structurally combined with ferromagnetic material

Industry

CPC
H01F41/046

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HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties

Current Industry

H01F41/046structurally combined with ferromagnetic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structure with a protection cap at an end port...
- Patent number 12,347,722
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making laminate substrate with sintered components
- Patent number 12,327,679
- Issue date Jun 10, 2025
- Qorvo US, Inc.
- Tarak A. Railkar
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing an embedded magnetic component device
- Patent number 12,315,667
- Issue date May 27, 2025
- Murata Manufacturing Co., Ltd.
- Scott Andrew Parish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil electronic component and method of manufacturing the same
- Patent number 12,308,150
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woon Chul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil electronic component
- Patent number 12,288,640
- Issue date Apr 29, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Ryung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component and method for manufacturing inductor component
- Patent number 12,249,454
- Issue date Mar 11, 2025
- Murata Manufacturing Co., Ltd.
- Hiroki Imaeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electromechanical device having a soft magnetic material elec...
- Patent number 12,240,753
- Issue date Mar 4, 2025
- International Business Machines Corporation
- William J. Gallagher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical magnetic structure for integrated power conversion
- Patent number 12,217,891
- Issue date Feb 4, 2025
- University College-Cork National University of Ireland
- Cian O'Mathuna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing coil component having terminal electrodes w...
- Patent number 12,106,887
- Issue date Oct 1, 2024
- Taiyo Yuden Co., Ltd.
- Daiki Mimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component
- Patent number 12,087,502
- Issue date Sep 10, 2024
- Murata Manufacturing Co., Ltd.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 12,074,193
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with inductor windings around a core above an...
- Patent number 12,057,468
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming integrated inductors and transformers with embedded magneti...
- Patent number 12,057,264
- Issue date Aug 6, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with laminated magnetic core inductor and magnet...
- Patent number 12,048,097
- Issue date Jul 23, 2024
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component and electronic component
- Patent number 12,014,861
- Issue date Jun 18, 2024
- Murata Manufacturing Co., Ltd.
- Yoshifumi Maki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Inductor made of component carrier material comprising electrically...
- Patent number 12,002,614
- Issue date Jun 4, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor system having an inductor module attached to a...
- Patent number 11,996,771
- Issue date May 28, 2024
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 11,919,084
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Keita Muneuchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Multilayer coil component
- Patent number 11,901,105
- Issue date Feb 13, 2024
- Murata Manufacturing Co., Ltd.
- Makoto Hiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing laminated magnetic core inductor with insul...
- Patent number 11,903,130
- Issue date Feb 13, 2024
- Ferric Inc.
- Noah Sturcken
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of manufacturing an embedded magnetic component device
- Patent number 11,894,176
- Issue date Feb 6, 2024
- Murata Manufacturing Co., Ltd.
- Scott Andrew Parish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro tactility-simulating sensing device and method for producing...
- Patent number 11,881,347
- Issue date Jan 23, 2024
- National Tsing Hua University
- Sheng-Kai Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating inductors, resistors, capacitors and other structures in p...
- Patent number 11,864,327
- Issue date Jan 2, 2024
- International Business Machines Corporation
- Gerald Bartley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method of manufacturing coil component
- Patent number 11,854,730
- Issue date Dec 26, 2023
- TDK Corporation
- Makoto Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated electronic component
- Patent number 11,842,846
- Issue date Dec 12, 2023
- Murata Manufacturing Co., Ltd.
- Mitsuhiro Sato
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of manufacturing ceramic electronic component
- Patent number 11,821,090
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Yoshinori Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing electronic component
- Patent number 11,817,244
- Issue date Nov 14, 2023
- Murata Manufacturing Co., Ltd.
- Mitsunori Inoue
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Multilayer coil component
- Patent number 11,810,704
- Issue date Nov 7, 2023
- TDK Corporation
- Hidekazu Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VOLTAGE-ISOLATED IC PACKAGES WITH EXTENSIONS FOR CORE PLACEMENT
- Publication number 20250201466
- Publication date Jun 19, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Vijay Mangtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION TRANSFORMER PACKAGES WITH LAMINATED WINDING STRUCTURES
- Publication number 20250191829
- Publication date Jun 12, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Paul A. David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TRANSFORMER AND IC PACKAGES
- Publication number 20250182950
- Publication date Jun 5, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL METAL INDUCTOR LOOPS AND ASSOCIATED METHODS
- Publication number 20250104911
- Publication date Mar 27, 2025
- Intel Corporation
- Jaeil Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC COMPONENT INTEGRATION
- Publication number 20250062062
- Publication date Feb 20, 2025
- UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
- Zoran PAVLOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY TRANSFERRED INDUCTORS WITH ELECTROPLATED MAGNETIC MATERIAL
- Publication number 20250054672
- Publication date Feb 13, 2025
- Intel Corporation
- Veronica Aleman Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PIN-COUPLED COILS
- Publication number 20250022654
- Publication date Jan 16, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Vijay Mangtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20240363676
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR
- Publication number 20240347578
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COIL COMPONENT
- Publication number 20240128004
- Publication date Apr 18, 2024
- Murata Manufacturing Co., Ltd.
- Makoto HIRAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN EMBEDDED MAGNETIC COMPONENT DEVICE
- Publication number 20230420175
- Publication date Dec 28, 2023
- Murata Manufacturing Co., Ltd.
- Scott Andrew PARISH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNETIC COMPONENT DEVICE INCLUDING VENTED CHANNEL AND MUL...
- Publication number 20230422400
- Publication date Dec 28, 2023
- Murata Manufacturing Co., Ltd.
- Takayuki TANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COIL COMPONENT
- Publication number 20230420172
- Publication date Dec 28, 2023
- TDK Corporation
- Hidekazu SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAKING LAMINATE SUBSTRATE WITH SINTERED COMPONENTS
- Publication number 20230395321
- Publication date Dec 7, 2023
- Qorvo US, Inc.
- Tarak A. Railkar
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230361156
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNETIC DEVICE INCLUDING MULTILAYER WINDINGS
- Publication number 20230335335
- Publication date Oct 19, 2023
- Murata Manufacturing Co., Ltd.
- Takayuki TANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR COMPONENT
- Publication number 20230260696
- Publication date Aug 17, 2023
- MURATA MANUFACTURING CO., LTD.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INDUCTOR AND MANUFACTURING METHOD OF ELECTR...
- Publication number 20230253150
- Publication date Aug 10, 2023
- FUJIFILM CORPORATION
- Tatsuo MIKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230238422
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
- Publication number 20230197331
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Yoshifumi MAKI
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP
- Publication number 20230154788
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230128594
- Publication date Apr 27, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Min Sung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...
- Publication number 20230127874
- Publication date Apr 27, 2023
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS CHARGE COIL
- Publication number 20230106085
- Publication date Apr 6, 2023
- HAESUNG DS CO., LTD.
- Sang Hak LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220392687
- Publication date Dec 8, 2022
- Murata Manufacturing Co., Ltd.
- Keita MUNEUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Magnetic Inlay With An Adjustable Inductance Value for a Component...
- Publication number 20220377895
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald WEIDINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost In-Package Power Inductor
- Publication number 20220351901
- Publication date Nov 3, 2022
- NXP B.V.
- Trevor Mark Newlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFACTURIN...
- Publication number 20220216295
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF AN INTEGRATED TRANSFORMER
- Publication number 20220139607
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20220140065
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS

structurally combined with ferromagnetic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device structure with a protection cap at an end port...

Process for making laminate substrate with sintered components

Method of manufacturing an embedded magnetic component device

Coil electronic component and method of manufacturing the same

Coil electronic component

Inductor component and method for manufacturing inductor component

Micro-electromechanical device having a soft magnetic material elec...

Vertical magnetic structure for integrated power conversion

Method of manufacturing coil component having terminal electrodes w...

Inductor component

Semiconductor device structure with magnetic element

Semiconductor device with inductor windings around a core above an...

Forming integrated inductors and transformers with embedded magneti...

Integrated circuit with laminated magnetic core inductor and magnet...

Method of manufacturing electronic component and electronic component

Inductor made of component carrier material comprising electrically...

Power semiconductor system having an inductor module attached to a...

Vertical inductor for WLCSP

Electronic component and method for manufacturing the same

Multilayer coil component

Method of manufacturing laminated magnetic core inductor with insul...

Method of manufacturing an embedded magnetic component device

Micro tactility-simulating sensing device and method for producing...

Creating inductors, resistors, capacitors and other structures in p...

Methods of embedding magnetic structures in substrates

Coil component and method of manufacturing coil component

Laminated electronic component

Method of manufacturing ceramic electronic component

Method for manufacturing electronic component

Multilayer coil component

Patents Applicationslast 30 patents

VOLTAGE-ISOLATED IC PACKAGES WITH EXTENSIONS FOR CORE PLACEMENT

ISOLATION TRANSFORMER PACKAGES WITH LAMINATED WINDING STRUCTURES

INTEGRATED TRANSFORMER AND IC PACKAGES

COAXIAL METAL INDUCTOR LOOPS AND ASSOCIATED METHODS

MAGNETIC COMPONENT INTEGRATION

SELECTIVELY TRANSFERRED INDUCTORS WITH ELECTROPLATED MAGNETIC MATERIAL

VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PIN-COUPLED COILS

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR

MULTILAYER COIL COMPONENT

METHOD OF MANUFACTURING AN EMBEDDED MAGNETIC COMPONENT DEVICE

EMBEDDED MAGNETIC COMPONENT DEVICE INCLUDING VENTED CHANNEL AND MUL...

MULTILAYER COIL COMPONENT

PROCESS FOR MAKING LAMINATE SUBSTRATE WITH SINTERED COMPONENTS

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

EMBEDDED MAGNETIC DEVICE INCLUDING MULTILAYER WINDINGS

INDUCTOR COMPONENT

MANUFACTURING METHOD OF INDUCTOR AND MANUFACTURING METHOD OF ELECTR...

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

METHOD OF MANUFACTURING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP

ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THEREOF

POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...

WIRELESS CHARGE COIL

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Magnetic Inlay With An Adjustable Inductance Value for a Component...

Low Cost In-Package Power Inductor

INDUCTOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFACTURIN...

FABRICATION OF AN INTEGRATED TRANSFORMER

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT