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B28D5/0029

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BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

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B28D5/0029rotating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dividing device for wafer
- Patent number 12,036,700
- Issue date Jul 16, 2024
- NAKAMURA-TOME PRECISION INDUSTRY CO., LTD.
- Tsuyoshi Naya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming integrated circuit devices using cutting tools t...
- Patent number 11,348,798
- Issue date May 31, 2022
- AKOUSTIS, INC.
- Robert C. Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for dividing workpiece
- Patent number 10,818,523
- Issue date Oct 27, 2020
- Disco Corporation
- Chris Mihai
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for dividing substrate along division lines using abrasive m...
- Patent number 10,515,841
- Issue date Dec 24, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer and wafer processing system
- Patent number 9,935,010
- Issue date Apr 3, 2018
- Disco Corporation
- Karl Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separation apparatuses for separating sheets of brittle material an...
- Patent number 9,556,056
- Issue date Jan 31, 2017
- Corning Incorporated
- Keith Mitchell Hill
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer divider and wafer division method
- Patent number 9,472,459
- Issue date Oct 18, 2016
- Disco Corporation
- Naotoshi Kirihara
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Separation apparatuses for separating sheets of brittle material an...
- Patent number 9,126,857
- Issue date Sep 8, 2015
- Corning Incorporated
- Keith Mitchell Hill
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Device and method for cutting off substrate of fragile material
- Patent number 8,276,796
- Issue date Oct 2, 2012
- Mitsuboshi Diamond Industrial Co., Ltd.
- Yuki Nishisaka
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
System for breaking a semiconductor wafer or other workpiece along...
- Patent number 8,220,685
- Issue date Jul 17, 2012
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Processing method of wafer
- Patent number 7,622,328
- Issue date Nov 24, 2009
- Disco Corporation
- Takatoshi Masuda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of manufacturing device having adhesive film on back-side su...
- Patent number 7,598,156
- Issue date Oct 6, 2009
- Disco Corporation
- Masaru Nakamura
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for the low-contamination, automatic crushing...
- Patent number 7,549,600
- Issue date Jun 23, 2009
- Wacker-Chemie GmbH
- Karl Hesse
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Flat display panel and method of dividing the flat display panel
- Patent number 7,439,665
- Issue date Oct 21, 2008
- Mitsuboshi Diamond Industrial Co., Ltd.
- Haruo Wakayama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Scribing system with particle remover
- Patent number 7,415,916
- Issue date Aug 26, 2008
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Breaking apparatus for ceramic board
- Patent number 6,098,861
- Issue date Aug 8, 2000
- Rohm Co., Ltd.
- Eiji Inoue
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Decorative cracked glass mirror tile and method
- Patent number 5,277,952
- Issue date Jan 11, 1994
- Edward W. Watras
- B44 - DECORATIVE ARTS
Information Patent Grant
Method for batch cleaving semiconductor wafers and coating cleaved...
- Patent number 5,171,717
- Issue date Dec 15, 1992
- International Business Machines Corporation
- Ronald F. Broom
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for cleaving wafers
- Patent number 4,995,539
- Issue date Feb 26, 1991
- Heinz Richard
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for cutting workpieces of glass, ceramics, and like material
- Patent number 4,940,176
- Issue date Jul 10, 1990
- Yasuo Sato
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor wafer breaking apparatus
- Patent number 4,775,085
- Issue date Oct 4, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Masahiro Ishizuka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for manipulating a stretched resilient diaphragm
- Patent number 4,410,168
- Issue date Oct 18, 1983
- Asta, Ltd.
- Alexander Gotman
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of manufacturing a permanent magnet which is to be arranged...
- Patent number 4,369,567
- Issue date Jan 25, 1983
- U.S. Philips Corporation
- Gerrit Bosch
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Control of small parts in a manufacturing operation
- Patent number 4,296,542
- Issue date Oct 27, 1981
- Presco, Inc.
- Alexander Gotman
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for separating snapstrates into individual hybrid substrates
- Patent number 4,195,758
- Issue date Apr 1, 1980
- GTE Automatic Electric Laboratories, Incorporated
- John H. Morgan
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Multiple ball element wafer breaking apparatus
- Patent number 4,044,937
- Issue date Aug 30, 1977
- International Business Machines Corporation
- Thomas Hill
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Backside laser dicing system
- Patent number 3,970,819
- Issue date Jul 20, 1976
- International Business Machines Corporation
- Gerald Alan Gates
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3870196
- Patent number 3,870,196
- Issue date Mar 11, 1975
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3790051
- Patent number 3,790,051
- Issue date Feb 5, 1974
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3786973
- Patent number 3,786,973
- Issue date Jan 22, 1974
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
DIVIDING METHOD OF WORKPIECE
- Publication number 20230102150
- Publication date Mar 30, 2023
- Disco Corporation
- Yohei MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE MANAGEMENT METHOD AND SHEET CUTTING MACHINE
- Publication number 20220020696
- Publication date Jan 20, 2022
- Disco Corporation
- Yoshinobu SAITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT DEVICES USING CUTTING TOOLS T...
- Publication number 20210249272
- Publication date Aug 12, 2021
- Akoustis, Inc.
- Robert C. Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIVIDING DEVICE FOR WAFER
- Publication number 20210129380
- Publication date May 6, 2021
- NAKAMURA-TOME PRECISION INDUSTRY CO., LTD.
- Tsuyoshi NAYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WORKPIECE
- Publication number 20180286753
- Publication date Oct 4, 2018
- Disco Corporation
- Kenji Takenouchi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF PROCESSING A WAFER AND WAFER PROCESSING SYSTEM
- Publication number 20170365519
- Publication date Dec 21, 2017
- Disco Corporation
- Karl Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DIVIDER AND WAFER DIVISION METHOD
- Publication number 20160247723
- Publication date Aug 25, 2016
- Disco Corporation
- Naotoshi Kirihara
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEPARATION APPARATUSES FOR SEPARATING SHEETS OF BRITTLE MATERIAL AN...
- Publication number 20150321941
- Publication date Nov 12, 2015
- Corning Incorporated
- Keith Mitchell Hill
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEPARATION APPARATUSES FOR SEPARATING SHEETS OF BRITTLE MATERIAL AN...
- Publication number 20140130552
- Publication date May 15, 2014
- Keith Mitchell Hill
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DEVICE FOR SEPARATION OF A STACKED STRUCTURE AND ASSOCIATED METHOD
- Publication number 20120261076
- Publication date Oct 18, 2012
- Hubert Moriceau
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WORKING METHOD FOR SAPPHIRE SUBSTRATE
- Publication number 20110294279
- Publication date Dec 1, 2011
- Disco Corporation
- Takashi Okamura
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DEVICE AND METHOD FOR CUTTING OFF SUBSTRATE OF FRAGILE MATERIAL
- Publication number 20100065599
- Publication date Mar 18, 2010
- MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
- Yuki Nishisaka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF MANUFACTURING DEVICE HAVING ADHESIVE FILM ON BACK-SIDE SU...
- Publication number 20090075458
- Publication date Mar 19, 2009
- Disco Corporation
- Masaru Nakamura
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Sheet separation through fluid impact
- Publication number 20080110952
- Publication date May 15, 2008
- Marvin William Kemmerer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Processing method of wafer
- Publication number 20070077731
- Publication date Apr 5, 2007
- DISCO CORPORATION
- Takatoshi Masuda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Scribing system with particle remover
- Publication number 20060162173
- Publication date Jul 27, 2006
- MICRO PROCESSING TECHNOLOGY, INC.
- Paul C. Lindsey
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Application
Apparatus and method for the low-contamination, automatic crushing...
- Publication number 20060088970
- Publication date Apr 27, 2006
- Wacker Chemie GmbH
- Karl Hesse
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Flat display panel and method of dividing the flat display panel
- Publication number 20040245913
- Publication date Dec 9, 2004
- Haruo Wakayama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for separating a brittle material
- Publication number 20030019897
- Publication date Jan 30, 2003
- Hannstar Display Corp.
- Ta-Ko Chuang
- B28 - WORKING CEMENT, CLAY, OR STONE

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dividing device for wafer

Methods of forming integrated circuit devices using cutting tools t...

Apparatus for dividing workpiece

Method for dividing substrate along division lines using abrasive m...

Method of processing a wafer and wafer processing system

Separation apparatuses for separating sheets of brittle material an...

Wafer divider and wafer division method

Separation apparatuses for separating sheets of brittle material an...

Device and method for cutting off substrate of fragile material

System for breaking a semiconductor wafer or other workpiece along...

Processing method of wafer

Method of manufacturing device having adhesive film on back-side su...

Apparatus and method for the low-contamination, automatic crushing...

Flat display panel and method of dividing the flat display panel

Scribing system with particle remover

Breaking apparatus for ceramic board

Decorative cracked glass mirror tile and method

Method for batch cleaving semiconductor wafers and coating cleaved...

Method and apparatus for cleaving wafers

Apparatus for cutting workpieces of glass, ceramics, and like material

Semiconductor wafer breaking apparatus

Apparatus for manipulating a stretched resilient diaphragm

Method of manufacturing a permanent magnet which is to be arranged...

Control of small parts in a manufacturing operation

Apparatus for separating snapstrates into individual hybrid substrates

Multiple ball element wafer breaking apparatus

Backside laser dicing system

3870196

3790051

3786973

Patents Applicationslast 30 patents

DIVIDING METHOD OF WORKPIECE

WORKPIECE MANAGEMENT METHOD AND SHEET CUTTING MACHINE

METHODS OF FORMING INTEGRATED CIRCUIT DEVICES USING CUTTING TOOLS T...

DIVIDING DEVICE FOR WAFER

METHOD OF PROCESSING WORKPIECE

METHOD OF PROCESSING A WAFER AND WAFER PROCESSING SYSTEM

WAFER DIVIDER AND WAFER DIVISION METHOD

SEPARATION APPARATUSES FOR SEPARATING SHEETS OF BRITTLE MATERIAL AN...

SEPARATION APPARATUSES FOR SEPARATING SHEETS OF BRITTLE MATERIAL AN...

DEVICE FOR SEPARATION OF A STACKED STRUCTURE AND ASSOCIATED METHOD

WORKING METHOD FOR SAPPHIRE SUBSTRATE

DEVICE AND METHOD FOR CUTTING OFF SUBSTRATE OF FRAGILE MATERIAL

METHOD OF MANUFACTURING DEVICE HAVING ADHESIVE FILM ON BACK-SIDE SU...

Sheet separation through fluid impact

Processing method of wafer

Scribing system with particle remover

Apparatus and method for the low-contamination, automatic crushing...

Flat display panel and method of dividing the flat display panel

Method for separating a brittle material