Unsaturated polyimide precursors

Industry

CPC
C08G73/12

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CCHEMISTRY METALLURGY C08Organic compounds C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00

Current Industry

C08G73/12Unsaturated polyimide precursors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Negative photosensitive resin composition, production method for po...
- Patent number 12,174,539
- Issue date Dec 24, 2024
- Asahi Kasei Kabushiki Kaisha
- Takeki Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide resin composition, polyimide resin adhesive layer, lamina...
- Patent number 12,157,815
- Issue date Dec 3, 2024
- ECHEM SOLUTIONS CORP.
- Yung-Yu Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Modified allyl compound, modified bismaleimide prepolymer
- Patent number 12,139,582
- Issue date Nov 12, 2024
- GUANGDONG HINNO-TECH CO., LTD.
- Yongjun Guo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition for semiconductor package, prepreg...
- Patent number 12,129,338
- Issue date Oct 29, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Build-up film with low dielectric loss, preparation method therefor...
- Patent number 12,098,230
- Issue date Sep 24, 2024
- Wuhan Choice Technology Co, Ltd
- De Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composite and metal clad laminate using the same
- Patent number 12,091,510
- Issue date Sep 17, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition, film adhesive, prepreg, and produc...
- Patent number 12,084,546
- Issue date Sep 10, 2024
- Teijin Limited
- Miki Horikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Amide acid oligomer process for molding polyimide composites
- Patent number 12,077,644
- Issue date Sep 3, 2024
- Kaneka Americas Holding, Inc.
- Masahiko Miyauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Additive manufacturing employing polyimide-containing formulations
- Patent number 12,070,897
- Issue date Aug 27, 2024
- Stratasys Ltd.
- Mariana Pokrass
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lightly crosslinked polyimides with phenylethynyl pendants for shap...
- Patent number 11,992,995
- Issue date May 28, 2024
- United States of America as represented by the Secretary of the Air Force
- Loon-Seng Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multiphenylethynyl-containing and lightly crosslinked polyimides ca...
- Patent number 11,975,477
- Issue date May 7, 2024
- United States of America as represented by the Secretary of the Air Force
- Loon-Seng Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Maleimide resin, curable resin composition, and cured product thereof
- Patent number 11,958,940
- Issue date Apr 16, 2024
- Nippon Kayaku Kabushiki Kaisha
- Kenichi Kuboki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting polyimide resin and manufacturing method thereof, com...
- Patent number 11,945,913
- Issue date Apr 2, 2024
- CHIN YEE CHEMICAL INDUSTRIES CO., LTD.
- Pi-Tao Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polyimides
- Patent number 11,939,428
- Issue date Mar 26, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Binod B. De
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, prepreg, laminate, multilayer printed wiring boa...
- Patent number 11,905,412
- Issue date Feb 20, 2024
- Resonac Corporation
- Takahiro Taki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide, laminate, and electronic device including same
- Patent number 11,898,009
- Issue date Feb 13, 2024
- UBE Corporation
- Norio Miura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive resin composition, heterocyclic ring-containing poly...
- Patent number 11,860,538
- Issue date Jan 2, 2024
- FUJIFILM Corporation
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Siloxane compound and polyimide precursor composition comprising same
- Patent number 11,820,785
- Issue date Nov 21, 2023
- LG Chem, Ltd.
- Cheolmin Yun
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for producing polyimide precursor, method for producing phot...
- Patent number 11,807,721
- Issue date Nov 7, 2023
- HD MICROSYSTEMS, LTD.
- Satoshi Yoneda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Poly(etherimide-phthalonitrile) adhesives and related methods
- Patent number 11,795,357
- Issue date Oct 24, 2023
- The Boeing Company
- Kevin James Drummey
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Compound and method for producing the same, resin composition, resi...
- Patent number 11,767,287
- Issue date Sep 26, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Shunsuke Katagiri
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Resin composition, preparation method thereof and article made ther...
- Patent number 11,697,711
- Issue date Jul 11, 2023
- ELITE MATERIAL CO., LTD.
- Chen-Yu Hsieh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant polyimide film
- Patent number 11,685,811
- Issue date Jun 27, 2023
- Changwei Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Modified bismaleimide resin, method for preparing the same, prepreg...
- Patent number 11,639,420
- Issue date May 2, 2023
- Nan Ya Plastics Corporation
- Te-Chao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photosensitive resin composition and method for producing cured rel...
- Patent number 11,640,112
- Issue date May 2, 2023
- Asahi Kasei Kabushiki Kaisha
- Tomohiro Yorisue
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Low-dielectric heat dissipation film composition and low-dielectric...
- Patent number 11,608,438
- Issue date Mar 21, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for fabricating multiphenylethynyl-containing and lightly cr...
- Patent number 11,577,448
- Issue date Feb 14, 2023
- United States of America as represented by the Secretary of the Air Force
- Loon-Seng Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Transparent polyimide film
- Patent number 11,530,297
- Issue date Dec 20, 2022
- TAIMIDE TECH. INC.
- Yi-Hsueh Ho
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for fabricating lightly crosslinked polyimides with phenylet...
- Patent number 11,504,899
- Issue date Nov 22, 2022
- United States of America as represented by the Secretary of the Air Force
- Loon-Seng Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
DEGRADABLE POLYIMIDES FOR FLEXIBLE ELECTRONIC SUBSTRATES USING THIO...
- Publication number 20240409690
- Publication date Dec 12, 2024
- University of Utah Research Foundation
- Caleb Reese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE MANUFACTURING EMPLOYING POLYIMIDE-CONTAINING FORMULATIONS
- Publication number 20240375346
- Publication date Nov 14, 2024
- STRATASYS LTD.
- Mariana POKRASS
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
AMINE-SUBSTITUTED PYRROLIDINE-2,5-DIONYL COPOLYMERS, POLYIMIDES, AR...
- Publication number 20240336739
- Publication date Oct 10, 2024
- Essex Furukawa Magnet Wire USA LLC
- Scott Jolley
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOIMAGABLE DIELECTRICS
- Publication number 20240317940
- Publication date Sep 26, 2024
- Rohm and Haas Electronic Materials L.L.C.
- Nora Sabina Radu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TY...
- Publication number 20240301115
- Publication date Sep 12, 2024
- SUMITOMO BAKELITE CO., LTD.
- Keita IMAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE POLYIMIDE COMPOSITIONS
- Publication number 20240288770
- Publication date Aug 29, 2024
- PROMERUS, LLC
- PRAMOD KANDANARACHCHI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...
- Publication number 20240247128
- Publication date Jul 25, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION
- Publication number 20240228705
- Publication date Jul 11, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD L...
- Publication number 20240191030
- Publication date Jun 13, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kazuyoshi YAMAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE C...
- Publication number 20240176240
- Publication date May 30, 2024
- Asahi Kasei Kabushiki Kaisha
- Satoshi SHIBUI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYIMIDES HAVING LOW DIELECTRIC LOSS
- Publication number 20240166818
- Publication date May 23, 2024
- SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
- Dipankar Basak
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINT...
- Publication number 20240117120
- Publication date Apr 11, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND ADHESIVE
- Publication number 20240092963
- Publication date Mar 21, 2024
- AAC TECHNOLOGIES (NANJING) CO., LTD.
- Hongyuan Wang
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT-CURABLE BISMALEIMIDE RESIN COMPOSITION
- Publication number 20240084075
- Publication date Mar 14, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masayuki IWASAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRECURSOR, POLYMER, OPTICAL FILM COMPRISING POLYMER, AND DISPLAY DE...
- Publication number 20240043634
- Publication date Feb 8, 2024
- KOLON INDUSTRIES, INC.
- Jong Won YANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIELECTRIC MATERIALS BASED ON BISMALEIMIDES CONTAINING CARDO/SPIRO...
- Publication number 20240010796
- Publication date Jan 11, 2024
- Merck Patent GmbH
- Gregor LARBIG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED S...
- Publication number 20230399467
- Publication date Dec 14, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroki HORIGOME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF AND MULTILA...
- Publication number 20230374186
- Publication date Nov 23, 2023
- Nippon Kayaku Kabushiki-Kaisha
- Kengo NISHIMURA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Thermoset polymers for high temperature applications
- Publication number 20230312870
- Publication date Oct 5, 2023
- National Technology & Engineering Solutions of Sandia, LLC
- Mathias C. Celina
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
POLYIMIDE PRECURSOR, PREPARATION METHOD THEREOF, PHOTOSENSITIVE RES...
- Publication number 20230295366
- Publication date Sep 21, 2023
- eChem Solutions Corp.
- Wei-Chung Liang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSET COMPOSITE COMPRISING A CROSSLINKED IMIDE EXTENDED COMPOUND
- Publication number 20230242709
- Publication date Aug 3, 2023
- ROGERS CORPORATION
- Thomas A. Koes
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BRANCHED AMORPHOUS POLYAMIDE (CO)POLYMERS AND METHODS OF MAKING AND...
- Publication number 20230167243
- Publication date Jun 1, 2023
- 3M Innovative Properties Company
- Rajdeep S. Kalgutkar
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLY(ETHERIMIDE-PHTHALONITRILE) ADHESIVES AND RELATED METHODS
- Publication number 20230103527
- Publication date Apr 6, 2023
- The Boeing Company
- Kevin James Drummey
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN SHEET
- Publication number 20230097896
- Publication date Mar 30, 2023
- LINTEC CORPORATION
- Yasutaka WATANABE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYIMIDE PRECURSOR SOLUTION, POROUS POLYIMIDE MEMBRANE, AND INSULA...
- Publication number 20230077397
- Publication date Mar 16, 2023
- FUJIFILM Business Innovation Corp.
- Takeshi IWANAGA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED USING T...
- Publication number 20230070603
- Publication date Mar 9, 2023
- Hyundai Motor Company
- Seul Yi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOUND AND METHOD FOR PRODUCING THE SAME, RESIN COMPOSITION, RESI...
- Publication number 20230057045
- Publication date Feb 23, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Shunsuke KATAGIRI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Amine-Substituted 2-Amino-Ethan-1-Olyl Polymers, Polyimides, Articl...
- Publication number 20230025661
- Publication date Jan 26, 2023
- Essex Furukawa Magnet Wire USA LLC
- Scott Jolley
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FIBER REINFORCED POLYMER COMPOSITE STRUCTURES AND ELECTROMAGNETIC I...
- Publication number 20230003177
- Publication date Jan 5, 2023
- Government of the United States, represented by the Secretary of the Air Force
- Gregory R. YANDEK
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Lightly Crosslinked Polyimides with Phenylethynyl Pendants for Shap...
- Publication number 20220388223
- Publication date Dec 8, 2022
- Government of the United States, as represented by the Secretary of the Air F...
- Loon-Seng Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Unsaturated polyimide precursors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Negative photosensitive resin composition, production method for po...

Polyimide resin composition, polyimide resin adhesive layer, lamina...

Modified allyl compound, modified bismaleimide prepolymer

Resin composition, resin sheet, multilayer printed wiring board, an...

Thermosetting resin composition for semiconductor package, prepreg...

Build-up film with low dielectric loss, preparation method therefor...

Thermosetting resin composite and metal clad laminate using the same

Thermosetting resin composition, film adhesive, prepreg, and produc...

Amide acid oligomer process for molding polyimide composites

Additive manufacturing employing polyimide-containing formulations

Lightly crosslinked polyimides with phenylethynyl pendants for shap...

Multiphenylethynyl-containing and lightly crosslinked polyimides ca...

Maleimide resin, curable resin composition, and cured product thereof

Thermosetting polyimide resin and manufacturing method thereof, com...

Polyimides

Resin composition, prepreg, laminate, multilayer printed wiring boa...

Polyimide, laminate, and electronic device including same

Photosensitive resin composition, heterocyclic ring-containing poly...

Siloxane compound and polyimide precursor composition comprising same

Method for producing polyimide precursor, method for producing phot...

Poly(etherimide-phthalonitrile) adhesives and related methods

Compound and method for producing the same, resin composition, resi...

Resin composition, preparation method thereof and article made ther...

Heat resistant polyimide film

Modified bismaleimide resin, method for preparing the same, prepreg...

Photosensitive resin composition and method for producing cured rel...

Low-dielectric heat dissipation film composition and low-dielectric...

Method for fabricating multiphenylethynyl-containing and lightly cr...

Transparent polyimide film

Method for fabricating lightly crosslinked polyimides with phenylet...

Patents Applicationslast 30 patents

DEGRADABLE POLYIMIDES FOR FLEXIBLE ELECTRONIC SUBSTRATES USING THIO...

ADDITIVE MANUFACTURING EMPLOYING POLYIMIDE-CONTAINING FORMULATIONS

AMINE-SUBSTITUTED PYRROLIDINE-2,5-DIONYL COPOLYMERS, POLYIMIDES, AR...

PHOTOIMAGABLE DIELECTRICS

NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TY...

PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...

RESIN COMPOSITION

RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD L...

PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE C...

POLYIMIDES HAVING LOW DIELECTRIC LOSS

CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINT...

RESIN COMPOSITION AND ADHESIVE

HEAT-CURABLE BISMALEIMIDE RESIN COMPOSITION

PRECURSOR, POLYMER, OPTICAL FILM COMPRISING POLYMER, AND DISPLAY DE...

DIELECTRIC MATERIALS BASED ON BISMALEIMIDES CONTAINING CARDO/SPIRO...

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED S...

PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF AND MULTILA...

Thermoset polymers for high temperature applications

POLYIMIDE PRECURSOR, PREPARATION METHOD THEREOF, PHOTOSENSITIVE RES...

THERMOSET COMPOSITE COMPRISING A CROSSLINKED IMIDE EXTENDED COMPOUND

BRANCHED AMORPHOUS POLYAMIDE (CO)POLYMERS AND METHODS OF MAKING AND...

POLY(ETHERIMIDE-PHTHALONITRILE) ADHESIVES AND RELATED METHODS

RESIN SHEET

POLYIMIDE PRECURSOR SOLUTION, POROUS POLYIMIDE MEMBRANE, AND INSULA...

POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED USING T...

COMPOUND AND METHOD FOR PRODUCING THE SAME, RESIN COMPOSITION, RESI...

Amine-Substituted 2-Amino-Ethan-1-Olyl Polymers, Polyimides, Articl...

FIBER REINFORCED POLYMER COMPOSITE STRUCTURES AND ELECTROMAGNETIC I...

Lightly Crosslinked Polyimides with Phenylethynyl Pendants for Shap...