Through-holes

Industry

CPC
G01N2021/95653

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Parent Industries

GPHYSICS G01Measuring instruments G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES

Current Industry

G01N2021/95653Through-holes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for semiconductor chip hole geometry metrology
- Patent number 11,674,909
- Issue date Jun 13, 2023
- Yangtze Memory Technologies Co., Ltd.
- Le Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal sectioning for profiling printed-circuit-bord vias with vert...
- Patent number 9,664,509
- Issue date May 30, 2017
- Bruker Nano Inc.
- Joanna Schmit
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board
- Patent number 9,462,680
- Issue date Oct 4, 2016
- ROBERT BOSCH (AUSTRALIA) PTY. LTD
- Tony Rocco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for measuring via hole of silicon wafer
- Patent number 9,121,696
- Issue date Sep 1, 2015
- Korea Research Institute of Standards and Science
- Jong Han Jin
- G01 - MEASURING TESTING
Information Patent Grant
Charged particle beam processing system with visual and infrared im...
- Patent number 8,610,092
- Issue date Dec 17, 2013
- FEI Company
- Chad Rue
- G01 - MEASURING TESTING
Information Patent Grant
Method for measuring via bottom profile
- Patent number 8,537,213
- Issue date Sep 17, 2013
- Industrial Technology Research Institute
- Deh-Ming Shyu
- G01 - MEASURING TESTING
Information Patent Grant
Inspection method
- Patent number 8,260,030
- Issue date Sep 4, 2012
- Koh Young Technology Inc.
- Hee-Tae Kim
- G01 - MEASURING TESTING
Information Patent Grant
System and method for via structure measurement
- Patent number 8,139,233
- Issue date Mar 20, 2012
- Industrial Technology Research Institute
- Yi Sha Ku
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and methods for the inspection of microvias in printed ci...
- Patent number 7,372,632
- Issue date May 13, 2008
- Hitachi Via Mechanics, Ltd.
- Todd E. Lizotte
- G01 - MEASURING TESTING
Information Patent Grant
Method for examining foreign matters in through holes
- Patent number 7,043,072
- Issue date May 9, 2006
- Seiko Epson Corporation
- Noboru Goto
- G01 - MEASURING TESTING
Information Patent Grant
Method of and apparatus for inspecting the minimum annular width of...
- Patent number 5,408,538
- Issue date Apr 18, 1995
- Dainippon Screen Mfg. Co., Ltd.
- Ryuji Kitakado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate machining verifier
- Patent number 5,198,878
- Issue date Mar 30, 1993
- International Business Machines Corporation
- Anthony F. Coneski
- G01 - MEASURING TESTING
Information Patent Grant
Method of reading optical image of inspected surface and image read...
- Patent number 5,197,105
- Issue date Mar 23, 1993
- Dainippon Screen Mfg. Co. Ltd.
- Haruo Uemura
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for inspecting surface pattern of object
- Patent number 5,166,985
- Issue date Nov 24, 1992
- Hitachi, Ltd.
- Yuji Takagi
- G01 - MEASURING TESTING
Information Patent Grant
Substrate machining verifier
- Patent number 5,159,409
- Issue date Oct 27, 1992
- International Business Machines Corporation
- Anthony F. Coneski
- G01 - MEASURING TESTING
Information Patent Grant
Video bond lead locator
- Patent number 5,125,036
- Issue date Jun 23, 1992
- Kulicke and Soffa Industries, Inc.
- Asuri Raghavan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for inspecting filled state of via-holes filled with fillers...
- Patent number 5,015,097
- Issue date May 14, 1991
- Hitachi, Ltd.
- Mineo Nomoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for detecting through-hole voids in multi-laye...
- Patent number 4,930,890
- Issue date Jun 5, 1990
- Hitachi Ltd.
- Yasuhiko Hara
- G01 - MEASURING TESTING
Information Patent Grant
Method and aparatus for observing the internal surface of a small hole
- Patent number 4,865,448
- Issue date Sep 12, 1989
- Sanko Giken Kogyo Co., Ltd.
- Kenzo Akutsu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR SEMICONDUCTOR CHIP HOLE GEOMETRY METROLOGY
- Publication number 20210293727
- Publication date Sep 23, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Le Wang
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20130222796
- Publication date Aug 29, 2013
- Robert Bosch (Australia) Pty. Ltd
- Tony Rocco
- G01 - MEASURING TESTING
Information Patent Application
DEVICE AND METHOD FOR MEASURING VIA HOLE OF SILICON WAFER
- Publication number 20130206992
- Publication date Aug 15, 2013
- Korea Research Institute of Standards and Science
- Jong Han Jin
- G01 - MEASURING TESTING
Information Patent Application
Plated Through Hole Void Detection in Printed Circuit Boards by Det...
- Publication number 20130014977
- Publication date Jan 17, 2013
- International Business Machines Corporation
- Bruce John Chamberlin
- G01 - MEASURING TESTING
Information Patent Application
Apparatus for inspecting printed circuit board
- Publication number 20120194810
- Publication date Aug 2, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Taeg Gyum Kim
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MEASURING VIA BOTTOM PROFILE
- Publication number 20120147171
- Publication date Jun 14, 2012
- Industrial Technology Research Institute
- Deh-Ming Shyu
- G01 - MEASURING TESTING
Information Patent Application
Charged Particle Beam Processing System with Visual and Infrared Im...
- Publication number 20120006987
- Publication date Jan 12, 2012
- FEI Company
- Chad Rue
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD FOR VIA STRUCTURE MEASUREMENT
- Publication number 20110172974
- Publication date Jul 14, 2011
- Industrial Technology Research Institute
- Yi Sha KU
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION METHOD
- Publication number 20100246931
- Publication date Sep 30, 2010
- KOH YOUNG TECHNOLOGY INC.
- Hee-Tae KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICALLY MONITORING AN ALOX FABRICATION PROCESS
- Publication number 20100078329
- Publication date Apr 1, 2010
- Uri Mirsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHODS FOR THE INSPECTION OF MICROVIAS IN PRINTED CI...
- Publication number 20080074749
- Publication date Mar 27, 2008
- Todd E. Lizotte
- G02 - OPTICS
Information Patent Application
Method for examining foreign matters in through holes
- Publication number 20030206651
- Publication date Nov 6, 2003
- Noboru Goto
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for examining through holes
- Publication number 20020031250
- Publication date Mar 14, 2002
- Mikio Saito
- G01 - MEASURING TESTING

Through-holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for semiconductor chip hole geometry metrology

Signal sectioning for profiling printed-circuit-bord vias with vert...

Printed circuit board

Device and method for measuring via hole of silicon wafer

Charged particle beam processing system with visual and infrared im...

Method for measuring via bottom profile

Inspection method

System and method for via structure measurement

Apparatus and methods for the inspection of microvias in printed ci...

Method for examining foreign matters in through holes

Method of and apparatus for inspecting the minimum annular width of...

Substrate machining verifier

Method of reading optical image of inspected surface and image read...

Method and apparatus for inspecting surface pattern of object

Substrate machining verifier

Video bond lead locator

Method for inspecting filled state of via-holes filled with fillers...

Method and apparatus for detecting through-hole voids in multi-laye...

Method and aparatus for observing the internal surface of a small hole

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR SEMICONDUCTOR CHIP HOLE GEOMETRY METROLOGY

PRINTED CIRCUIT BOARD

DEVICE AND METHOD FOR MEASURING VIA HOLE OF SILICON WAFER

Plated Through Hole Void Detection in Printed Circuit Boards by Det...

Apparatus for inspecting printed circuit board

METHOD FOR MEASURING VIA BOTTOM PROFILE

Charged Particle Beam Processing System with Visual and Infrared Im...

SYSTEM AND METHOD FOR VIA STRUCTURE MEASUREMENT

INSPECTION METHOD

OPTICALLY MONITORING AN ALOX FABRICATION PROCESS

APPARATUS AND METHODS FOR THE INSPECTION OF MICROVIAS IN PRINTED CI...

Method for examining foreign matters in through holes

Method and apparatus for examining through holes