Severing delaminating means [e.g., chisel, etc.]

Industry

CPC
Y10T156/1961

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10T156/1961Severing delaminating means [e.g., chisel, etc.]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stand-alone cutting apparatus
- Patent number 12,036,688
- Issue date Jul 16, 2024
- AVERY DENNISON RETAIL INFORMATION SERVICES LLC
- Donald J. Ward
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Hand-held liner removal tool for pressure sensitive tape
- Patent number 11,939,182
- Issue date Mar 26, 2024
- Eurotech Distributors, Inc.
- Paul J. Waszkowski
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Apparatus for manufacturing display device and method for manufactu...
- Patent number 11,890,851
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Sung Dong Park
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermoplastic laminate induction welding system and method
- Patent number 11,571,883
- Issue date Feb 7, 2023
- Rohr, Inc.
- Noushin Bahramshahi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Solar panel disassembling apparatus
- Patent number 11,491,774
- Issue date Nov 8, 2022
- Won Kwang S&T Co., Ltd.
- Sang Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar module exterior disassembling apparatus
- Patent number 11,491,775
- Issue date Nov 8, 2022
- Won Kwang S&T Co., Ltd.
- Sang Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material removal apparatus, system, and method
- Patent number 11,279,057
- Issue date Mar 22, 2022
- The Boeing Company
- Christopher R. Loesche
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for reducing label waste using a cutting apparatus
- Patent number 11,148,846
- Issue date Oct 19, 2021
- AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
- João Pedro Gomes da Costa
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Grant
Combination printer and cutting apparatus
- Patent number 11,052,559
- Issue date Jul 6, 2021
- Avery Dennison Retail Information Servives, LLC
- John D. Mistyurik
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Stand-alone cutting apparatus
- Patent number 11,045,966
- Issue date Jun 29, 2021
- AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
- Donald J. Ward
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Grant
Methods for processing a first substrate bonded to a second substrate
- Patent number 10,814,603
- Issue date Oct 27, 2020
- Corning Incorporated
- Leena Kumari Sahoo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus to remove a protective layer
- Patent number 10,800,150
- Issue date Oct 13, 2020
- Ryan Westover
- B08 - CLEANING
Information Patent Grant
Caulking assisting device
- Patent number 10,683,673
- Issue date Jun 16, 2020
- Huang Chin-Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Components feeder
- Patent number 10,667,447
- Issue date May 26, 2020
- Yamaha Hatsudoki Kabushiki Kaisha
- Yukinari Awano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prescription label remover
- Patent number 10,486,409
- Issue date Nov 26, 2019
- Herman Chang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Processing apparatus and processing method of stack
- Patent number 10,442,172
- Issue date Oct 15, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo Kumakura
- G02 - OPTICS
Information Patent Grant
Method of recycling solar cell module
- Patent number 10,388,812
- Issue date Aug 20, 2019
- TOHO KASEI CO., LTD.
- Takanori Kawanishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Preparing laminate materials for testing
- Patent number 10,377,118
- Issue date Aug 13, 2019
- The Boeing Company
- John W. Delconte
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Carbon fiber recovery method
- Patent number 10,343,305
- Issue date Jul 9, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akira Kano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Feeder
- Patent number 10,342,168
- Issue date Jul 2, 2019
- FUJI CORPORATION
- Hiroyasu Ohashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Peeling method and manufacturing method of flexible device
- Patent number 10,279,576
- Issue date May 7, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Yoshiharu Hirakata
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System for disassembling display device and method for disassemblin...
- Patent number 10,272,662
- Issue date Apr 30, 2019
- Samsung Display Co., Ltd.
- Chang-Mo Park
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bendable carrier mount, device and method for releasing a carrier s...
- Patent number 10,272,660
- Issue date Apr 30, 2019
- EV Group E. Thallner GmbH
- Jürgen Burggraf
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer de-bonding device
- Patent number 10,204,813
- Issue date Feb 12, 2019
- Zhejiang Microtech Material Co., Ltd.
- Ming Yin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for creating separation start portion for layered bodies, de...
- Patent number 10,173,408
- Issue date Jan 8, 2019
- AGC Inc.
- Yuki Tateyama
- G02 - OPTICS
Information Patent Grant
Dual-layer bonding material process for temporary bonding of microe...
- Patent number 10,103,048
- Issue date Oct 16, 2018
- Brewer Science, Inc.
- Tony D. Flaim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Systems and methods for separation of thermal interface bond
- Patent number 10,065,407
- Issue date Sep 4, 2018
- Dell Products L.P.
- Lawrence A. Kyle
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive film remover
- Patent number 9,987,837
- Issue date Jun 5, 2018
- ORIBEL PTE LTD
- Gilberto Cabral
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Clamping apparatus for cleaving a bonded wafer structure and method...
- Patent number 9,925,755
- Issue date Mar 27, 2018
- Sunedison Semiconductor Limited (UEN201334164H)
- Gregory A. Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for separating two substrates
- Patent number 9,914,233
- Issue date Mar 13, 2018
- Soitec
- Didier Landru
- B26 - HAND CUTTING TOOLS CUTTING SEVERING

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20240227381
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Sung Dong PARK
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20240131835
- Publication date Apr 25, 2024
- SAMSUNG DISPLAY CO., LTD.
- Sung Dong PARK
- B32 - LAYERED PRODUCTS
Information Patent Application
Carpet Divider System
- Publication number 20180126719
- Publication date May 10, 2018
- Antero Rodarte Garcia
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD OF STACK
- Publication number 20170334187
- Publication date Nov 23, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo KUMAKURA
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
SUBSTRATE SEPARATION APPARATUS AND METHOD
- Publication number 20140338828
- Publication date Nov 20, 2014
- SAMSUNG DISPLAY CO., LTD.
- Seung Jun LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
PEELING DEVICE, PEELING SYSTEM, AND PEELING METHOD
- Publication number 20140332166
- Publication date Nov 13, 2014
- TOKYO ELECTRON LIMITED
- Masaru HONDA
- B32 - LAYERED PRODUCTS
Information Patent Application
INTERCHANGEABLE CUT TAPE / LEADERLESS FEEDER FINGER ADAPTABLE TO VA...
- Publication number 20140318713
- Publication date Oct 30, 2014
- Kelvin Wiley
- B32 - LAYERED PRODUCTS
Information Patent Application
DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...
- Publication number 20140262053
- Publication date Sep 18, 2014
- SKYWORKS SOLUTIONS, INC.
- Steve Canale
- B32 - LAYERED PRODUCTS
Information Patent Application
SEPARATING APPARATUS
- Publication number 20140196855
- Publication date Jul 17, 2014
- Disco Corporation
- Kentaro Iizuka
- B32 - LAYERED PRODUCTS
Information Patent Application
PEELING APPARATUS, PEELING SYSTEM AND PEELING METHOD
- Publication number 20140150980
- Publication date Jun 5, 2014
- TOKYO ELECTRON LIMITED
- Masanori Itou
- B32 - LAYERED PRODUCTS
Information Patent Application
Polarizing Sheet Removing Tool and Removing Method
- Publication number 20140144302
- Publication date May 29, 2014
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Yizhuang Zhuang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
FILM STRIPPING MECHANISM
- Publication number 20140130987
- Publication date May 15, 2014
- BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.
- Peng LI
- B32 - LAYERED PRODUCTS
Information Patent Application
Cartridge and tubular container triming and refinishing apparatus f...
- Publication number 20140096914
- Publication date Apr 10, 2014
- Paul J. Flood
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
FILM PEELING METHOD AND FILM PEELING DEVICE FOR FILM-COATED FLAT WIRE
- Publication number 20140076498
- Publication date Mar 20, 2014
- Toyota Jidosha Kabushiki Kaisha
- Kazuhiro SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...
- Publication number 20130340947
- Publication date Dec 26, 2013
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR CLEAVING A BONDED WAFER STRUCTURE
- Publication number 20130105538
- Publication date May 2, 2013
- MEMC Electronic Materials, Inc.
- Gregory A. Young
- B32 - LAYERED PRODUCTS
Information Patent Application
CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE
- Publication number 20130105539
- Publication date May 2, 2013
- MEMC Electronic Materials, Inc.
- Gregory A. Young
- B32 - LAYERED PRODUCTS
Information Patent Application
PAPER STRIPPING MEMBER AND IMAGE FORMING APPARATUS
- Publication number 20130105091
- Publication date May 2, 2013
- Sharp Kabushiki Kaisha
- Hirokazu YAMAUCHI
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Debonding Temporarily Bonded Semiconductor Wafers
- Publication number 20130048224
- Publication date Feb 28, 2013
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Application
Double Tread
- Publication number 20130029002
- Publication date Jan 31, 2013
- Bridgestone Bandag, LLC
- Troy Allen Kost
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD AND APPARATUS FOR DETACHING PLATES JOINED TO EACH OTHER
- Publication number 20130020031
- Publication date Jan 24, 2013
- Nitto Denko Corporation
- Masato FUJITA
- B32 - LAYERED PRODUCTS
Information Patent Application
Double Tread
- Publication number 20130022696
- Publication date Jan 24, 2013
- Bridgestone Bandag, LLC
- Troy Allen Kost
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Tool For Harvesting Polycrystalline Silicon-coated Rods From A Chem...
- Publication number 20120237678
- Publication date Sep 20, 2012
- MEMC ELECTRONIC MATERIALS SPA
- Rodolfo Bovo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD FOR DETACHING A SEMICONDUCTOR WAFER FROM A SUBSTRATE
- Publication number 20120152465
- Publication date Jun 21, 2012
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR REPAIRING A WALL CONSISTING OF A PLURALITY OF LAYERS
- Publication number 20120132344
- Publication date May 31, 2012
- Michel Deleris
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FIXTURES AND METHODS FOR UNBONDING WAFERS BY SHEAR FORCE
- Publication number 20120080150
- Publication date Apr 5, 2012
- SKYWORKS SOLUTIONS, INC.
- Jens A. Riege
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE CUTTING DEVICE AND METHOD
- Publication number 20120048906
- Publication date Mar 1, 2012
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DIE BONDER, PICKUP METHOD, AND PICKUP DEVICE
- Publication number 20110308738
- Publication date Dec 22, 2011
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...
- Publication number 20110297329
- Publication date Dec 8, 2011
- SKYWORKS SOLUTIONS, INC.
- Steve Canale
- B32 - LAYERED PRODUCTS
Information Patent Application
TAPE REMOVAL APPARATUS AND PROCESS
- Publication number 20110277941
- Publication date Nov 17, 2011
- The Boeing Company
- Thomas J. Hagman
- B32 - LAYERED PRODUCTS

Severing delaminating means [e.g., chisel, etc.]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stand-alone cutting apparatus

Hand-held liner removal tool for pressure sensitive tape

Apparatus for manufacturing display device and method for manufactu...

Thermoplastic laminate induction welding system and method

Solar panel disassembling apparatus

Solar module exterior disassembling apparatus

Material removal apparatus, system, and method

Method for reducing label waste using a cutting apparatus

Combination printer and cutting apparatus

Stand-alone cutting apparatus

Methods for processing a first substrate bonded to a second substrate

Method and apparatus to remove a protective layer

Caulking assisting device

Components feeder

Prescription label remover

Processing apparatus and processing method of stack

Method of recycling solar cell module

Preparing laminate materials for testing

Carbon fiber recovery method

Feeder

Peeling method and manufacturing method of flexible device

System for disassembling display device and method for disassemblin...

Bendable carrier mount, device and method for releasing a carrier s...

Wafer de-bonding device

Method for creating separation start portion for layered bodies, de...

Dual-layer bonding material process for temporary bonding of microe...

Systems and methods for separation of thermal interface bond

Adhesive film remover

Clamping apparatus for cleaving a bonded wafer structure and method...

Device for separating two substrates

Patents Applicationslast 30 patents

APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTU...

APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTU...

Carpet Divider System

PROCESSING APPARATUS AND PROCESSING METHOD OF STACK

SUBSTRATE SEPARATION APPARATUS AND METHOD

PEELING DEVICE, PEELING SYSTEM, AND PEELING METHOD

INTERCHANGEABLE CUT TAPE / LEADERLESS FEEDER FINGER ADAPTABLE TO VA...

DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...

SEPARATING APPARATUS

PEELING APPARATUS, PEELING SYSTEM AND PEELING METHOD

Polarizing Sheet Removing Tool and Removing Method

FILM STRIPPING MECHANISM

Cartridge and tubular container triming and refinishing apparatus f...

FILM PEELING METHOD AND FILM PEELING DEVICE FOR FILM-COATED FLAT WIRE

DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...

METHODS FOR CLEAVING A BONDED WAFER STRUCTURE

CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE

PAPER STRIPPING MEMBER AND IMAGE FORMING APPARATUS

Debonding Temporarily Bonded Semiconductor Wafers

Double Tread

METHOD AND APPARATUS FOR DETACHING PLATES JOINED TO EACH OTHER

Double Tread

Tool For Harvesting Polycrystalline Silicon-coated Rods From A Chem...

DEVICE AND METHOD FOR DETACHING A SEMICONDUCTOR WAFER FROM A SUBSTRATE

METHOD FOR REPAIRING A WALL CONSISTING OF A PLURALITY OF LAYERS

FIXTURES AND METHODS FOR UNBONDING WAFERS BY SHEAR FORCE

SUBSTRATE CUTTING DEVICE AND METHOD

DIE BONDER, PICKUP METHOD, AND PICKUP DEVICE

DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...

TAPE REMOVAL APPARATUS AND PROCESS