Polyimides Polyester-imides Polyamide-imides Polyamide acids or similar polyimide precursors

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CPC
C09J179/08

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CCHEMISTRY METALLURGY C09Paints, dyes C09JADHESIVES NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE USE OF MATERIALS AS ADHESIVES C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00

Current Industry

C09J179/08Polyimides Polyester-imides Polyamide-imides Polyamide acids or similar polyimide precursors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fluoropolymer adhesives and methods thereof
- Patent number 12,275,820
- Issue date Apr 15, 2025
- The Boeing Company
- Ashley M. Dustin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing cured product of heat-curable maleimide resin...
- Patent number 12,264,270
- Issue date Apr 1, 2025
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Interior member for aircraft, manufacturing method of the same, and...
- Patent number 12,168,339
- Issue date Dec 17, 2024
- Mitsubishi Heavy Industries, Ltd.
- Makoto Hirai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat-curable maleimide resin composition
- Patent number 12,162,971
- Issue date Dec 10, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide resin composition, polyimide resin adhesive layer, lamina...
- Patent number 12,157,815
- Issue date Dec 3, 2024
- ECHEM SOLUTIONS CORP.
- Yung-Yu Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition, adhesive agent, adhesive film, circuit s...
- Patent number 12,139,576
- Issue date Nov 12, 2024
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Fluorinated poly(imide-phthalonitrile) adhesive formulations and re...
- Patent number 12,116,504
- Issue date Oct 15, 2024
- The Boeing Company
- Ashley Marie Dustin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polyimides for temporary bonding adhesives, methods for manufacturi...
- Patent number 12,091,508
- Issue date Sep 17, 2024
- Kaneka Americas Holding, Inc.
- Samuel Kyran
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary bonding composition, temporary bonding film, composite fi...
- Patent number 12,043,770
- Issue date Jul 23, 2024
- Daxin Materials Corporation
- Cheng-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated wire and preparation method thereof, coil and electronic/...
- Patent number 12,031,066
- Issue date Jul 9, 2024
- Well Ascent Electronic (Ganzhou) Co., Ltd.
- Huimin Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-curable citraconimide resin composition
- Patent number 12,012,485
- Issue date Jun 18, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting polyimide resin and manufacturing method thereof, com...
- Patent number 11,945,913
- Issue date Apr 2, 2024
- CHIN YEE CHEMICAL INDUSTRIES CO., LTD.
- Pi-Tao Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thick polyimide film having improved surface quality and method of...
- Patent number 11,945,922
- Issue date Apr 2, 2024
- PI Advanced Materials Co., Ltd.
- Won Ho Son
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit material and circuit board containing the same
- Patent number 11,930,595
- Issue date Mar 12, 2024
- Shengyi Technology Co., Ltd.
- Weifeng Yin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Manufacturing method of wavelength-converting component
- Patent number 11,865,575
- Issue date Jan 9, 2024
- Coretronic Corporation
- Yu-Lin Tsai
- G02 - OPTICS
Information Patent Grant
Composite encapsulating material and photovoltaic module including...
- Patent number 11,810,777
- Issue date Nov 7, 2023
- JINKO GREEN ENERGY (SHANGHAI) MANAGEMENT CO., LTD.
- Kun Yu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Poly(etherimide-phthalonitrile) adhesives and related methods
- Patent number 11,795,357
- Issue date Oct 24, 2023
- The Boeing Company
- Kevin James Drummey
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition and semiconductor device production method
- Patent number 11,795,356
- Issue date Oct 24, 2023
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat resistant polyimide film
- Patent number 11,685,811
- Issue date Jun 27, 2023
- Changwei Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods of disassembling apparel products having imine adhesives
- Patent number 11,542,413
- Issue date Jan 3, 2023
- CreateMe Technologies LLC
- Caglar Remzi Becer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Materials for use as adhesive and for surface sealing
- Patent number 11,505,729
- Issue date Nov 22, 2022
- EPG (Engineered Nanoproducts Germany) AG
- Heike Schneider
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal particle-containing composition and electrically conductive a...
- Patent number 11,466,181
- Issue date Oct 11, 2022
- Furukawa Electric Co., Ltd.
- Norzafriza Nitta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluoropolymer adhesives and methods thereof
- Patent number 11,421,080
- Issue date Aug 23, 2022
- The Boeing Company
- Ashley M. Dustin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition, cured product, adhesive, bonding film, c...
- Patent number 11,421,107
- Issue date Aug 23, 2022
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composition for forming a coating film for removing foreign matters
- Patent number 11,319,514
- Issue date May 3, 2022
- NISSAN CHEMICAL CORPORATION
- Takahiro Kishioka
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Electrically conductive adhesive agent composition, and electricall...
- Patent number 11,306,225
- Issue date Apr 19, 2022
- Furukawa Electric Co., Ltd.
- Shunichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,193,047
- Issue date Dec 7, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin layer, permanent adhesive, adhesive for te...
- Patent number 11,186,757
- Issue date Nov 30, 2021
- Toray Industries, Inc.
- Shinji Arimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,136,479
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE AND MULTILAYER STRUCTURE
- Publication number 20250215292
- Publication date Jul 3, 2025
- Industrial Technology Research Institute
- Jauder Jeng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION
- Publication number 20250215293
- Publication date Jul 3, 2025
- Shin-Etsu Polymer Co., Ltd.
- Shiori MOMMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HIGH TEMPERATURE STABLE CURABLE BONDING COMPOSITIONS
- Publication number 20250179339
- Publication date Jun 5, 2025
- 3M Innovative Properties Company
- Naichao Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DOUBLE-SIDED ADHESIVE
- Publication number 20250154379
- Publication date May 15, 2025
- Mitsui Chemicals ICT Materia, Inc.
- Takashi UNEZAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE
- Publication number 20250154395
- Publication date May 15, 2025
- ZACROS Corporation
- Tadahiro NOMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Multifunctional Adhesion Promoter for Semiconductor Device Packages
- Publication number 20250122413
- Publication date Apr 17, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROTECTIVE MASKING TAPE FOR CIRCUIT BOARD TABS
- Publication number 20250122409
- Publication date Apr 17, 2025
- Dell Products L.P.
- Wallace H. ABLES
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...
- Publication number 20250084216
- Publication date Mar 13, 2025
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION
- Publication number 20250059312
- Publication date Feb 20, 2025
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Curable Precursor of an Adhesive Composition
- Publication number 20250059328
- Publication date Feb 20, 2025
- 3M Innovative Properties Company
- Ralph R. Roberts
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE
- Publication number 20250019582
- Publication date Jan 16, 2025
- MITSUI CHEMICALS, INC.
- Ko TAKASE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS
- Publication number 20250014954
- Publication date Jan 9, 2025
- Soham Agarwal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELEC...
- Publication number 20240400825
- Publication date Dec 5, 2024
- TORAY INDUSTRIES, INC.
- Akira Shimada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...
- Publication number 20240376348
- Publication date Nov 14, 2024
- TORAY INDUSTRIES, INC.
- Yukari ARIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, POLYIMIDE PREPARATION METHOD AND RELATED PRODUCTS
- Publication number 20240336738
- Publication date Oct 10, 2024
- AAC TECHNOLOGIES (NANJING) CO., LTD.
- Yilan Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ALL-AROMATIC LIQUID-CRYSTALLINE HOMO-POLYIMIDES WITH AROMATIC ENDGR...
- Publication number 20240294813
- Publication date Sep 5, 2024
- Government of the United States, as represented by the Secretary of the Air F...
- Loon-Seng Tan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...
- Publication number 20240247128
- Publication date Jul 25, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED...
- Publication number 20240191029
- Publication date Jun 13, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masayuki IWASAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD L...
- Publication number 20240191030
- Publication date Jun 13, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kazuyoshi YAMAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYAMIC ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMI...
- Publication number 20240182765
- Publication date Jun 6, 2024
- MITSUI CHEMICALS, INC.
- Masaki OKAZAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE, AND L...
- Publication number 20240182645
- Publication date Jun 6, 2024
- MITSUI CHEMICALS, INC.
- Masaki OKAZAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINT...
- Publication number 20240117120
- Publication date Apr 11, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PRE...
- Publication number 20240043637
- Publication date Feb 8, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kazuyoshi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF LASER-RELEASABLE COMPOSITION
- Publication number 20240010892
- Publication date Jan 11, 2024
- MICROCOSM TECHNOLOGY CO., LTD.
- Bo-Hung Lai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...
- Publication number 20230416466
- Publication date Dec 28, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORINATED POLY(IMIDE-PHTHALONITRILE) ADHESIVE FORMULATIONS AND RE...
- Publication number 20230392055
- Publication date Dec 7, 2023
- The Boeing Company
- Ashley Marie Dustin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROVISIONAL FIXATION MATERIAL AND METHOD FOR PRODUCING ELECTRONIC C...
- Publication number 20230348767
- Publication date Nov 2, 2023
- Sekisui Chemical Co., Ltd
- Izumi DAIDO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING CURED PRODUCT OF HEAT-CURABLE MALEIMIDE RESIN...
- Publication number 20230340299
- Publication date Oct 26, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION, TEMPORARY FIXING MATERIAL, AND ELECTRONI...
- Publication number 20230312923
- Publication date Oct 5, 2023
- Sekisui Chemical Co., Ltd
- Toshio TAKAHASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Polyimides Polyester-imides Polyamide-imides Polyamide acids or similar polyimide precursors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fluoropolymer adhesives and methods thereof

Method for producing cured product of heat-curable maleimide resin...

Interior member for aircraft, manufacturing method of the same, and...

Heat-curable maleimide resin composition

Polyimide resin composition, polyimide resin adhesive layer, lamina...

Curable resin composition, adhesive agent, adhesive film, circuit s...

Fluorinated poly(imide-phthalonitrile) adhesive formulations and re...

Polyimides for temporary bonding adhesives, methods for manufacturi...

Temporary bonding composition, temporary bonding film, composite fi...

Insulated wire and preparation method thereof, coil and electronic/...

Heat-curable citraconimide resin composition

Thermosetting polyimide resin and manufacturing method thereof, com...

Thick polyimide film having improved surface quality and method of...

Circuit material and circuit board containing the same

Manufacturing method of wavelength-converting component

Composite encapsulating material and photovoltaic module including...

Poly(etherimide-phthalonitrile) adhesives and related methods

Adhesive composition and semiconductor device production method

Heat resistant polyimide film

Methods of disassembling apparel products having imine adhesives

Materials for use as adhesive and for surface sealing

Metal particle-containing composition and electrically conductive a...

Fluoropolymer adhesives and methods thereof

Curable resin composition, cured product, adhesive, bonding film, c...

Composition for forming a coating film for removing foreign matters

Electrically conductive adhesive agent composition, and electricall...

Electrically conductive adhesive film and dicing-die bonding film u...

Resin composition, resin layer, permanent adhesive, adhesive for te...

Enhanced adhesive materials and processes for 3D applications

Electrically conductive adhesive film and dicing-die bonding film u...

Patents Applicationslast 30 patents

ADHESIVE AND MULTILAYER STRUCTURE

ADHESIVE COMPOSITION

HIGH TEMPERATURE STABLE CURABLE BONDING COMPOSITIONS

DOUBLE-SIDED ADHESIVE

ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE

Multifunctional Adhesion Promoter for Semiconductor Device Packages

PROTECTIVE MASKING TAPE FOR CIRCUIT BOARD TABS

CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION

Curable Precursor of an Adhesive Composition

POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE

HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS

RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELEC...

ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

RESIN COMPOSITION, POLYIMIDE PREPARATION METHOD AND RELATED PRODUCTS

ALL-AROMATIC LIQUID-CRYSTALLINE HOMO-POLYIMIDES WITH AROMATIC ENDGR...

CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...

HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED...

RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD L...

POLYAMIC ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMI...

POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE, AND L...

CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINT...

THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PRE...

APPLICATION OF LASER-RELEASABLE COMPOSITION

CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...

FLUORINATED POLY(IMIDE-PHTHALONITRILE) ADHESIVE FORMULATIONS AND RE...

PROVISIONAL FIXATION MATERIAL AND METHOD FOR PRODUCING ELECTRONIC C...

METHOD FOR PRODUCING CURED PRODUCT OF HEAT-CURABLE MALEIMIDE RESIN...

CURABLE RESIN COMPOSITION, TEMPORARY FIXING MATERIAL, AND ELECTRONI...