together with other curing agents

Industry

CPC
C08G59/4284

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Parent Industries

CCHEMISTRY METALLURGY C08Organic compounds C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS C08G59/00Polycondensates containing more than one epoxy group per molecule Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups

Current Industry

C08G59/4284together with other curing agents

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process for the production of epoxy resins
- Patent number 11,702,505
- Issue date Jul 18, 2023
- Vito N.V.
- Pablo Ortiz
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sheet-shaped prepreg
- Patent number 11,479,637
- Issue date Oct 25, 2022
- Daicel Corporation
- Hiroto Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature anhydride epoxy cured systems
- Patent number 11,286,336
- Issue date Mar 29, 2022
- Evonik Operations GmbH
- Pritesh G. Patel
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Image display device sealing material and image display device seal...
- Patent number 11,264,589
- Issue date Mar 1, 2022
- Mitsui Chemicals, Inc.
- Yusuke Tomita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, process for producing same, and uses of sa...
- Patent number 11,066,510
- Issue date Jul 20, 2021
- Sumitomo Seika Chemicals Co., Ltd.
- Noriaki Fukuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition and article made therefrom
- Patent number 10,717,807
- Issue date Jul 21, 2020
- ELITE MATERIAL CO., LTD.
- Yu-Te Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, prepreg, metal foil with resin, metal-clad lamin...
- Patent number 10,450,405
- Issue date Oct 22, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Nii
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Halogen-free epoxy resin composition, prepreg, laminate and printed...
- Patent number 10,400,099
- Issue date Sep 3, 2019
- SHENGYI TECHNOLOGY CO., LTD.
- Hui Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg and laminate board
- Patent number 10,017,601
- Issue date Jul 10, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Nii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Silicone-modified epoxy resin, composition containing the epoxy res...
- Patent number 9,963,542
- Issue date May 8, 2018
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicone-modified epoxy resin, composition containing said epoxy re...
- Patent number 9,944,760
- Issue date Apr 17, 2018
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Halogen-free epoxy resin composition, prepreg and laminate using same
- Patent number 9,873,789
- Issue date Jan 23, 2018
- SHENGYI TECHNOLOGY CO., LTD.
- Xianping Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, metal foil with resin, metal-clad lamin...
- Patent number 9,681,541
- Issue date Jun 13, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshiyuki Higashida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-pack type epoxy resin composition for fiber-reinforced composit...
- Patent number 9,328,237
- Issue date May 3, 2016
- Toray Industries, Inc.
- Hideki Oka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable composition, articles comprising the curable composition, a...
- Patent number 9,056,438
- Issue date Jun 16, 2015
- 3M Innovative Properties Company
- Eric G. Larson
- B32 - LAYERED PRODUCTS
Information Patent Grant
Halogen-free resin composition and its application for copper clad...
- Patent number 9,005,761
- Issue date Apr 14, 2015
- Elite Material Co., Ltd.
- Yu-Te Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Compositions comprising solvated aromatic amines and methods for th...
- Patent number 8,748,540
- Issue date Jun 10, 2014
- Crosslink Technology, Inc
- John Ulcar
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosettable composition containing a combination of an amphiphil...
- Patent number 8,722,798
- Issue date May 13, 2014
- Leiming Ji
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosettable composition containing a half ester of a cycloalipha...
- Patent number 8,691,920
- Issue date Apr 8, 2014
- Dow Global Technologies
- Yong-Jiang Li
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable epoxy resin composition
- Patent number 8,399,577
- Issue date Mar 19, 2013
- ABB Research Ltd.
- Bandeep Singh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flame-retardant adhesive resin composition and adhesive film using...
- Patent number 8,268,940
- Issue date Sep 18, 2012
- Nippon Steel Chemical Co., Ltd.
- Akira Mori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Rubber-modified polyamide resin, epoxy resin composition and cured...
- Patent number 8,114,940
- Issue date Feb 14, 2012
- Nippon Kayaku Kabushiki Kaisha
- Kazunori Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-part epoxy composition
- Patent number 8,053,031
- Issue date Nov 8, 2011
- Raven Lining Systems Inc.
- David L. Stanley
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Optoelectronic molding compound that transmits visible light and bl...
- Patent number 7,474,009
- Issue date Jan 6, 2009
- Henkel Corporation
- Dale R. Starkey
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low voiding no flow fluxing underfill for electronic devices
- Patent number 7,247,683
- Issue date Jul 24, 2007
- Fry's Metals, Inc.
- James M. Hurley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Elastomeric material compositions obtained from castor oil and epox...
- Patent number 7,196,124
- Issue date Mar 27, 2007
- Texas Tech University
- Harry W. Parker
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solvent-borne two component modified epoxy/polyamine coating compos...
- Patent number 7,169,862
- Issue date Jan 30, 2007
- E. I. Du Pont de Nemours and Company
- Cesar A. S. Rodrigues
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin compositions, solid state devices encapsulated therewit...
- Patent number 7,144,763
- Issue date Dec 5, 2006
- General Electric Company
- Malgorzata Iwona Rubinsztajn
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reactive non-isocyanate coating compositions
- Patent number 7,108,919
- Issue date Sep 19, 2006
- Mohamad Deeb Shalati
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Oxazolidone ring-containing epoxy resin
- Patent number 7,049,354
- Issue date May 23, 2006
- Nippon Paint Co., Ltd.
- Shuhei Yamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ROOM TEMPERATURE IONIC LIQUID CURING AGENT
- Publication number 20220356298
- Publication date Nov 10, 2022
- Evonik Operations GmbH
- Jian Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHEMICAL SOLUTION-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CON...
- Publication number 20220145119
- Publication date May 12, 2022
- NISSAN CHEMICAL CORPORATION
- Takafumi ENDO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PROCESS FOR THE PRODUCTION OF EPOXY RESINS
- Publication number 20220002473
- Publication date Jan 6, 2022
- VITO NV
- Pablo ORTIZ
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SA...
- Publication number 20200283566
- Publication date Sep 10, 2020
- Sumitomo Seika Chemicals Co., LTD
- Noriaki FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDENER COMPOSITION
- Publication number 20200270393
- Publication date Aug 27, 2020
- SABIC Global Technologies B.V.
- Edwards Norman Peters
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED-CI...
- Publication number 20200207976
- Publication date Jul 2, 2020
- Shengyi Technology Co., Ltd.
- Xianping ZENG
- B32 - LAYERED PRODUCTS
Information Patent Application
IMAGE DISPLAY DEVICE SEALING MATERIAL AND IMAGE DISPLAY DEVICE SEAL...
- Publication number 20200176706
- Publication date Jun 4, 2020
- Mitsui Chemicals, Inc.
- Yusuke TOMITA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
NOVEL LOW TEMPERATURE ANHYDRIDE EPOXY CURED SYSTEMS
- Publication number 20200087446
- Publication date Mar 19, 2020
- EVONIK DEGUSSA GmbH
- Pritesh G. PATEL
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SHEET-SHAPED PREPREG
- Publication number 20200055979
- Publication date Feb 20, 2020
- DAICEL CORPORATION
- Hiroto MIYAKE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ROOM TEMPERATURE IONIC LIQUID CURING AGENT
- Publication number 20190330412
- Publication date Oct 31, 2019
- EVONIK DEGUSSA GmbH
- Jian Li
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURING AGENT COMPOSITIONS FOR THERMOSETTING EPOXY RESIN COMPOSITIONS
- Publication number 20190330413
- Publication date Oct 31, 2019
- SABIC Global Technologies B.V.
- Mukesh Agrawal
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CUR...
- Publication number 20190241698
- Publication date Aug 8, 2019
- Edward Norman PETERS
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SA...
- Publication number 20190119434
- Publication date Apr 25, 2019
- Sumitomo Seika Chemicals Co., Ltd.
- Noriaki FUKUDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Halogen-Free Epoxy Resin Composition, Prepreg, Laminate and Printed...
- Publication number 20170298218
- Publication date Oct 19, 2017
- Shengyi Technology Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALOGEN-FREE EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE USING SAME
- Publication number 20170283609
- Publication date Oct 5, 2017
- SHENGYI TECHNOLOGY CO., LTD.
- Xianping Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMIN...
- Publication number 20170226276
- Publication date Aug 10, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- DAISUKE NII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING THE EPOXY RES...
- Publication number 20170107322
- Publication date Apr 20, 2017
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING SAID EPOXY RE...
- Publication number 20170073457
- Publication date Mar 16, 2017
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG AND LAMINATE BOARD
- Publication number 20160369042
- Publication date Dec 22, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Daisuke NII
- B32 - LAYERED PRODUCTS
Information Patent Application
TWO-PACK EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MAT...
- Publication number 20160237273
- Publication date Aug 18, 2016
- Hideki Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMIN...
- Publication number 20160234934
- Publication date Aug 11, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- TOSHIYUKI HIGASHIDA
- B32 - LAYERED PRODUCTS
Information Patent Application
PREPREG AND USES OF THE SAME
- Publication number 20150189746
- Publication date Jul 2, 2015
- Taiwan Union Technology Corporation
- Chih-Wei Liao
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESSING-FRIENDLY DIANHYDRIDE HARDENER FOR EPOXY RESIN SYSTEMS BA...
- Publication number 20150175740
- Publication date Jun 25, 2015
- Evonik Industries AG
- Benjamin WILLY
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TWO-PACK TYPE EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSIT...
- Publication number 20140288214
- Publication date Sep 25, 2014
- Hideki Oka
- B32 - LAYERED PRODUCTS
Information Patent Application
HARDENER FOR EPOXY RESIN SYSTEMS AND USE THEREOF
- Publication number 20140005344
- Publication date Jan 2, 2014
- Evonik Industries AG
- Stefanie RINKER
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, A...
- Publication number 20130295311
- Publication date Nov 7, 2013
- 3M Innovative Properties Company
- Eric G. Larson
- B32 - LAYERED PRODUCTS
Information Patent Application
EPOXY COMPOUND WITH NITROGEN-CONTAINING RING
- Publication number 20130172522
- Publication date Jul 4, 2013
- Nissan Chemical Industries, Ltd.
- Mikio Kasai
- C07 - ORGANIC CHEMISTRY
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION AND ITS APPLICATION FOR COPPER CLAD...
- Publication number 20130161080
- Publication date Jun 27, 2013
- Yu-Te LIN
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMIC...
- Publication number 20120326301
- Publication date Dec 27, 2012
- SEKISUI CHEMICAL CO., LTD.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE EPOXY RESIN COMPOSITION
- Publication number 20120202918
- Publication date Aug 9, 2012
- ABB Research Ltd.
- Bandeep SINGH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

together with other curing agents

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process for the production of epoxy resins

Sheet-shaped prepreg

Low temperature anhydride epoxy cured systems

Image display device sealing material and image display device seal...

Epoxy resin composition, process for producing same, and uses of sa...

Epoxy resin composition and article made therefrom

Resin composition, prepreg, metal foil with resin, metal-clad lamin...

Halogen-free epoxy resin composition, prepreg, laminate and printed...

Resin composition, prepreg and laminate board

Silicone-modified epoxy resin, composition containing the epoxy res...

Silicone-modified epoxy resin, composition containing said epoxy re...

Halogen-free epoxy resin composition, prepreg and laminate using same

Resin composition, prepreg, metal foil with resin, metal-clad lamin...

Two-pack type epoxy resin composition for fiber-reinforced composit...

Curable composition, articles comprising the curable composition, a...

Halogen-free resin composition and its application for copper clad...

Compositions comprising solvated aromatic amines and methods for th...

Thermosettable composition containing a combination of an amphiphil...

Thermosettable composition containing a half ester of a cycloalipha...

Curable epoxy resin composition

Flame-retardant adhesive resin composition and adhesive film using...

Rubber-modified polyamide resin, epoxy resin composition and cured...

Two-part epoxy composition

Optoelectronic molding compound that transmits visible light and bl...

Low voiding no flow fluxing underfill for electronic devices

Elastomeric material compositions obtained from castor oil and epox...

Solvent-borne two component modified epoxy/polyamine coating compos...

Epoxy resin compositions, solid state devices encapsulated therewit...

Reactive non-isocyanate coating compositions

Oxazolidone ring-containing epoxy resin

Patents Applicationslast 30 patents

ROOM TEMPERATURE IONIC LIQUID CURING AGENT

CHEMICAL SOLUTION-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CON...

PROCESS FOR THE PRODUCTION OF EPOXY RESINS

EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SA...

HARDENER COMPOSITION

EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED-CI...

IMAGE DISPLAY DEVICE SEALING MATERIAL AND IMAGE DISPLAY DEVICE SEAL...

NOVEL LOW TEMPERATURE ANHYDRIDE EPOXY CURED SYSTEMS

SHEET-SHAPED PREPREG

ROOM TEMPERATURE IONIC LIQUID CURING AGENT

CURING AGENT COMPOSITIONS FOR THERMOSETTING EPOXY RESIN COMPOSITIONS

HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CUR...

EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SA...

Halogen-Free Epoxy Resin Composition, Prepreg, Laminate and Printed...

HALOGEN-FREE EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE USING SAME

RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMIN...

SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING THE EPOXY RES...

SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING SAID EPOXY RE...

RESIN COMPOSITION, PREPREG AND LAMINATE BOARD

TWO-PACK EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MAT...

RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMIN...

PREPREG AND USES OF THE SAME

PROCESSING-FRIENDLY DIANHYDRIDE HARDENER FOR EPOXY RESIN SYSTEMS BA...

TWO-PACK TYPE EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSIT...

HARDENER FOR EPOXY RESIN SYSTEMS AND USE THEREOF

CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, A...

EPOXY COMPOUND WITH NITROGEN-CONTAINING RING

HALOGEN-FREE RESIN COMPOSITION AND ITS APPLICATION FOR COPPER CLAD...

THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMIC...

CURABLE EPOXY RESIN COMPOSITION