the temperature difference between different chips being controlled

Follow

Industry

CPC
H03F2200/531

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H03Electronic circuits H03FAMPLIFIERS H03F2200/00Indexing scheme relating to amplifiers

Current Industry

H03F2200/531the temperature difference between different chips being controlled

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
System and method for generating high-voltage radio frequency signa...
- Patent number 10,284,154
- Issue date May 7, 2019
- Agilent Technologies, Inc.
- Michael Schoessow
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit module having a first die with a power amplifier...
- Patent number 9,583,471
- Issue date Feb 28, 2017
- Qorvo US, Inc.
- Douglas Andrew Teeter
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Compensation of timing errors caused by dynamic thermal mismatch
- Patent number 6,317,001
- Issue date Nov 13, 2001
- Agilent Technologies, Inc.
- Bernhard Roth
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT MODULE HAVING A FIRST DIE WITH A POWER AMPLIFIER...
- Publication number 20150200189
- Publication date Jul 16, 2015
- RF Micro Devices, Inc.
- Douglas Andrew Teeter
- H01 - BASIC ELECTRIC ELEMENTS