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Rapid approach, then slow, then pressure for clamping, bonding

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  • CPC
  • G05B2219/43149
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Parent Industries

GPHYSICS G05Controlling systems G05BCONTROL OR REGULATING SYSTEMS IN GENERAL FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS G05B2219/00Program-control systems

Current Industry

G05B2219/43149Rapid approach, then slow, then pressure for clamping, bonding
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Patents Grantslast 30 patents

  • Information Patent Grant

    Motor controller
    • Patent number 8,928,267
    • Issue date Jan 6, 2015
    • Mitsubishi Electric Corporation
    • Yuji Igarashi
    • G05 - CONTROLLING REGULATING
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 4,444,349
    • Issue date Apr 24, 1984
    • Kulicke & Soffa Industries, Inc.
    • Glenn B. Bilane
    • G05 - CONTROLLING REGULATING
  • Information Patent Grant

    High speed wire bonding method
    • Patent number 4,340,166
    • Issue date Jul 20, 1982
    • Kulicke & Soffa Industries, Inc.
    • Glenn B. Bilane
    • G05 - CONTROLLING REGULATING
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 4,266,710
    • Issue date May 12, 1981
    • Kulicke and Soffa Industries Inc.
    • Glenn B. Bilane
    • G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents