Polyphenylene oxides

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CPC
C08J2471/12

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CCHEMISTRY METALLURGY C08Organic compounds C08JWORKING-UP GENERAL PROCESSES OF COMPOUNDING AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G C08J2471/00Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain Derivatives of such polymers

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C08J2471/12Polyphenylene oxides

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Patents Grantslast 30 patents

Information Patent Grant
Resin composition, resin sheet, cured film, method for producing cu...
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- Toray Industries, Inc.
- Keika Hashimoto
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Resin composition suitable for use as film for film capacitor
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Resin composition, prepreg, film with resin, metal foil with resin,...
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Resin composition and article made therefrom
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- Issue date Jul 16, 2024
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
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Radome substrate and preparation method thereof
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- Kuang-Chi Cutting Edge Technology Ltd.
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Multilayer composite rubber-plastic foam insulation material and pr...
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Material systems and methods of manufacture for auxetic foams
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- The Florida State University Research Foundation, Inc.
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Polymer electrolyte membrane, method for manufacturing same, and me...
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Resin composition and article made therefrom
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Resin composition, laminate sheet, and multilayer printed wiring board
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Circuit board using low dielectric resin composition
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Thermosetting resin composition, prepreg, laminate, and printed cir...
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Method for preparing benzoxazine-containing resin composition, and...
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Resin composition and article made therefrom
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- ELITE MATERIAL CO., LTD.
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Method for preparing carbon nanotube/polymer composite
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- Tianjin University
- Wei Feng
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Information Patent Grant
Resin composition and article made therefrom
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Allyl-containing resin and uses of the same
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- Chang Chun Plastics Co., Ltd.
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Halogen-free low dielectric resin composition, and pre-preg, metal-...
- Patent number 11,124,614
- Issue date Sep 21, 2021
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Halogen-free low dielectric resin composition, and prepreg, metal-c...
- Patent number 11,015,052
- Issue date May 25, 2021
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Multilayer transmission line plate
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Primer composition and copper foil substrate using the same
- Patent number 10,917,964
- Issue date Feb 9, 2021
- Industrial Technology Research Institute
- Shi-Ing Huang
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

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RESIN COMPOSITION AND ARTICLE MADE THEREFROM
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RESIN COMPOSITION AND USES THEREOF
- Publication number 20240301189
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- TAIWAN UNION TECHNOLOGY CORPORATION
- Jen-Chi CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPOLYMER, RESIN COMPOSITION COMPRISING THE SAME AND ARTICLE MADE...
- Publication number 20240294745
- Publication date Sep 5, 2024
- ELITE MATERIAL CO., LTD.
- Yi-Fei YU
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LOW DIELECTRIC RESIN COMPOSITION AND AN ARTICLE OF MANUFACTURE PREP...
- Publication number 20240182613
- Publication date Jun 6, 2024
- HUNTSMAN ADVANCED MATERIALS LICENSING (SWITZERLAND) GMBH
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LIQUID CRYSTAL POLYMER FILM AND METHOD FOR PRODUCING LIQUID CRYSTAL...
- Publication number 20240182655
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- Murata Manufacturing Co., Ltd.
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RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20240182702
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- Elite Electronic Material (kunShan) Co., Ltd.
- Rongtao WANG
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RESIN COMPOSITION
- Publication number 20240174849
- Publication date May 30, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
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RESIN COMPOSITION AND USES THEREOF
- Publication number 20240150567
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- TAIWAN UNION TECHNOLOGY CORPORATION
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- B32 - LAYERED PRODUCTS
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HIGHLY FILLER-FILLED HIGHLY THERMALLY-CONDUCTIVE THIN SHEET HAVING...
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- TAKAGI CHEMICALS, INC.
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THERMOFORMABLE POLYMERIC SHEETS BASED ON PSEUDO-AMORPHOUS POLYARYLE...
- Publication number 20240101769
- Publication date Mar 28, 2024
- Arkema France
- Roderick REBER
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Information Patent Application
RESIN COMPOSITION SUITABLE FOR USE AS FILM FOR FILM CAPACITOR
- Publication number 20240093016
- Publication date Mar 21, 2024
- OJI HOLDINGS CORPORATION
- Takumi SUEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING COMPATIBILITY OF THERMOSETTING RESIN COMPOSIT...
- Publication number 20230392002
- Publication date Dec 7, 2023
- Shuichi ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
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LOW COMPRESSION SET THERMOPLASTIC GEL AND CABLE GEL SEAL ARRANGEMENT
- Publication number 20230348676
- Publication date Nov 2, 2023
- CommScope Technologies LLC
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MATERIAL SYSTEMS AND METHODS OF MANUFACTURE FOR AUXETIC FOAMS
- Publication number 20230182358
- Publication date Jun 15, 2023
- The Florida State University Research Foundation, Inc.
- Changchun Zeng
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20230167297
- Publication date Jun 1, 2023
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LEAD-FREE THREE-COMPONENT PIEZOELECTRIC POLYMER COMPOSITE
- Publication number 20230141847
- Publication date May 11, 2023
- SABIC Global Technologies B.V.
- Soma GUHATHAKURTA
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PIEZOELECTRIC POLYMER BLEND AND COMPOSITE COMPOSITIONS INCLUDING LI...
- Publication number 20230127574
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- SABIC Global Technologies B.V.
- Soma GUHATHAKURTA
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Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20230101785
- Publication date Mar 30, 2023
- Elite Electronic Material (kunShan) Co., Ltd.
- Rongtao WANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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REGENERATED ALLOY MATERIAL BASED ON CHEMICAL AND PHYSICAL CO-MODIFI...
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- CHINA NATIONAL ELECTRIC APPARATUS RESEARCH INSTITUTE CO., LTD.
- Nuo CAO
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THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED C...
- Publication number 20230045848
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- Shengyi Technology Co., Ltd.
- Huayong FAN
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THERMOSETTING RESIN MATERIAL, PREPREG, AND METAL SUBSTRATE
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- Nan Ya Plastics Corporation
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ALLYL-CONTAINING RESIN AND USES OF THE SAME
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Polyphenylene oxides

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin composition, resin sheet, cured film, method for producing cu...

Resin composition suitable for use as film for film capacitor

Thermosetting resin composition and prepreg, laminate and printed c...

Resin composition, prepreg, film with resin, metal foil with resin,...

Resin composition, prepreg, metal foil-clad laminate, resin sheet,...

Piezoelectric polymer blend and composite compositions including li...

Resin composition and article made therefrom

Resin composition, prepreg for printed circuit and metal-coated lam...

Resin composition, prepreg, resin-equipped film, resin-equipped met...

Prepreg and method for manufacturing molded prepreg article

Adhesive composition for semiconductor circuit connection and adhes...

Latex composition for dip-forming, method for preparing the composi...

Low compression set thermoplastic gel and cable gel seal arrangement

Radome substrate and preparation method thereof

Multilayer composite rubber-plastic foam insulation material and pr...

Material systems and methods of manufacture for auxetic foams

Polymer electrolyte membrane, method for manufacturing same, and me...

Resin composition and article made therefrom

Resin composition, laminate sheet, and multilayer printed wiring board

Circuit board using low dielectric resin composition

Thermosetting resin composition, prepreg, laminate, and printed cir...

Method for preparing benzoxazine-containing resin composition, and...

Resin composition and article made therefrom

Method for preparing carbon nanotube/polymer composite

Resin composition and article made therefrom

Allyl-containing resin and uses of the same

Halogen-free low dielectric resin composition, and pre-preg, metal-...

Halogen-free low dielectric resin composition, and prepreg, metal-c...

Multilayer transmission line plate

Primer composition and copper foil substrate using the same

Patents Applicationslast 30 patents

DIELECTRIC FILM-FORMING COMPOSITION

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

RESIN COMPOSITION AND USES THEREOF

PREPOLYMER, RESIN COMPOSITION COMPRISING THE SAME AND ARTICLE MADE...

LOW DIELECTRIC RESIN COMPOSITION AND AN ARTICLE OF MANUFACTURE PREP...

LIQUID CRYSTAL POLYMER FILM AND METHOD FOR PRODUCING LIQUID CRYSTAL...

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

RESIN COMPOSITION

RESIN COMPOSITION AND USES THEREOF

HIGHLY FILLER-FILLED HIGHLY THERMALLY-CONDUCTIVE THIN SHEET HAVING...

THERMOFORMABLE POLYMERIC SHEETS BASED ON PSEUDO-AMORPHOUS POLYARYLE...

RESIN COMPOSITION SUITABLE FOR USE AS FILM FOR FILM CAPACITOR

METHOD FOR EVALUATING COMPATIBILITY OF THERMOSETTING RESIN COMPOSIT...

LOW COMPRESSION SET THERMOPLASTIC GEL AND CABLE GEL SEAL ARRANGEMENT

MATERIAL SYSTEMS AND METHODS OF MANUFACTURE FOR AUXETIC FOAMS

RESIN COMPOSITION

LEAD-FREE THREE-COMPONENT PIEZOELECTRIC POLYMER COMPOSITE

PIEZOELECTRIC POLYMER BLEND AND COMPOSITE COMPOSITIONS INCLUDING LI...

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

REGENERATED ALLOY MATERIAL BASED ON CHEMICAL AND PHYSICAL CO-MODIFI...

THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED C...

THERMOSETTING RESIN MATERIAL, PREPREG, AND METAL SUBSTRATE

NON-HALOGENATED FLAME RETARDANT AND REINFORCED POLY(ALKYLENE TEREPH...

CONDUCTIVE RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOL...

RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED MET...

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN,...

RESIN COMPOSITION, CURED MOLDED ARTICLE, FIBER-REINFORCED PLASTIC M...

RESIN COMPOSITION, PREPREG FOR PRINTED CIRCUIT AND METAL-COATED LAM...

MULTILAYER COMPOSITE RUBBER-PLASTIC FOAM INSULATION MATERIAL AND PR...

ALLYL-CONTAINING RESIN AND USES OF THE SAME