the supporting or holding device being of the vacuum type

Industry

CPC
B28D5/0094

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/0094the supporting or holding device being of the vacuum type

Industries

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Patents Grantslast 30 patents

Information Patent Grant
SiC ingot processing method and laser processing apparatus
- Patent number 11,958,132
- Issue date Apr 16, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method of wafer
- Patent number 11,890,783
- Issue date Feb 6, 2024
- Disco Corporation
- Xiaoming Qiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method and laser processing apparatus
- Patent number 11,597,039
- Issue date Mar 7, 2023
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dividing apparatus including an imaging unit for detecting defects...
- Patent number 11,476,137
- Issue date Oct 18, 2022
- Disco Corporation
- Hironari Ohkubo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus for cutting workpiece with cutting blade
- Patent number 11,404,303
- Issue date Aug 2, 2022
- Disco Corporation
- Takeomi Fukuoka
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Peeling apparatus
- Patent number 11,358,306
- Issue date Jun 14, 2022
- Disco Corporation
- Kazuyuki Hinohara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus with auto chuck cleaning mechanism
- Patent number 11,338,472
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Min Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer producing method and laser processing apparatus
- Patent number 11,273,522
- Issue date Mar 15, 2022
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-set clamping fixture for diamond machining
- Patent number 11,207,798
- Issue date Dec 28, 2021
- Shanghai Zhengshi Technology Co., Ltd.
- Weidong Man
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus
- Patent number 11,173,631
- Issue date Nov 16, 2021
- Disco Corporation
- Takeomi Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck table and inspection apparatus
- Patent number 11,152,246
- Issue date Oct 19, 2021
- Disco Corporation
- Hideaki Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chuck table and processing apparatus including the same
- Patent number 10,870,220
- Issue date Dec 22, 2020
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Conveyance system
- Patent number 10,717,605
- Issue date Jul 21, 2020
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting apparatus with auto chuck cleaning mechanism
- Patent number 10,695,952
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Min Tseng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Photovoltaic structure cleaving system
- Patent number 10,672,938
- Issue date Jun 2, 2020
- SolarCity Corporation
- Pablo Gonzalez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of processing workpiece including cutting step that uses cut...
- Patent number 10,522,405
- Issue date Dec 31, 2019
- Disco Corporation
- Kenji Takenouchi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Workpiece support jig
- Patent number 10,297,488
- Issue date May 21, 2019
- Disco Corporation
- Takeomi Fukuoka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Photovoltaic structure cleaving system
- Patent number 9,685,579
- Issue date Jun 20, 2017
- SolarCity Corporation
- Pablo Gonzalez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Laser processing method
- Patent number 9,102,005
- Issue date Aug 11, 2015
- Hamamatsu Photonics K.K.
- Kenichi Muramatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gemstone alignment
- Patent number 9,079,331
- Issue date Jul 14, 2015
- De Beers Centenary AG
- James G. C. Smith
- B24 - GRINDING POLISHING
Information Patent Grant
Package substrate processing method
- Patent number 9,023,687
- Issue date May 5, 2015
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for supporting a workpiece during processing
- Patent number 9,016,675
- Issue date Apr 28, 2015
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Optical device wafer processing method and laser processing apparatus
- Patent number 8,431,428
- Issue date Apr 30, 2013
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC layers separator
- Patent number 8,261,804
- Issue date Sep 11, 2012
- Meicer Semiconductor Inc.
- Sheng Chang Huang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Supply mechanism for the chuck of an integrated circuit dicing device
- Patent number 7,939,374
- Issue date May 10, 2011
- Rokko Systems Pte Ltd.
- Hae Choon Yang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Supply mechanism for the chuck of an integrated circuit dicing device
- Patent number 7,829,383
- Issue date Nov 9, 2010
- Rokko Systems Pte Ltd.
- Hae Choon Yang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer dividing method
- Patent number 7,696,010
- Issue date Apr 13, 2010
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer holding mechanism
- Patent number 7,557,904
- Issue date Jul 7, 2009
- Disco Corporation
- Naoki Ohmiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scribing apparatus, substrate cutting apparatus equipped with the s...
- Patent number 7,528,341
- Issue date May 5, 2009
- LG Display Co., Ltd.
- Jung Sik Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece holding jig
- Patent number 7,438,286
- Issue date Oct 21, 2008
- Disco Corporation
- Takayuki Umahashi
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
UNLOADING AND COLLECTING DEVICE FOR SLICE AND CUTTING MACHINE WITH...
- Publication number 20250010518
- Publication date Jan 9, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Xuelong LIN
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
MANUFACTURING METHOD OF GALLIUM NITRIDE SUBSTRATE
- Publication number 20240149379
- Publication date May 9, 2024
- Disco Corporation
- Asahi NOMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PEELING APPARATUS
- Publication number 20230373129
- Publication date Nov 23, 2023
- Disco Corporation
- Koyo HONOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MANUFACTURING METHOD
- Publication number 20230219256
- Publication date Jul 13, 2023
- Disco Corporation
- Yuki IKKU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MANUFACTURING METHOD
- Publication number 20230112548
- Publication date Apr 13, 2023
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Si SUBSTRATE MANUFACTURING METHOD
- Publication number 20220032503
- Publication date Feb 3, 2022
- Disco Corporation
- Kazuya HIRATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SiC INGOT PROCESSING METHOD AND LASER PROCESSING APPARATUS
- Publication number 20210197319
- Publication date Jul 1, 2021
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING APPARATUS
- Publication number 20200391410
- Publication date Dec 17, 2020
- Disco Corporation
- Takeomi FUKUOKA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DIVIDING APPARATUS
- Publication number 20200335370
- Publication date Oct 22, 2020
- Disco Corporation
- Hironari OHKUBO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING APPARATUS WITH AUTO CHUCK CLEANING MECHANISM
- Publication number 20200307022
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Min TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK TABLE AND INSPECTION APPARATUS
- Publication number 20200266091
- Publication date Aug 20, 2020
- Disco Corporation
- Hideaki TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCING METHOD AND LASER PROCESSING APPARATUS
- Publication number 20200086426
- Publication date Mar 19, 2020
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING APPARATUS WITH AUTO CHUCK CLEANING MECHANISM
- Publication number 20200086527
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Min TSENG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
TREATMENT APPARATUS FOR TREATING WORKPIECE
- Publication number 20190378732
- Publication date Dec 12, 2019
- Disco Corporation
- Satoshi Hanajima
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CONVEYANCE SYSTEM
- Publication number 20190352099
- Publication date Nov 21, 2019
- Disco Corporation
- Kazuma SEKIYA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CHUCK TABLE AND PROCESSING APPARATUS INCLUDING THE SAME
- Publication number 20190275700
- Publication date Sep 12, 2019
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
PEELING APPARATUS
- Publication number 20190160708
- Publication date May 30, 2019
- Disco Corporation
- Kazuyuki HINOHARA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF PROCESSING WORKPIECE
- Publication number 20180286757
- Publication date Oct 4, 2018
- Disco Corporation
- Kenji Takenouchi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING BLADE AND CUTTING APPARATUS
- Publication number 20180236691
- Publication date Aug 23, 2018
- Disco Corporation
- Suguru Hiraiwa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WORKPIECE SUPPORT JIG
- Publication number 20170076971
- Publication date Mar 16, 2017
- Disco Corporation
- Takeomi Fukuoka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
PACKAGE SUBSTRATE PROCESSING METHOD
- Publication number 20140030850
- Publication date Jan 30, 2014
- Disco Corporation
- Kazuma SEKIYA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
APPARATUS AND METHOD FOR SUPPORTING A WORKPIECE DURING PROCESSING
- Publication number 20140008855
- Publication date Jan 9, 2014
- Chi Wah CHENG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
GEMSTONE ALIGNMENT
- Publication number 20120167362
- Publication date Jul 5, 2012
- DE BEERS CENTENARY AG
- James G. C. Smith
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
OPTICAL DEVICE WAFER PROCESSING METHOD AND LASER PROCESSING APPARATUS
- Publication number 20110256689
- Publication date Oct 20, 2011
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND PROCESS FOR DICING INTEGRATED CIRCUITS
- Publication number 20110045656
- Publication date Feb 24, 2011
- ROKKO VENTURES PTE, LTD.
- Chong Chen Lim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SUPPLY MECHANISM FOR THE CHUCK OF AN INTEGRATED CIRCUIT DICING DEVICE
- Publication number 20110021003
- Publication date Jan 27, 2011
- Hae Choon Yang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF, AND APPARATUS FOR, SEPARATING WAFERS FROM A WAFER STACK
- Publication number 20110008145
- Publication date Jan 13, 2011
- Gebr. Schmid GmbH & Co.
- Reinhard Huber
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Apparatus for cutting flat display panel
- Publication number 20100011927
- Publication date Jan 21, 2010
- Jae-Pil Lee
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method and Device for the Mechanical Structuring of Flexible Thin-F...
- Publication number 20090211424
- Publication date Aug 27, 2009
- Hans-Ulrich ZUEHLKE
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Laser Processing Method
- Publication number 20090008373
- Publication date Jan 8, 2009
- HAMAMATSU PHOTONICS K. K.
- Kenichi Muramatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

the supporting or holding device being of the vacuum type

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SiC ingot processing method and laser processing apparatus

Production method of wafer

Wafer producing method and laser processing apparatus

Dividing apparatus including an imaging unit for detecting defects...

Cutting apparatus for cutting workpiece with cutting blade

Peeling apparatus

Cutting apparatus with auto chuck cleaning mechanism

Wafer producing method and laser processing apparatus

Multi-set clamping fixture for diamond machining

Cutting apparatus

Chuck table and inspection apparatus

Chuck table and processing apparatus including the same

Conveyance system

Cutting apparatus with auto chuck cleaning mechanism

Photovoltaic structure cleaving system

Method of processing workpiece including cutting step that uses cut...

Workpiece support jig

Photovoltaic structure cleaving system

Laser processing method

Gemstone alignment

Package substrate processing method

Apparatus and method for supporting a workpiece during processing

Optical device wafer processing method and laser processing apparatus

IC layers separator

Supply mechanism for the chuck of an integrated circuit dicing device

Supply mechanism for the chuck of an integrated circuit dicing device

Wafer dividing method

Wafer holding mechanism

Scribing apparatus, substrate cutting apparatus equipped with the s...

Workpiece holding jig

Patents Applicationslast 30 patents

UNLOADING AND COLLECTING DEVICE FOR SLICE AND CUTTING MACHINE WITH...

MANUFACTURING METHOD OF GALLIUM NITRIDE SUBSTRATE

PEELING APPARATUS

SUBSTRATE MANUFACTURING METHOD

SUBSTRATE MANUFACTURING METHOD

Si SUBSTRATE MANUFACTURING METHOD

SiC INGOT PROCESSING METHOD AND LASER PROCESSING APPARATUS

CUTTING APPARATUS

DIVIDING APPARATUS

CUTTING APPARATUS WITH AUTO CHUCK CLEANING MECHANISM

CHUCK TABLE AND INSPECTION APPARATUS

WAFER PRODUCING METHOD AND LASER PROCESSING APPARATUS

CUTTING APPARATUS WITH AUTO CHUCK CLEANING MECHANISM

TREATMENT APPARATUS FOR TREATING WORKPIECE

CONVEYANCE SYSTEM

CHUCK TABLE AND PROCESSING APPARATUS INCLUDING THE SAME

PEELING APPARATUS

METHOD OF PROCESSING WORKPIECE

CUTTING BLADE AND CUTTING APPARATUS

WORKPIECE SUPPORT JIG

PACKAGE SUBSTRATE PROCESSING METHOD

APPARATUS AND METHOD FOR SUPPORTING A WORKPIECE DURING PROCESSING

GEMSTONE ALIGNMENT

OPTICAL DEVICE WAFER PROCESSING METHOD AND LASER PROCESSING APPARATUS

SYSTEM AND PROCESS FOR DICING INTEGRATED CIRCUITS

SUPPLY MECHANISM FOR THE CHUCK OF AN INTEGRATED CIRCUIT DICING DEVICE

METHOD OF, AND APPARATUS FOR, SEPARATING WAFERS FROM A WAFER STACK

Apparatus for cutting flat display panel

Method and Device for the Mechanical Structuring of Flexible Thin-F...

Laser Processing Method