconductor die and method of handling a...

Cold fluid semiconductor device release during pick and place opera...

System and method for peeling a semiconductor chip from a tape usin...

Substrate collecting device

Apparatus and method for the dry removal of labels from containers...

Evaporation device and evaporation method

Die bonding apparatus

Photovoltaic structure cleaving system

Peeling device, peeling system, and peeling method

Device and method for transferring electronic components from a fir...

Patents Applicationslast 30 patents

APPARATUS FOR SEPARATING A WINDOW AND METHOD FOR SEPARATING A WINDO...

LABEL APPLICATION DEVICES

WAFER-RELATED DATA MANAGEMENT METHOD AND WAFER-RELATED DATA CREATIO...

DIE EJECT ASSEMBLY FOR DIE BONDER

LABEL APPLICATION DEVICES

CHIP SORTING APPARATUS

Method For Detaching A Semiconductor Chip From A Foil

APPARATUS FOR STRIPPING RELEASE PAPER FROM WORKPIECE

FILM PEELING APPARATUS AND FILM PEELING METHOD USING THE SAME

Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up...

DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER S...

SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICO...

Method For Detaching A Semiconductor Chip From A Foil

System and Method for Removing the Outer Layer of a Layered Article

PAPER STRIPPING MEMBER AND IMAGE FORMING APPARATUS

METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE

SUBSTRATE SEPARATING APPARATUS, LOAD LOCK APPARATUS, SUBSTRATE BOND...

DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER S...

METHOD AND APPARATUS FOR PEELING ELECTRONIC COMPONENT

Pick-Up Method of Die Bonder and Die Bonder

DEVICE FOR FASTENING AND DETACHING A COMPONENT, AND METHOD THEREFOR

Apparatus and Method to Remove At Least One Chip-Like Semiconductor...

SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE

Tape Removal Apparatus and Process for Use with an Automated Compos...

DIE BONDER, PICKUP METHOD, AND PICKUP DEVICE

TAPE REMOVAL APPARATUS AND PROCESS

METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE

Method For Detaching And Removing A Semiconductor Chip From A Foil

UNIVERSAL DIE DETACHMENT APPARATUS

SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE