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MOLDING DEVICE FOR SEMICONDUCTOR CHIP PACKAGE
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Publication number 20130071505
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Publication date Mar 21, 2013
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HON HAI Precision Industry CO., LTD.
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JUN-YI XIAO
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B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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PLASTIC LENS
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Publication number 20120140336
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Publication date Jun 7, 2012
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TAMRON CO., LTD.
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Noboru FUJINO
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B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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APPARATUS FOR MOLDING OPTICAL FIBER CONNECTOR
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Publication number 20110262582
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Publication date Oct 27, 2011
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HON HAI Precision Industry CO., LTD.
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KUN-CHAN WU
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B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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LOAD CARRIER
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Publication number 20110163055
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Publication date Jul 7, 2011
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Georg Utz Holding AG
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Jean-Marc Dubois
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B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Mold for Actuation Sled
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Publication number 20090115105
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Publication date May 7, 2009
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Tyco Healthcare Group LP
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Roman Czernik
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B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Injection-molded gear
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Publication number 20090011071
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Publication date Jan 8, 2009
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ENPLAS CORPORATION
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Toru Hagihara
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B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Mold for an integrated circuit package
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Publication number 20030129272
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Publication date Jul 10, 2003
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Chi-Chih Shen
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B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL