Polyimides Polyester-imides Polyamide-imides Polyamide acids or similar polyimide precursors

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CPC
C09J179/08

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Parent Industries

CCHEMISTRY METALLURGY C09Paints, dyes C09JADHESIVES NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE USE OF MATERIALS AS ADHESIVES C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00

Current Industry

C09J179/08Polyimides Polyester-imides Polyamide-imides Polyamide acids or similar polyimide precursors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interior member for aircraft, manufacturing method of the same, and...
- Patent number 12,168,339
- Issue date Dec 17, 2024
- Mitsubishi Heavy Industries, Ltd.
- Makoto Hirai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat-curable maleimide resin composition
- Patent number 12,162,971
- Issue date Dec 10, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide resin composition, polyimide resin adhesive layer, lamina...
- Patent number 12,157,815
- Issue date Dec 3, 2024
- ECHEM SOLUTIONS CORP.
- Yung-Yu Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition, adhesive agent, adhesive film, circuit s...
- Patent number 12,139,576
- Issue date Nov 12, 2024
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Fluorinated poly(imide-phthalonitrile) adhesive formulations and re...
- Patent number 12,116,504
- Issue date Oct 15, 2024
- The Boeing Company
- Ashley Marie Dustin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polyimides for temporary bonding adhesives, methods for manufacturi...
- Patent number 12,091,508
- Issue date Sep 17, 2024
- Kaneka Americas Holding, Inc.
- Samuel Kyran
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary bonding composition, temporary bonding film, composite fi...
- Patent number 12,043,770
- Issue date Jul 23, 2024
- Daxin Materials Corporation
- Cheng-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated wire and preparation method thereof, coil and electronic/...
- Patent number 12,031,066
- Issue date Jul 9, 2024
- Well Ascent Electronic (Ganzhou) Co., Ltd.
- Huimin Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-curable citraconimide resin composition
- Patent number 12,012,485
- Issue date Jun 18, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting polyimide resin and manufacturing method thereof, com...
- Patent number 11,945,913
- Issue date Apr 2, 2024
- CHIN YEE CHEMICAL INDUSTRIES CO., LTD.
- Pi-Tao Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thick polyimide film having improved surface quality and method of...
- Patent number 11,945,922
- Issue date Apr 2, 2024
- PI Advanced Materials Co., Ltd.
- Won Ho Son
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit material and circuit board containing the same
- Patent number 11,930,595
- Issue date Mar 12, 2024
- Shengyi Technology Co., Ltd.
- Weifeng Yin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Manufacturing method of wavelength-converting component
- Patent number 11,865,575
- Issue date Jan 9, 2024
- Coretronic Corporation
- Yu-Lin Tsai
- G02 - OPTICS
Information Patent Grant
Composite encapsulating material and photovoltaic module including...
- Patent number 11,810,777
- Issue date Nov 7, 2023
- JINKO GREEN ENERGY (SHANGHAI) MANAGEMENT CO., LTD.
- Kun Yu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Poly(etherimide-phthalonitrile) adhesives and related methods
- Patent number 11,795,357
- Issue date Oct 24, 2023
- The Boeing Company
- Kevin James Drummey
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition and semiconductor device production method
- Patent number 11,795,356
- Issue date Oct 24, 2023
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat resistant polyimide film
- Patent number 11,685,811
- Issue date Jun 27, 2023
- Changwei Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods of disassembling apparel products having imine adhesives
- Patent number 11,542,413
- Issue date Jan 3, 2023
- CreateMe Technologies LLC
- Caglar Remzi Becer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Materials for use as adhesive and for surface sealing
- Patent number 11,505,729
- Issue date Nov 22, 2022
- EPG (Engineered Nanoproducts Germany) AG
- Heike Schneider
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal particle-containing composition and electrically conductive a...
- Patent number 11,466,181
- Issue date Oct 11, 2022
- Furukawa Electric Co., Ltd.
- Norzafriza Nitta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluoropolymer adhesives and methods thereof
- Patent number 11,421,080
- Issue date Aug 23, 2022
- The Boeing Company
- Ashley M. Dustin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition, cured product, adhesive, bonding film, c...
- Patent number 11,421,107
- Issue date Aug 23, 2022
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composition for forming a coating film for removing foreign matters
- Patent number 11,319,514
- Issue date May 3, 2022
- NISSAN CHEMICAL CORPORATION
- Takahiro Kishioka
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Electrically conductive adhesive agent composition, and electricall...
- Patent number 11,306,225
- Issue date Apr 19, 2022
- Furukawa Electric Co., Ltd.
- Shunichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,193,047
- Issue date Dec 7, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin layer, permanent adhesive, adhesive for te...
- Patent number 11,186,757
- Issue date Nov 30, 2021
- Toray Industries, Inc.
- Shinji Arimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,136,479
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wavelength-converting component, projection apparatus and manufactu...
- Patent number 11,106,123
- Issue date Aug 31, 2021
- Coretronic Corporation
- Yu-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,098,226
- Issue date Aug 24, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELEC...
- Publication number 20240400825
- Publication date Dec 5, 2024
- TORAY INDUSTRIES, INC.
- Akira Shimada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...
- Publication number 20240376348
- Publication date Nov 14, 2024
- TORAY INDUSTRIES, INC.
- Yukari ARIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, POLYIMIDE PREPARATION METHOD AND RELATED PRODUCTS
- Publication number 20240336738
- Publication date Oct 10, 2024
- AAC TECHNOLOGIES (NANJING) CO., LTD.
- Yilan Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ALL-AROMATIC LIQUID-CRYSTALLINE HOMO-POLYIMIDES WITH AROMATIC ENDGR...
- Publication number 20240294813
- Publication date Sep 5, 2024
- Government of the United States, as represented by the Secretary of the Air F...
- Loon-Seng Tan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...
- Publication number 20240247128
- Publication date Jul 25, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED...
- Publication number 20240191029
- Publication date Jun 13, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masayuki IWASAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD L...
- Publication number 20240191030
- Publication date Jun 13, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kazuyoshi YAMAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYAMIC ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMI...
- Publication number 20240182765
- Publication date Jun 6, 2024
- MITSUI CHEMICALS, INC.
- Masaki OKAZAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE, AND L...
- Publication number 20240182645
- Publication date Jun 6, 2024
- MITSUI CHEMICALS, INC.
- Masaki OKAZAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINT...
- Publication number 20240117120
- Publication date Apr 11, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PRE...
- Publication number 20240043637
- Publication date Feb 8, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kazuyoshi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF LASER-RELEASABLE COMPOSITION
- Publication number 20240010892
- Publication date Jan 11, 2024
- MICROCOSM TECHNOLOGY CO., LTD.
- Bo-Hung Lai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...
- Publication number 20230416466
- Publication date Dec 28, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORINATED POLY(IMIDE-PHTHALONITRILE) ADHESIVE FORMULATIONS AND RE...
- Publication number 20230392055
- Publication date Dec 7, 2023
- The Boeing Company
- Ashley Marie Dustin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROVISIONAL FIXATION MATERIAL AND METHOD FOR PRODUCING ELECTRONIC C...
- Publication number 20230348767
- Publication date Nov 2, 2023
- Sekisui Chemical Co., Ltd
- Izumi DAIDO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING CURED PRODUCT OF HEAT-CURABLE MALEIMIDE RESIN...
- Publication number 20230340299
- Publication date Oct 26, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION, TEMPORARY FIXING MATERIAL, AND ELECTRONI...
- Publication number 20230312923
- Publication date Oct 5, 2023
- Sekisui Chemical Co., Ltd
- Toshio TAKAHASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY ADHESION METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE...
- Publication number 20230178412
- Publication date Jun 8, 2023
- Shin-Etsu Chemical Co., Ltd.
- Tamotsu OOWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC IMIDE RESIN COMPOSITION, LIQUID ADHESIVE, FILM, PREPREG, COP...
- Publication number 20230130867
- Publication date Apr 27, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MULTILAYER STRUCTURE FOR TRANSPORTING OR STORING HYDROGEN
- Publication number 20230103345
- Publication date Apr 6, 2023
- Arkema France
- Nicolas DUFAURE
- C01 - INORGANIC CHEMISTRY
Information Patent Application
POLY(ETHERIMIDE-PHTHALONITRILE) ADHESIVES AND RELATED METHODS
- Publication number 20230103527
- Publication date Apr 6, 2023
- The Boeing Company
- Kevin James Drummey
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
AMIDE COMPOUND, NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AND CROS...
- Publication number 20230094470
- Publication date Mar 30, 2023
- DAIKIN INDUSTRIES, LTD.
- Yoshiyuki OISHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLUOROPOLYMER ADHESIVES AND METHODS THEREOF
- Publication number 20230002557
- Publication date Jan 5, 2023
- The Boeing Company
- Ashley M. DUSTIN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
REACTIVE POLYAMIDEIMIDE OLIGOMERS, METHODS, AND ARTICLES
- Publication number 20230002558
- Publication date Jan 5, 2023
- The University of North Carolina at Chapel Hill
- Maruti HEDGE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...
- Publication number 20220319873
- Publication date Oct 6, 2022
- Showa Denko Materials Co., Ltd.
- Tomohiro NAGOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-CURABLE CITRACONIMIDE RESIN COMPOSITION
- Publication number 20220306808
- Publication date Sep 29, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD (FPC), AND H...
- Publication number 20220306920
- Publication date Sep 29, 2022
- Shin-Etsu Chemical Co., Ltd.
- Atsushi TSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATED WIRE AND PREPARATION METHOD THEREOF, COIL AND ELECTRONIC/...
- Publication number 20220306921
- Publication date Sep 29, 2022
- Well Ascent Electronic (Ganzhou) Co., Ltd.
- Huimin YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE RESIN COMPOSITION, POLYIMIDE RESIN ADHESIVE LAYER, LAMINA...
- Publication number 20220275205
- Publication date Sep 1, 2022
- eChem Solutions Corp.
- Yung-Yu Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Polyimides Polyester-imides Polyamide-imides Polyamide acids or similar polyimide precursors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interior member for aircraft, manufacturing method of the same, and...

