the unsaturated precursors containing heterocyclic moieties in the main chain

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CPC
C08G73/128

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CCHEMISTRY METALLURGY C08Organic compounds C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00

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C08G73/128the unsaturated precursors containing heterocyclic moieties in the main chain

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Modified allyl compound, modified bismaleimide prepolymer
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- Issue date Nov 12, 2024
- GUANGDONG HINNO-TECH CO., LTD.
- Yongjun Guo
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Resin composition, resin sheet, multilayer printed wiring board, an...
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Thermosetting resin composition, film adhesive, prepreg, and produc...
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- Teijin Limited
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Additive manufacturing employing polyimide-containing formulations
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- Issue date Aug 27, 2024
- Stratasys Ltd.
- Mariana Pokrass
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Maleimide resin, curable resin composition, and cured product thereof
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- Issue date Apr 16, 2024
- Nippon Kayaku Kabushiki Kaisha
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Resin composition, prepreg, laminate, multilayer printed wiring boa...
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- Issue date Feb 20, 2024
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Photosensitive resin composition, heterocyclic ring-containing poly...
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- FUJIFILM Corporation
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Information Patent Grant
Heat resistant polyimide film
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Modified bismaleimide resin, method for preparing the same, prepreg...
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Information Patent Grant
Photosensitive resin composition and method for producing cured rel...
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Information Patent Grant
Low-dielectric heat dissipation film composition and low-dielectric...
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Information Patent Grant
Method for producing aqueous polyimide precursor solution composition
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Information Patent Grant
Photosensitive resin composition and method for producing cured rel...
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Information Patent Grant
Bismaleimide-based solution for inkjet ink for three dimensional pr...
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- Soreq Nuclear Research Center
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- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Liquid crystal display device
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- Atsuhiko Mandai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant polyimide film and preparation method thereof
- Patent number 11,028,226
- Issue date Jun 8, 2021
- Changwei Liu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Disintegratable bismaleimide composites for downhole tool applications
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- Issue date Mar 30, 2021
- Baker Hughes Oilfield Operations LLC
- Anton Kovalchuk
- E21 - EARTH DRILLING MINING
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Electrically conductive composition
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- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Gas separation membrane, gas separation module, gas separation appa...
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- C01 - INORGANIC CHEMISTRY
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Resin film for flexible printed circuit board, metal foil provided...
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- Hitachi Chemical Company, Ltd.
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- B32 - LAYERED PRODUCTS
Information Patent Grant
Silicon-containing underlayers
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- Charlotte A. Cutler
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Substrate for organic electronic device
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- Ji Hee Kim
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Information Patent Grant
High temperature three-dimensional printing compositions
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- Sajal Das
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
High temperature three dimensional printing compositions
- Patent number 9,708,440
- Issue date Jul 18, 2017
- NOVOSET, LLC
- Sajal Das
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fluorine-containing modified bismaleimide resin
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- Issue date May 30, 2017
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reversible polymer adhesive composition
- Patent number 9,193,139
- Issue date Nov 24, 2015
- Xerox Corporation
- James D. Mayo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Insulating layer composition for substrate, and prepreg and substra...
- Patent number 8,940,186
- Issue date Jan 27, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Soo Young Ji
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bismaleimide-triazine resin bonded superabrasive wheels
- Patent number 5,167,674
- Issue date Dec 1, 1992
- Norton Company
- Prasad V. Ika
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Ethynyl terminated imidothioethers and resins therefrom
- Patent number 5,021,518
- Issue date Jun 4, 1991
- The United States of America as represented by the Adm inistration of the Nat...
- Paul M. Hergenrother
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Ethynyl terminated imidothioethers and resins therefrom
- Patent number 4,861,882
- Issue date Aug 29, 1989
- The United States of America as represented by the administrator of the Natio...
- Paul M. Hergenrother
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

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DEGRADABLE POLYIMIDES FOR FLEXIBLE ELECTRONIC SUBSTRATES USING THIO...
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ADDITIVE MANUFACTURING EMPLOYING POLYIMIDE-CONTAINING FORMULATIONS
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CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...
- Publication number 20240247128
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- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Thermoset polymers for high temperature applications
- Publication number 20230312870
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- National Technology & Engineering Solutions of Sandia, LLC
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- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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Amine-Substituted 2-Amino-Ethan-1-Olyl Polymers, Polyimides, Articl...
- Publication number 20230025661
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- Essex Furukawa Magnet Wire USA LLC
- Scott Jolley
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MODIFIED ALLYL COMPOUND, MODIFIED BISMALEIMIDE PREPOLYMER
- Publication number 20220204699
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- GUANGDONG HINNO-TECH CO., LTD.
- Yongjun GUO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOA...
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- B32 - LAYERED PRODUCTS
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RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
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THERMOSETTING RESIN COMPOSITION, FILM ADHESIVE, PREPREG, AND PRODUC...
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PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED REL...
- Publication number 20220011669
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FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATI...
- Publication number 20210405529
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- Mitsubishi Gas Chemical Company, Inc.
- Junya HORIUCHI
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HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND ADHESIVE AGENT, SUBSTR...
- Publication number 20210371594
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- Shin-Etsu Chemical Co., Ltd.
- Yuki KUDO
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IMIDE OLIGOMER, VARNISH, CURED PRODUCTS THEREOF, AND PREPREG AND FI...
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Heat Resistant Polyimide Film
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- Publication date Aug 26, 2021
- Institute of Petroleum Chemistry, Heilongjiang Academy of Sciences
- Changwei LIU
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MALEIMIDE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
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FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATI...
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PHOTOSENSITIVE RESIN COMPOSITION, HETEROCYCLIC RING-CONTAINING POLY...
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BISMALEIMIDE-BASED SOLUTION FOR INKJET INK FOR THREE DIMENSIONAL PR...
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- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

the unsaturated precursors containing heterocyclic moieties in the main chain

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modified allyl compound, modified bismaleimide prepolymer

Resin composition, resin sheet, multilayer printed wiring board, an...

Thermosetting resin composition, film adhesive, prepreg, and produc...

Additive manufacturing employing polyimide-containing formulations

Maleimide resin, curable resin composition, and cured product thereof

Resin composition, prepreg, laminate, multilayer printed wiring boa...

Photosensitive resin composition, heterocyclic ring-containing poly...

Heat resistant polyimide film

Modified bismaleimide resin, method for preparing the same, prepreg...

Photosensitive resin composition and method for producing cured rel...

Low-dielectric heat dissipation film composition and low-dielectric...

Method for producing aqueous polyimide precursor solution composition

Photosensitive resin composition and method for producing cured rel...

Bismaleimide-based solution for inkjet ink for three dimensional pr...

Liquid crystal display device

Heat resistant polyimide film and preparation method thereof

Disintegratable bismaleimide composites for downhole tool applications

Electrically conductive composition

Gas separation membrane, gas separation module, gas separation appa...

Resin film for flexible printed circuit board, metal foil provided...

Silicon-containing underlayers

Substrate for organic electronic device

High temperature three-dimensional printing compositions

High temperature three dimensional printing compositions

Fluorine-containing modified bismaleimide resin

Reversible polymer adhesive composition

Insulating layer composition for substrate, and prepreg and substra...

Bismaleimide-triazine resin bonded superabrasive wheels

Ethynyl terminated imidothioethers and resins therefrom

Ethynyl terminated imidothioethers and resins therefrom

Patents Applicationslast 30 patents

DEGRADABLE POLYIMIDES FOR FLEXIBLE ELECTRONIC SUBSTRATES USING THIO...

ADDITIVE MANUFACTURING EMPLOYING POLYIMIDE-CONTAINING FORMULATIONS

CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...

Thermoset polymers for high temperature applications

Amine-Substituted 2-Amino-Ethan-1-Olyl Polymers, Polyimides, Articl...

MODIFIED ALLYL COMPOUND, MODIFIED BISMALEIMIDE PREPOLYMER

RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOA...

MODIFIED BISMALEIMIDE RESIN, METHOD FOR PREPARING THE SAME, PREPREG...

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...

THERMOSETTING RESIN COMPOSITION, FILM ADHESIVE, PREPREG, AND PRODUC...

PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED REL...

FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATI...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND ADHESIVE AGENT, SUBSTR...

IMIDE OLIGOMER, VARNISH, CURED PRODUCTS THEREOF, AND PREPREG AND FI...

Heat Resistant Polyimide Film

MALEIMIDE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF

FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATI...

MODIFIED BISMALEIMIDE RESIN, METHOD FOR PREPARING THE SAME, PREPREG...

POLYIMIDE PRECURSOR SOLUTION AND METHOD FOR PRODUCING POLYIMIDE FILM

ADDITIVE MANUFACTURING EMPLOYING SOLVENT-FREE POLYIMIDE-CONTAINING...

ADDITIVE MANUFACTURING EMPLOYING POLYIMIDE-CONTAINING FORMULATIONS

COMPOUND, RESIN, COMPOSITION, AND FILM FORMING MATERIAL FOR LITHOGR...

POLYIMIDE PRECURSOR RESIN COMPOSITION FOR FORMING FLEXIBLE DEVICE S...

LOW-DIELECTRIC HEAT DISSIPATION FILM COMPOSITION AND LOW-DIELECTRIC...

DISINTEGRATABLE BISMALEIMIDE COMPOSITES FOR DOWNHOLE TOOL APPLICATIONS

METHOD FOR PRODUCING AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION

Heat Resistant Polyimide Film and Preparation Method Thereof

PHOTOSENSITIVE RESIN COMPOSITION, HETEROCYCLIC RING-CONTAINING POLY...

BISMALEIMIDE-BASED SOLUTION FOR INKJET INK FOR THREE DIMENSIONAL PR...

GAS SEPARATION MEMBRANE, GAS SEPARATION MODULE, GAS SEPARATOR, AND...