the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking

Industry

CPC
B28D5/0041

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/0041the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 11,594,432
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,998,208
- Issue date May 4, 2021
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,410,891
- Issue date Sep 10, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Device and method for cleaving
- Patent number 10,065,340
- Issue date Sep 4, 2018
- LatticeGear, LLC
- Gal Moyal
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus, device and method for wafer dicing
- Patent number 9,349,645
- Issue date May 24, 2016
- NXP B.V.
- Martin Lapke
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for breaking semiconductor wafers
- Patent number 7,262,115
- Issue date Aug 28, 2007
- Dynatex International
- William H. Baylis
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Anvil pad configuration for laser cleaving
- Patent number 6,247,625
- Issue date Jun 19, 2001
- Lucent Technologies, Inc.
- Utpal Kumar Chakrabarti
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for breaking and separating dies from a wafer
- Patent number 5,979,728
- Issue date Nov 9, 1999
- Texas Instruments Incorporated
- Rafael C. Alfaro
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for breaking and separating dies from a wafer
- Patent number 5,710,065
- Issue date Jan 20, 1998
- Texas Instruments Incorporated
- Rafael C. Alfaro
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for subdividing into pieces a ceramic plate
- Patent number 4,865,241
- Issue date Sep 12, 1989
- U.S. Philips Corporation
- Christian Hamel
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for assembling semiconductor devices such as L...
- Patent number 4,590,667
- Issue date May 27, 1986
- General Instrument Corporation
- Ralph E. Simon
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for cracking and separating pellets formed on a wafer
- Patent number 4,247,031
- Issue date Jan 27, 1981
- RCA Corporation
- Thomas W. Pote
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3920168
- Patent number 3,920,168
- Issue date Nov 18, 1975
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
2970730
- Patent number 2,970,730
- Issue date Feb 7, 1961
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20210225672
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20190326142
- Publication date Oct 24, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, DEVICE AND METHOD FOR WAFER DICING
- Publication number 20150104931
- Publication date Apr 16, 2015
- NXP B.V.
- Martin Lapke
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Device and Method for Cleaving.
- Publication number 20130119106
- Publication date May 16, 2013
- LatticeGear, LLC
- Gal Moyal
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
WAFER SPLITTING APPARATUS AND WAFER SPLITTING PROCESS
- Publication number 20120160227
- Publication date Jun 28, 2012
- LEXTAR ELECTRONICS CORP.
- Chien-Sen Weng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WAFER SPLITTING LAMINATE MECHANISM
- Publication number 20100175834
- Publication date Jul 15, 2010
- Shin-Kan LIU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method and apparatus for breaking semiconductor wafers
- Publication number 20070048972
- Publication date Mar 1, 2007
- DYNATEX INTERNATIONAL
- William H. Baylis
- B28 - WORKING CEMENT, CLAY, OR STONE

the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cold fluid semiconductor device release during pick and place opera...

Cold fluid semiconductor device release during pick and place opera...

Cold fluid semiconductor device release during pick and place opera...

Device and method for cleaving

Apparatus, device and method for wafer dicing

Method and apparatus for breaking semiconductor wafers

Anvil pad configuration for laser cleaving

Apparatus for breaking and separating dies from a wafer

Method and apparatus for breaking and separating dies from a wafer

Method and apparatus for subdividing into pieces a ceramic plate

Method and apparatus for assembling semiconductor devices such as L...

Method for cracking and separating pellets formed on a wafer

3920168

2970730

Patents Applicationslast 30 patents

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

APPARATUS, DEVICE AND METHOD FOR WAFER DICING

Device and Method for Cleaving.

WAFER SPLITTING APPARATUS AND WAFER SPLITTING PROCESS

WAFER SPLITTING LAMINATE MECHANISM

Method and apparatus for breaking semiconductor wafers