Thickness

Industry

CPC
G05B2219/37398

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G05Controlling systems G05BCONTROL OR REGULATING SYSTEMS IN GENERAL FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS G05B2219/00Program-control systems

Current Industry

G05B2219/37398Thickness

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Targeted adjusting of the contour using corresponding specifications
- Patent number 11,534,808
- Issue date Dec 27, 2022
- PRIMETALS TECHNOLOGIES GERMANY GMBH
- Jens Frenzel
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method of dynamically calculating refractive index to determine the...
- Patent number 10,429,827
- Issue date Oct 1, 2019
- TAMKO Building Products LLC
- Kyle Davis
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Dynamically calculated refractive index for determining the thickne...
- Patent number 9,977,424
- Issue date May 22, 2018
- Tamko Building Products, Inc.
- Kyle Davis
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device and method for manufacturing a semiconductor wafer
- Patent number 8,196,545
- Issue date Jun 12, 2012
- Sumco Techxiv Corporation
- Yoshiaki Kurosawa
- G05 - CONTROLLING REGULATING
Information Patent Grant
S-shape detection test piece and a detection method for detecting t...
- Patent number 8,061,052
- Issue date Nov 22, 2011
- Chengdu Aircraft Industrial (Group) Co., Ltd.
- Zhiyong Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling a process for fabricating integrated devices
- Patent number 7,815,812
- Issue date Oct 19, 2010
- Applied Materials, Inc.
- Matthew F. Davis
- G05 - CONTROLLING REGULATING
Information Patent Grant
Offset correction techniques for positioning substrates
- Patent number 7,479,236
- Issue date Jan 20, 2009
- Lam Research Corporation
- Jack Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and apparatus for prediction of polishing condition, and com...
- Patent number 7,289,872
- Issue date Oct 30, 2007
- Fujitsu Limited
- Daisuke Fukuda
- B24 - GRINDING POLISHING
Information Patent Grant
Method for automatic riser gate removal compensating for variance i...
- Patent number 6,876,899
- Issue date Apr 5, 2005
- Vulcan Engineering Co., Inc.
- Frank D. DeCord, Jr.
- B24 - GRINDING POLISHING
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,739,944
- Issue date May 25, 2004
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,488,566
- Issue date Dec 3, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,464,560
- Issue date Oct 15, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,464,561
- Issue date Oct 15, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,464,564
- Issue date Oct 15, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,338,667
- Issue date Jan 15, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,306,009
- Issue date Oct 23, 2001
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,261,151
- Issue date Jul 17, 2001
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for in-situ optimization for semiconductor wafers...
- Patent number 6,159,075
- Issue date Dec 12, 2000
- VLSI Technology, Inc.
- Liming Zhang
- G05 - CONTROLLING REGULATING
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,120,347
- Issue date Sep 19, 2000
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing method and polishing apparatus using the same
- Patent number 6,093,081
- Issue date Jul 25, 2000
- Canon Kabushiki Kaisha
- Masaru Nyui
- G05 - CONTROLLING REGULATING
Information Patent Grant
Production method of pattern for casting
- Patent number 6,007,280
- Issue date Dec 28, 1999
- Nissan Motor Co., Ltd.
- Kazuhiro Asahi
- G05 - CONTROLLING REGULATING
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 5,851,135
- Issue date Dec 22, 1998
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing inclu...
- Patent number 5,842,909
- Issue date Dec 1, 1998
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing inclu...
- Patent number 5,762,537
- Issue date Jun 9, 1998
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing inclu...
- Patent number 5,730,642
- Issue date Mar 24, 1998
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 5,700,180
- Issue date Dec 23, 1997
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing inclu...
- Patent number 5,658,183
- Issue date Aug 19, 1997
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing inclu...
- Patent number 5,643,060
- Issue date Jul 1, 1997
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for real-time control of semiconductor a wafer po...
- Patent number 5,486,129
- Issue date Jan 23, 1996
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for finish machining an in-process part having an...
- Patent number 5,446,673
- Issue date Aug 29, 1995
- General Electric Company
- Lowell W. Bauer
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
EDGE BUILD-UP MEASUREMENT
- Publication number 20220290284
- Publication date Sep 15, 2022
- ARCELORMITTAL
- David SLOAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DYNAMICALLY CALCULATING REFRACTIVE INDEX TO DETERMINE THE...
- Publication number 20180224838
- Publication date Aug 9, 2018
- TAMKO Building Products, Inc.
- Kyle Davis
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
Dynamically Calculated Refractive Index for Determining the Thickne...
- Publication number 20150331414
- Publication date Nov 19, 2015
- TAMKO Building Products, Inc.
- Kyle Davis
- E04 - BUILDING
Information Patent Application
WHEEL RECUTTING
- Publication number 20140150243
- Publication date Jun 5, 2014
- Marek Mamczur
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
S-SHAPE DETECTION TEST PIECE AND A DETECTION METHOD FOR DETECTING T...
- Publication number 20100004777
- Publication date Jan 7, 2010
- Chengdu Aircraft INdustrial (Group) Co., Ltd
- Zhiyong Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device and method for manufacturing a semiconductor wafer
- Publication number 20090269861
- Publication date Oct 29, 2009
- SUMCO TECHXIV CORPORATION
- Yoshiaki Kurosawa
- G05 - CONTROLLING REGULATING
Information Patent Application
OFFSET CORRECTION TECHNIQUES FOR POSITIONING SUBSTRATES
- Publication number 20080081383
- Publication date Apr 3, 2008
- Jack Chen
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD FOR CONTROLLING A PROCESS FOR FABRICATING INTEGRATED DEVICES
- Publication number 20070017896
- Publication date Jan 25, 2007
- Applied Materials, Inc.
- Matthew F. Davis
- G05 - CONTROLLING REGULATING
Information Patent Application
Method for controlling a process for fabricating integrated devices
- Publication number 20040200574
- Publication date Oct 14, 2004
- APPLIED MATERIALS, INC.
- Matthew F. Davis
- G05 - CONTROLLING REGULATING
Information Patent Application
Method for automatic riser gate removal compensating for variance i...
- Publication number 20030139841
- Publication date Jul 24, 2003
- Frank D. DeCord
- B22 - CASTING POWDER METALLURGY
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20030073384
- Publication date Apr 17, 2003
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20020034922
- Publication date Mar 21, 2002
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20020016131
- Publication date Feb 7, 2002
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20010041501
- Publication date Nov 15, 2001
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20010016466
- Publication date Aug 23, 2001
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20010001755
- Publication date May 24, 2001
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Targeted adjusting of the contour using corresponding specifications

Method of dynamically calculating refractive index to determine the...

Dynamically calculated refractive index for determining the thickne...

Device and method for manufacturing a semiconductor wafer

S-shape detection test piece and a detection method for detecting t...

Method for controlling a process for fabricating integrated devices

Offset correction techniques for positioning substrates

Method and apparatus for prediction of polishing condition, and com...

Method for automatic riser gate removal compensating for variance i...

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

Method and system for in-situ optimization for semiconductor wafers...

System for real-time control of semiconductor wafer polishing

Polishing method and polishing apparatus using the same

Production method of pattern for casting

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing inclu...

System for real-time control of semiconductor wafer polishing inclu...

System for real-time control of semiconductor wafer polishing inclu...

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing inclu...

System for real-time control of semiconductor wafer polishing inclu...

System and method for real-time control of semiconductor a wafer po...

System and method for finish machining an in-process part having an...

Patents Applicationslast 30 patents

EDGE BUILD-UP MEASUREMENT

METHOD OF DYNAMICALLY CALCULATING REFRACTIVE INDEX TO DETERMINE THE...

Dynamically Calculated Refractive Index for Determining the Thickne...

WHEEL RECUTTING

S-SHAPE DETECTION TEST PIECE AND A DETECTION METHOD FOR DETECTING T...

Device and method for manufacturing a semiconductor wafer

OFFSET CORRECTION TECHNIQUES FOR POSITIONING SUBSTRATES

METHOD FOR CONTROLLING A PROCESS FOR FABRICATING INTEGRATED DEVICES

Method for controlling a process for fabricating integrated devices

Method for automatic riser gate removal compensating for variance i...

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing