Polyphenylene oxides

Industry

CPC
C09J171/12

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

CCHEMISTRY METALLURGY C09Paints, dyes C09JADHESIVES NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE USE OF MATERIALS AS ADHESIVES C09J171/00Adhesives based on polyethers obtained by reactions forming an ether link in the main chain Adhesives based on derivatives of such polymers

Current Industry

C09J171/12Polyphenylene oxides

Industries

Patents Grantslast 30 patents

Information Patent Grant
Composition comprising maleimide pre-polymerized resin
- Patent number 12,122,912
- Issue date Oct 22, 2024
- ELITE MATERIAL CO., LTD.
- Shu-Hao Chang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit material and circuit board containing the same
- Patent number 11,930,595
- Issue date Mar 12, 2024
- Shengyi Technology Co., Ltd.
- Weifeng Yin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition for semiconductor circuit connection and adhes...
- Patent number 11,834,415
- Issue date Dec 5, 2023
- LG Chem, Ltd.
- Ju Hyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition and use thereof
- Patent number 11,702,507
- Issue date Jul 18, 2023
- Shikoku Chemicals Corporation
- Akihito Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, and prepreg and circuit material using the same
- Patent number 11,584,851
- Issue date Feb 21, 2023
- SHENGYI TECHNOLOGY CO., LTD.
- Jianying Shi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Poly(arylene ether) copolymer
- Patent number 11,505,699
- Issue date Nov 22, 2022
- SHPP Global Technologies B.V.
- Huseyin Tas
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin composition
- Patent number 11,091,627
- Issue date Aug 17, 2021
- Sumitomo Seika Chemicals Co., Ltd.
- Noriaki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polyphenyl ether resin composition and use thereof in high-frequenc...
- Patent number 10,745,599
- Issue date Aug 18, 2020
- Shengyi Technology Co., Ltd.
- Guangbing Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Workpiece treating method, semiconductor device, process for manufa...
- Patent number 10,679,886
- Issue date Jun 9, 2020
- JSR Corporation
- Hiroyuki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyphenylene ether oligomer and high-frequency copper clad laminate
- Patent number 10,358,585
- Issue date Jul 23, 2019
- Industrial Technology Research Institute
- Cheng-Po Kuo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition, semiconductor device containing cured product...
- Patent number 10,294,395
- Issue date May 21, 2019
- Toray Industries, Inc.
- Kazuyuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,202,519
- Issue date Feb 12, 2019
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,066,118
- Issue date Sep 4, 2018
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermoplastic temporary adhesive for silicon handler with infra-red...
- Patent number 9,947,567
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,807,870
- Issue date Oct 31, 2017
- Fujikura Ltd.
- Naomi Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hot melt pressure sensitive adhesive and thermoset comprising styre...
- Patent number 9,752,068
- Issue date Sep 5, 2017
- Kraton Polymers US LLC
- Jason Drew Gillen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photocurable sheet-type adhesive composition for optical use
- Patent number 9,562,172
- Issue date Feb 7, 2017
- Three Bond Fine Chemical Co., Ltd.
- Yoshiaki Koga
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition containing resin having carbon-carbon multiple...
- Patent number 9,505,962
- Issue date Nov 29, 2016
- Nissan Chemical Industries, Ltd.
- Hiroshi Ogino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dielectric materials, methods of forming subassemblies therefrom, a...
- Patent number 9,265,160
- Issue date Feb 16, 2016
- Rogers Corporation
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Reversible thermoset adhesives
- Patent number 9,260,640
- Issue date Feb 16, 2016
- Cornerstone Research Group, Inc.
- Benjamin C. Mac Murray
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit materials with improved bond, method of manufacture thereof...
- Patent number 8,722,192
- Issue date May 13, 2014
- World Properties, Inc.
- Sankar K. Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dielectric materials, methods of forming subassemblies therefrom, a...
- Patent number 8,632,874
- Issue date Jan 21, 2014
- Rogers Corporation
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit materials with improved bond, method of manufacture thereof...
- Patent number 8,431,222
- Issue date Apr 30, 2013
- World Properties, Inc.
- Sankar K. Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Poly(arylene ether) adhesive compositions
- Patent number 7,090,920
- Issue date Aug 15, 2006
- General Electric Company
- Michael J. Davis
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Poly(arylene ether) adhesive compositions
- Patent number 6,906,120
- Issue date Jun 14, 2005
- General Electric
- Michael J. Davis
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Pressure sensitive adhesive composition
- Patent number 6,777,080
- Issue date Aug 17, 2004
- 3M Innovative Properties Company
- Ashish Kumar Khandpur
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive for electroless plating and method of producing the same
- Patent number 6,359,035
- Issue date Mar 19, 2002
- Ibiden Co., Ltd.
- Yoshitaka Ono
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition containing a block copolymer composition and p...
- Patent number 6,277,488
- Issue date Aug 21, 2001
- 3M Innovative Properties Company
- James J. Kobe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING BONDED BODY
- Publication number 20240300213
- Publication date Sep 12, 2024
- Resonac Corporation
- Nobuyuki TAKAHASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE RESIN COMPOSITION AND ADHESIVE FILM
- Publication number 20230279278
- Publication date Sep 7, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Takahiro YOSHIOKA
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITION COMPRISING MALEIMIDE PRE-POLYMERIZED RESIN
- Publication number 20230135428
- Publication date May 4, 2023
- ELITE MATERIAL CO., LTD.
- SHU-HAO CHANG
- B32 - LAYERED PRODUCTS
Information Patent Application
POLY(ARYLENE ETHER) COPOLYMER
- Publication number 20230069911
- Publication date Mar 9, 2023
- SHPP Global Technologies B.V.
- Huseyin Tas
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION AND USE THEREOF
- Publication number 20220185960
- Publication date Jun 16, 2022
- SHIKOKU CHEMICALS CORPORATION
- Akihito OTSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIRE WITH ETHYLENE-VINYL ALCOHOL COPOLYMER INNERLINER
- Publication number 20220169076
- Publication date Jun 2, 2022
- The Goodyear Tire and Rubber Company
- Dinesh Chandra
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT MATERIAL AND CIRCUIT BOARD CONTAINING THE SAME
- Publication number 20210307164
- Publication date Sep 30, 2021
- Shengyi Technology Co., Ltd.
- Weifeng YIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, AND PREPREG AND CIRCUIT MATERIAL USING THE SAME
- Publication number 20210301130
- Publication date Sep 30, 2021
- Shengyi Technology Co., Ltd.
- Jianying SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILLER-CONTAINING FILM
- Publication number 20210238456
- Publication date Aug 5, 2021
- DEXERIALS CORPORATION
- Makoto MATSUBARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION AND ADHES...
- Publication number 20200308121
- Publication date Oct 1, 2020
- LG CHEM, LTD.
- Ju Hyeon KIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLY(ARYLENE ETHER) COPOLYMER
- Publication number 20200109281
- Publication date Apr 9, 2020
- SABIC Global Technologies B.V.
- Huseyin Tas
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN COMPOSITION
- Publication number 20190322858
- Publication date Oct 24, 2019
- Sumitomo Seika Chemicals Co., Ltd.
- Noriaki FUKUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WORKPIECE TREATING METHOD, SEMICONDUCTOR DEVICE, PROCESS FOR MANUFA...
- Publication number 20190157128
- Publication date May 23, 2019
- JSR Corporation
- Hiroyuki ISHII
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20190092963
- Publication date Mar 28, 2019
- Sekisui Chemical Co., Ltd
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, SEMI-CURED THERMALLY CONDUCTIVE FILM USING SAME,...
- Publication number 20180298186
- Publication date Oct 18, 2018
- Kaneka Corporation
- Shusuke Yoshihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION AND METHOD FOR BONDING
- Publication number 20180244965
- Publication date Aug 30, 2018
- LORD CORPORATION
- Douglas H. MOWREY
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
POLYPHENYL ETHER RESIN COMPOSITION AND USE THEREOF IN HIGH-FREQUENC...
- Publication number 20180215971
- Publication date Aug 2, 2018
- Shengyi Technology Co., Ltd.
- Guangbing CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION AND COMPOSITE SUBSTRATE EMPLOYING THE SAME
- Publication number 20180179424
- Publication date Jun 28, 2018
- Industrial Technology Research Institute
- Jyh-Long JENG
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED...
- Publication number 20180174882
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Bing Dang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BISMALEIMIDE RESINS FOR ONE DROP FILL SEALANT APPLICATION
- Publication number 20180134657
- Publication date May 17, 2018
- Henkel IP & Holging GmbH
- Laxmisha M. Sridhar
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MONOMERIC AND OLIGOMERIC RESINS FOR ONE DROP FILL SEALANT APPLICATION
- Publication number 20180134839
- Publication date May 17, 2018
- Henkel IP & Holding GmbH
- Laxmisha M. Sridhar
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE CONTAINING CURED PRODUCT...
- Publication number 20170362472
- Publication date Dec 21, 2017
- TORAY INDUSTRIES, INC.
- Kazuyuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20170233599
- Publication date Aug 17, 2017
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20170048968
- Publication date Feb 16, 2017
- FUJIKURA LTD.
- Naomi KOMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...
- Publication number 20160351532
- Publication date Dec 1, 2016
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED...
- Publication number 20160284582
- Publication date Sep 29, 2016
- International Business Machines Corporation
- Bing Dang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COVERLAY ADHESIVE COMPOSITION
- Publication number 20160137890
- Publication date May 19, 2016
- E I DU PONT DE NEMOURS AND COMPANY
- TUNG LIN LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, A...
- Publication number 20140090767
- Publication date Apr 3, 2014
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Application
RUBBER COMPOSITE REINFORCED WITH A TEXTILE MATERIAL PROVIDED WITH A...
- Publication number 20140051312
- Publication date Feb 20, 2014
- Michelin Recherche et Technique S.A.
- Vincent Abad
- B60 - VEHICLES IN GENERAL
Information Patent Application
ADHESIVE COMPOSITION CONTAINING RESIN HAVING CARBON-CARBON MULTIPLE...
- Publication number 20130177763
- Publication date Jul 11, 2013
- Nissan Chemical Industries, Ltd.
- Hiroshi Ogino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Polyphenylene oxides

