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Anisotropic conductive adhesive
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Issue date Dec 7, 2004
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Sony Chemicals Corp.
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Tomoyuki Ishimatsu
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Radiation curable inkjet composition
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Issue date Jul 1, 2003
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Spectra Group Limited, Inc.
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Alexandre Mejiritski
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Fiber-reinforced resin composition
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Patent number 5,612,424
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Issue date Mar 18, 1997
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Mitsubishi Chemical Industries, Ltd.
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Shoichi Sato
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Heat-curable molding material
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Patent number 5,326,822
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Issue date Jul 5, 1994
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BASF Aktiengesellschaft
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Anton Hesse
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Resin composition
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Patent number 5,084,508
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Issue date Jan 28, 1992
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Dainippon Ink and Chemicals, Inc.
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Katsuo Kagaya
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Radiation curable acrylate polyesters
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Radcure Specialties, Inc.
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JoAnn A. McConnell
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Polymerizable water soluble binders
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Issue date Jun 12, 1990
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Wolff Walsrode AG
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Michael Piepho
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Grouting composition
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Patent number 4,749,592
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Issue date Jun 7, 1988
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Minnesota Mining and Manufacturing Company
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Alton J. Gasper
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Silicone sealant composition
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Issue date Jan 29, 1985
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Toshiba Silicone Co., Ltd.
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Atsushi Kurita
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UV Curable composition and coil coatings
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Westinghouse Electric Corp.
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Frank A. Sattler
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Reactive plastisol dispersion
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Patent number 4,463,128
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Issue date Jul 31, 1984
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W. R. Grace & Co.
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Shiow C. Lin
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