Heat-curable maleimide resin composition

Polyimide resin composition, polyimide resin adhesive layer, lamina...

Curable resin composition, adhesive agent, adhesive film, circuit s...

Fluorinated poly(imide-phthalonitrile) adhesive formulations and re...

Polyimides for temporary bonding adhesives, methods for manufacturi...

Temporary bonding composition, temporary bonding film, composite fi...

Insulated wire and preparation method thereof, coil and electronic/...

Heat-curable citraconimide resin composition

Thermosetting polyimide resin and manufacturing method thereof, com...

Thick polyimide film having improved surface quality and method of...

Circuit material and circuit board containing the same

Manufacturing method of wavelength-converting component

Composite encapsulating material and photovoltaic module including...

Poly(etherimide-phthalonitrile) adhesives and related methods

Adhesive composition and semiconductor device production method

Heat resistant polyimide film

Methods of disassembling apparel products having imine adhesives

Materials for use as adhesive and for surface sealing

Metal particle-containing composition and electrically conductive a...

Fluoropolymer adhesives and methods thereof

Curable resin composition, cured product, adhesive, bonding film, c...

Composition for forming a coating film for removing foreign matters

Electrically conductive adhesive agent composition, and electricall...

Electrically conductive adhesive film and dicing-die bonding film u...

Resin composition, resin layer, permanent adhesive, adhesive for te...

Enhanced adhesive materials and processes for 3D applications

Electrically conductive adhesive film and dicing-die bonding film u...

Wavelength-converting component, projection apparatus and manufactu...

Electrically conductive adhesive film and dicing-die bonding film u...

Patents Applicationslast 30 patents

RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELEC...

ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

RESIN COMPOSITION, POLYIMIDE PREPARATION METHOD AND RELATED PRODUCTS

ALL-AROMATIC LIQUID-CRYSTALLINE HOMO-POLYIMIDES WITH AROMATIC ENDGR...

CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...

HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED...

RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD L...

POLYAMIC ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMI...

POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE, AND L...

CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINT...

THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PRE...

APPLICATION OF LASER-RELEASABLE COMPOSITION

CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...

FLUORINATED POLY(IMIDE-PHTHALONITRILE) ADHESIVE FORMULATIONS AND RE...

PROVISIONAL FIXATION MATERIAL AND METHOD FOR PRODUCING ELECTRONIC C...

METHOD FOR PRODUCING CURED PRODUCT OF HEAT-CURABLE MALEIMIDE RESIN...

CURABLE RESIN COMPOSITION, TEMPORARY FIXING MATERIAL, AND ELECTRONI...

TEMPORARY ADHESION METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE...

CYCLIC IMIDE RESIN COMPOSITION, LIQUID ADHESIVE, FILM, PREPREG, COP...

MULTILAYER STRUCTURE FOR TRANSPORTING OR STORING HYDROGEN

POLY(ETHERIMIDE-PHTHALONITRILE) ADHESIVES AND RELATED METHODS

AMIDE COMPOUND, NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AND CROS...

FLUOROPOLYMER ADHESIVES AND METHODS THEREOF

REACTIVE POLYAMIDEIMIDE OLIGOMERS, METHODS, AND ARTICLES

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...

HEAT-CURABLE CITRACONIMIDE RESIN COMPOSITION

ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD (FPC), AND H...

INSULATED WIRE AND PREPARATION METHOD THEREOF, COIL AND ELECTRONIC/...

POLYIMIDE RESIN COMPOSITION, POLYIMIDE RESIN ADHESIVE LAYER, LAMINA...