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composition comprising maleimide pre-polymerized resin

Circuit material and circuit board containing the same

Adhesive composition for semiconductor circuit connection and adhes...

Resin composition and use thereof

Resin composition, and prepreg and circuit material using the same

Poly(arylene ether) copolymer

Epoxy resin composition

Alignment method, method for connecting electronic component, metho...

Inkjet adhesive, manufacturing method for semiconductor device, and...

Polyphenyl ether resin composition and use thereof in high-frequenc...

Workpiece treating method, semiconductor device, process for manufa...

Polyphenylene ether oligomer and high-frequency copper clad laminate

Adhesive composition, semiconductor device containing cured product...

Inkjet adhesive, manufacturing method for semiconductor device, and...

Inkjet adhesive, manufacturing method for semiconductor device, and...

Thermoplastic temporary adhesive for silicon handler with infra-red...

Printed wiring board

Hot melt pressure sensitive adhesive and thermoset comprising styre...

Photocurable sheet-type adhesive composition for optical use

Adhesive composition containing resin having carbon-carbon multiple...

Dielectric materials, methods of forming subassemblies therefrom, a...

Reversible thermoset adhesives

Circuit materials with improved bond, method of manufacture thereof...

Dielectric materials, methods of forming subassemblies therefrom, a...

Circuit materials with improved bond, method of manufacture thereof...

Poly(arylene ether) adhesive compositions

Poly(arylene ether) adhesive compositions

Pressure sensitive adhesive composition

Adhesive for electroless plating and method of producing the same

Adhesive composition containing a block copolymer composition and p...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING BONDED BODY

ADHESIVE RESIN COMPOSITION AND ADHESIVE FILM

COMPOSITION COMPRISING MALEIMIDE PRE-POLYMERIZED RESIN

POLY(ARYLENE ETHER) COPOLYMER

RESIN COMPOSITION AND USE THEREOF

TIRE WITH ETHYLENE-VINYL ALCOHOL COPOLYMER INNERLINER

CIRCUIT MATERIAL AND CIRCUIT BOARD CONTAINING THE SAME

RESIN COMPOSITION, AND PREPREG AND CIRCUIT MATERIAL USING THE SAME

FILLER-CONTAINING FILM

ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION AND ADHES...

POLY(ARYLENE ETHER) COPOLYMER

EPOXY RESIN COMPOSITION

WORKPIECE TREATING METHOD, SEMICONDUCTOR DEVICE, PROCESS FOR MANUFA...

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

RESIN COMPOSITION, SEMI-CURED THERMALLY CONDUCTIVE FILM USING SAME,...

ADHESIVE COMPOSITION AND METHOD FOR BONDING

POLYPHENYL ETHER RESIN COMPOSITION AND USE THEREOF IN HIGH-FREQUENC...

ADHESIVE COMPOSITION AND COMPOSITE SUBSTRATE EMPLOYING THE SAME

THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED...

BISMALEIMIDE RESINS FOR ONE DROP FILL SEALANT APPLICATION

MONOMERIC AND OLIGOMERIC RESINS FOR ONE DROP FILL SEALANT APPLICATION

ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE CONTAINING CURED PRODUCT...

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

PRINTED WIRING BOARD

ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...

THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED...

COVERLAY ADHESIVE COMPOSITION

DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, A...

RUBBER COMPOSITE REINFORCED WITH A TEXTILE MATERIAL PROVIDED WITH A...

ADHESIVE COMPOSITION CONTAINING RESIN HAVING CARBON-CARBON MULTIPLE...