Substances characterised by their function in the composition

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C08L2666/66

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CCHEMISTRY METALLURGY C08Organic compounds C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition

Current Industry

C08L2666/66Substances characterised by their function in the composition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Latent reactive adhesive film
- Patent number 11,535,778
- Issue date Dec 27, 2022
- tesa SE
- Marco Kupsky
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Modelling compound
- Patent number 11,274,193
- Issue date Mar 15, 2022
- DELTA OF SWEDEN AB
- Staffan Thuresson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Optoelectronic component and method for producing an optoelectronic...
- Patent number 10,840,416
- Issue date Nov 17, 2020
- OSRAM OLED GmbH
- David O'Brien
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Preparation method of vinyl ester resin for optimizing heat-release...
- Patent number 10,793,686
- Issue date Oct 6, 2020
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Yi-Kang Lan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device having polyimide layer
- Patent number 10,211,143
- Issue date Feb 19, 2019
- Intel Corporation
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Directly adhering, transparent heat-sealable binder for the coating...
- Patent number 10,195,829
- Issue date Feb 5, 2019
- Evonik Roehm GmbH
- André Hennig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resistive grid elements having a thermosetting polymer
- Patent number 9,824,797
- Issue date Nov 21, 2017
- General Electric Company
- Gary William Yeager
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Materials, structures and methods for microelectronic packaging
- Patent number 9,484,277
- Issue date Nov 1, 2016
- Intel Corporation
- Ravindra V. Tanikella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature shape memory polymers
- Patent number 9,447,253
- Issue date Sep 20, 2016
- The University of Akron
- Robert Weiss
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Materials, structures and methods for microelectronic packaging
- Patent number 8,796,825
- Issue date Aug 5, 2014
- Intel Corporation
- Ravindra V. Tanikella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials, structures and methods for microelectronic packaging
- Patent number 8,129,823
- Issue date Mar 6, 2012
- Intel Corporation
- Ravindra V. Tanikella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials, structures and methods for microelectronic packaging
- Patent number 7,335,608
- Issue date Feb 26, 2008
- Intel Corporation
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
POST-CONSUMER RECYCLED THERMOPLASTICS TREATED FOR MELT-PROCESSING W...
- Publication number 20240067815
- Publication date Feb 29, 2024
- COLORMATRIX HOLDINGS, INC.
- Mark Rule
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
AQUEOUS POLYOLEFIN DISPERSION
- Publication number 20240018311
- Publication date Jan 18, 2024
- Anna Maier
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LATENT REACTIVE ADHESIVE FILM
- Publication number 20230323170
- Publication date Oct 12, 2023
- tesa SE
- Marco Kupsky
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LATENT REACTIVE ADHESIVE FILM
- Publication number 20230092613
- Publication date Mar 23, 2023
- tesa SE
- Marco Kupsky
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
IMPACT-RESISTANT POLYESTER MATERIAL
- Publication number 20230002610
- Publication date Jan 5, 2023
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TRANSPARENT PLASTIC SUBSTRATE AND PLASTIC LENS
- Publication number 20180362730
- Publication date Dec 20, 2018
- HOYA LENS THAILAND LTD.
- Masahisa KOUSAKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TRANSPARENT PLASTIC SUBSTRATE AND PLASTIC LENS
- Publication number 20180362731
- Publication date Dec 20, 2018
- HOYA LENS THAILAND LTD.
- Masahisa KOUSAKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MODELLING COMPOUND
- Publication number 20180030247
- Publication date Feb 1, 2018
- RAMLAT LIMITED
- Staffan THURESSON
- B44 - DECORATIVE ARTS
Information Patent Application
DIRECTLY ADHERING, TRANSPARENT HEAT-SEALABLE BINDER FOR THE COATING...
- Publication number 20170335141
- Publication date Nov 23, 2017
- Evonik Roehm GmbH
- André HENNIG
- B32 - LAYERED PRODUCTS
Information Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
- Publication number 20140312101
- Publication date Oct 23, 2014
- RAVINDRA V. TANIKELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
- Publication number 20120181687
- Publication date Jul 19, 2012
- RAVINDRA V. TANIKELLA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Materials, structures and methods for microelectronic packaging
- Publication number 20080087986
- Publication date Apr 17, 2008
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Materials, structures and methods for microelectronic packaging
- Publication number 20060060956
- Publication date Mar 23, 2006
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Substances characterised by their function in the composition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Latent reactive adhesive film

Modelling compound

Optoelectronic component and method for producing an optoelectronic...

Preparation method of vinyl ester resin for optimizing heat-release...

Semiconductor device having polyimide layer

Directly adhering, transparent heat-sealable binder for the coating...

Resistive grid elements having a thermosetting polymer

Materials, structures and methods for microelectronic packaging

High temperature shape memory polymers

Materials, structures and methods for microelectronic packaging

Materials, structures and methods for microelectronic packaging

Materials, structures and methods for microelectronic packaging

Patents Applicationslast 30 patents

POST-CONSUMER RECYCLED THERMOPLASTICS TREATED FOR MELT-PROCESSING W...

AQUEOUS POLYOLEFIN DISPERSION

LATENT REACTIVE ADHESIVE FILM

LATENT REACTIVE ADHESIVE FILM

IMPACT-RESISTANT POLYESTER MATERIAL

TRANSPARENT PLASTIC SUBSTRATE AND PLASTIC LENS

TRANSPARENT PLASTIC SUBSTRATE AND PLASTIC LENS

MODELLING COMPOUND

DIRECTLY ADHERING, TRANSPARENT HEAT-SEALABLE BINDER FOR THE COATING...

MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING

MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING

Materials, structures and methods for microelectronic packaging

Materials, structures and methods for microelectronic packaging