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RESIN COMPOSITION, MOLDED BODY, AND FILM
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POLYIMIDE RESIN COMPOSITION AND MOLDED BODY
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MANUFACTURING METHOD OF PACKAGE
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Taiwan Semiconductor Manufacturing Company, Ltd.
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RESIN COMPOSITION
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Publication number 20240317985
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Publication date Sep 26, 2024
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Rohm and Haas Electronic Materials L.L.C.
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RESIN COMPOSITION
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Publication date Jul 11, 2024
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Nan Ya Plastics Corporation
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Mitsubishi Gas Chemical Company, Inc.
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Momoko YAMASHITA
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RESIN COMPOSITION, FORMED ARTICLE AND FILM
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Publication number 20240199878
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Publication date Jun 20, 2024
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Kaneka Corporation
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Kohei Ogawa
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RESIN COMPOSITION
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Publication number 20240166874
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Nan Ya Plastics Corporation
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RESIN COMPOSITION AND ARTICLE MADE THEREFROM
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ELITE MATERIAL CO., LTD.
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