Surface mounting

Industry

CPC
H05K13/046

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/046Surface mounting

Industries

Patents Grantslast 30 patents

Information Patent Grant
Mounting head, mounting apparatus, and method of manufacturing elec...
- Patent number 12,193,163
- Issue date Jan 7, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yusuke Takechi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 12,176,384
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for self-assembling semiconductor light-emitting diodes
- Patent number 12,159,800
- Issue date Dec 3, 2024
- LG Electronics Inc.
- Inbum Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-valve automatic calibration system and dual-valve automatic ca...
- Patent number 12,115,550
- Issue date Oct 15, 2024
- Kulicke and Soffa Hi-Tech Co., Ltd.
- Lu-Min Chen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 12,114,432
- Issue date Oct 8, 2024
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB production by laser systems
- Patent number 12,089,328
- Issue date Sep 10, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method of providing underfill on a circuit b...
- Patent number 12,082,344
- Issue date Sep 3, 2024
- JABIL INC.
- Mark Tudman
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 12,062,638
- Issue date Aug 13, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robot apparatus for soldering
- Patent number 12,017,341
- Issue date Jun 25, 2024
- FANUC CORPORATION
- Yoshio Motowaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application device for applying adhesive, and adhesive application...
- Patent number 11,998,943
- Issue date Jun 4, 2024
- NHK Spring Co., Ltd.
- Akira Homma
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Fluxless gang die bonding arrangement
- Patent number 11,972,968
- Issue date Apr 30, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular-design component handling device with component gripping to...
- Patent number 11,956,901
- Issue date Apr 9, 2024
- ASMPT GMBH & CO. KG
- Sebastian Lohmeier
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wireless communication device manufacturing method and wireless com...
- Patent number 11,937,375
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Yoshinori Yamawaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for mounting components on a substrate
- Patent number 11,924,974
- Issue date Mar 5, 2024
- Besi Switzerland AG
- Norbert Bilewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profiled thermode
- Patent number 11,910,533
- Issue date Feb 20, 2024
- Pragmatic Printing Ltd
- Neil Davies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate chuck for self-assembling semiconductor light emitting di...
- Patent number 11,901,208
- Issue date Feb 13, 2024
- LG Electronics Inc.
- Inbum Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB production by laser systems
- Patent number 11,877,398
- Issue date Jan 16, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed wiring board
- Patent number 11,871,520
- Issue date Jan 9, 2024
- BotFactory Inc.
- Michael Knox
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wave solder pallets for optimal solder flow and methods of manufact...
- Patent number 11,850,684
- Issue date Dec 26, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system interchangeable solder pads
- Patent number 11,832,393
- Issue date Nov 28, 2023
- Dell Products L.P.
- Yu-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMT process prediction tool for intelligent decision making on PCB...
- Patent number 11,825,606
- Issue date Nov 21, 2023
- Chengdu Aeronautic Polytechnic
- Xin Su
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tilt and rotate dispenser having strain wave gear system
- Patent number 11,818,846
- Issue date Nov 14, 2023
- Illinois Tool Works Inc.
- Thomas C. Prentice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tilt and rotate dispenser having motion control
- Patent number 11,805,634
- Issue date Oct 31, 2023
- Illinois Tool Works Inc.
- Ronald J. Forget
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Solder composition and electronic substrate
- Patent number 11,780,035
- Issue date Oct 10, 2023
- Tamura Corporation
- Ryutaro Shimoishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 11,776,989
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,769,749
- Issue date Sep 26, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for applying a viscous material to workpieces
- Patent number 11,766,692
- Issue date Sep 26, 2023
- Atlas Copco IAS GmbH
- Thomas Hausner
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods of parallel transfer of micro-devices using mask layer
- Patent number 11,756,982
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL-VALVE AUTOMATIC CALIBRATION SYSTEM AND DUAL-VALVE AUTOMATIC CA...
- Publication number 20240390934
- Publication date Nov 28, 2024
- Kulicke and Soffa Hi-Tech Co., Ltd.
- Lu-Min Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS, SYSTEM, AND METHOD OF PROVIDING UNDERFILL ON A CIRCUIT B...
- Publication number 20240397687
- Publication date Nov 28, 2024
- Jabil Inc.
- Mark Tudman
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PRE-ASSEMBLY WARPAGE PAIRING
- Publication number 20240381603
- Publication date Nov 14, 2024
- Nokia Solutions and Networks Oy
- Paul Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM, APPARATUS AND METHOD FOR MOUNTING COMPONENT
- Publication number 20240365525
- Publication date Oct 31, 2024
- HANWHA PRECISION MACHINERY CO., LTD.
- Han Su Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...
- Publication number 20240365523
- Publication date Oct 31, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Sei UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB PRODUCTION BY LASER SYSTEMS
- Publication number 20240324101
- Publication date Sep 26, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...
- Publication number 20240308200
- Publication date Sep 19, 2024
- Skiileux Electricity Inc.
- SHENG-HSIANG YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUXLESS GANG DIE BONDING ARRANGEMENT
- Publication number 20240304485
- Publication date Sep 12, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX TRANSFER APPARATUS, FLUX TRANSFER METHOD, AND MOUNTING APPARATUS
- Publication number 20240276695
- Publication date Aug 15, 2024
- SHINKAWA LTD.
- Shinichi YOSHIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PERFORMING ONLINE PICK-AND-PLACE PATH OPTIMIZATION SIMUL...
- Publication number 20240244814
- Publication date Jul 18, 2024
- Ningbo Yik-Tong Intelligent Technology Co., LTD
- Zhengkai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTER AND ELECTRONIC COMPONENT IMAGING METHOD
- Publication number 20240244815
- Publication date Jul 18, 2024
- FUJI CORPORATION
- Shota SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR DETERMINING CONTAMINATION COEFFICIENTS AND/OR DEGREES OF...
- Publication number 20240237322
- Publication date Jul 11, 2024
- ERSA GMBH
- Michael Haas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS COMMUNICATION DEVICE MANUFACTURING METHOD AND WIRELESS COM...
- Publication number 20240188271
- Publication date Jun 6, 2024
- Murata Manufacturing Co., Ltd.
- Yoshinori Yamawaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISPLAY MODULE, METHOD FOR DISASSEMBLING/ASSEMBLING THEREOF, AND DI...
- Publication number 20240188236
- Publication date Jun 6, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Shaofei GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
QUALITY DETERMINATION DEVICE AND QUALITY DETERMINATION METHOD
- Publication number 20240149363
- Publication date May 9, 2024
- FUJI CORPORATION
- Seijiro HAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE ASSEMBLY APPARATUS
- Publication number 20240147616
- Publication date May 2, 2024
- NACHI-FUJIKOSHI CORP.
- Akira KUNISAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR DETERMINING CONTAMINATION COEFFICIENTS AND/OR DEGREES OF...
- Publication number 20240138134
- Publication date Apr 25, 2024
- ERSA GMBH
- Michael Haas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD
- Publication number 20240121932
- Publication date Apr 11, 2024
- Cisco Technology, Inc.
- Robert Gregory Twiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB PRODUCTION BY LASER SYSTEMS
- Publication number 20240064897
- Publication date Feb 22, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ASSEMBLING AN ELECTRONIC DEVICE
- Publication number 20240057306
- Publication date Feb 15, 2024
- Google LLC
- Luis Chau
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
- Publication number 20240033840
- Publication date Feb 1, 2024
- LASERSSEL CO., LTD.
- Jae Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEASUREMENT DEVICE, MEASUREMENT METHOD, AND BONDING SYSTEM
- Publication number 20230392921
- Publication date Dec 7, 2023
- SHINKAWA LTD.
- Shinichi YOSHIDA
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF PARALLEL TRANSFER OF MICRO-DEVICES USING TREATMENT
- Publication number 20230395645
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for mounting components on a substrate
- Publication number 20230284426
- Publication date Sep 7, 2023
- Besi Switzerland AG
- Norbert BILEWICZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION AND PRODUCTION OF PRINTED CIRCUIT BOARD ASSEMBLIES
- Publication number 20230262903
- Publication date Aug 17, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Daniel Fiebag
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER PRINTING INSPECTION DEVICE
- Publication number 20230232603
- Publication date Jul 20, 2023
- CKD CORPORATION
- Kazuyoshi Kikuchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT MOUNTING SYSTEM
- Publication number 20230217637
- Publication date Jul 6, 2023
- FUJI CORPORATION
- Hidetoshi KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR CREATING INTERCONNECTIONS BETWEEN A SUBSTRATE AND ELECTR...
- Publication number 20230189449
- Publication date Jun 15, 2023
- SunRay Scientific, Inc.
- Andrew Stemmermann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY, DISPLAY ASSEMBLY AND ASSEMBLING METHOD THER...
- Publication number 20230180448
- Publication date Jun 8, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Fengxian WANG
- H01 - BASIC ELECTRIC ELEMENTS

Surface mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mounting head, mounting apparatus, and method of manufacturing elec...

Methods of parallel transfer of micro-devices using treatment

Device for self-assembling semiconductor light-emitting diodes

Dual-valve automatic calibration system and dual-valve automatic ca...

Electronic device and method for manufacturing the same

PCB production by laser systems

Apparatus, system, and method of providing underfill on a circuit b...

Microdevice transfer setup and integration of micro-devices into sy...

Robot apparatus for soldering

Advanced device assembly structures and methods

Application device for applying adhesive, and adhesive application...

Fluxless gang die bonding arrangement

Modular-design component handling device with component gripping to...

Wireless communication device manufacturing method and wireless com...

Apparatus for mounting components on a substrate

Profiled thermode

Substrate chuck for self-assembling semiconductor light emitting di...

PCB production by laser systems

Method for producing a printed wiring board

Wave solder pallets for optimal solder flow and methods of manufact...

Information handling system interchangeable solder pads

SMT process prediction tool for intelligent decision making on PCB...

Laser bonding apparatus for three-dimensional molded sculptures

Tilt and rotate dispenser having strain wave gear system

Tilt and rotate dispenser having motion control

Solder composition and electronic substrate

Methods of parallel transfer of micro-devices using treatment

Mounting apparatus

Device for applying a viscous material to workpieces

Methods of parallel transfer of micro-devices using mask layer

Patents Applicationslast 30 patents

DUAL-VALVE AUTOMATIC CALIBRATION SYSTEM AND DUAL-VALVE AUTOMATIC CA...

APPARATUS, SYSTEM, AND METHOD OF PROVIDING UNDERFILL ON A CIRCUIT B...

PRE-ASSEMBLY WARPAGE PAIRING

SYSTEM, APPARATUS AND METHOD FOR MOUNTING COMPONENT

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...

PCB PRODUCTION BY LASER SYSTEMS

DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...

FLUXLESS GANG DIE BONDING ARRANGEMENT

FLUX TRANSFER APPARATUS, FLUX TRANSFER METHOD, AND MOUNTING APPARATUS

METHOD FOR PERFORMING ONLINE PICK-AND-PLACE PATH OPTIMIZATION SIMUL...

COMPONENT MOUNTER AND ELECTRONIC COMPONENT IMAGING METHOD

SYSTEM FOR DETERMINING CONTAMINATION COEFFICIENTS AND/OR DEGREES OF...

WIRELESS COMMUNICATION DEVICE MANUFACTURING METHOD AND WIRELESS COM...

DISPLAY MODULE, METHOD FOR DISASSEMBLING/ASSEMBLING THEREOF, AND DI...

QUALITY DETERMINATION DEVICE AND QUALITY DETERMINATION METHOD

ELECTRONIC DEVICE ASSEMBLY APPARATUS

SYSTEM FOR DETERMINING CONTAMINATION COEFFICIENTS AND/OR DEGREES OF...

SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD

PCB PRODUCTION BY LASER SYSTEMS

SYSTEMS AND METHODS FOR ASSEMBLING AN ELECTRONIC DEVICE

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

MEASUREMENT DEVICE, MEASUREMENT METHOD, AND BONDING SYSTEM

METHODS OF PARALLEL TRANSFER OF MICRO-DEVICES USING TREATMENT

Apparatus for mounting components on a substrate

INSPECTION AND PRODUCTION OF PRINTED CIRCUIT BOARD ASSEMBLIES

SOLDER PRINTING INSPECTION DEVICE

COMPONENT MOUNTING SYSTEM

SYSTEM FOR CREATING INTERCONNECTIONS BETWEEN A SUBSTRATE AND ELECTR...

CIRCUIT BOARD ASSEMBLY, DISPLAY ASSEMBLY AND ASSEMBLING METHOD THER...