Unsaturated polyimide precursors

Industry

CPC
C08L79/085

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Parent Industries

CCHEMISTRY METALLURGY C08Organic compounds C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00

Current Industry

C08L79/085Unsaturated polyimide precursors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Composition comprising maleimide pre-polymerized resin
- Patent number 12,122,912
- Issue date Oct 22, 2024
- ELITE MATERIAL CO., LTD.
- Shu-Hao Chang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting resin composition, film adhesive, prepreg, and produc...
- Patent number 12,084,546
- Issue date Sep 10, 2024
- Teijin Limited
- Miki Horikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition, laminate, semiconductor wafer with resin composi...
- Patent number 11,924,979
- Issue date Mar 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Masashi Okaniwa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bismaleimide compound, composition containing same, polybenzoxazole...
- Patent number 11,905,356
- Issue date Feb 20, 2024
- Nippon Kayaku Kabushiki Kaisha
- Naoki Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, prepreg, laminate, multilayer printed wiring boa...
- Patent number 11,905,412
- Issue date Feb 20, 2024
- Resonac Corporation
- Takahiro Taki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition and article made therefrom
- Patent number 11,820,894
- Issue date Nov 21, 2023
- ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
- Teng Xu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flame retardant compound, method of making the same, resin composit...
- Patent number 11,773,115
- Issue date Oct 3, 2023
- ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
- Zhilong Hu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Low-dielectric heat dissipation film composition and low-dielectric...
- Patent number 11,608,438
- Issue date Mar 21, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid compression molding encapsulants
- Patent number 11,578,202
- Issue date Feb 14, 2023
- Henkel AG & Co. KGaA
- Jie Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified silicone compound, and thermosetting resin composition, pr...
- Patent number 11,401,381
- Issue date Aug 2, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomohiko Kotake
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Friction drive belt
- Patent number 11,300,178
- Issue date Apr 12, 2022
- Mitsuboshi Belting Ltd.
- Hisato Ishiguro
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Thermosetting resin composition for semiconductor package and prepr...
- Patent number 11,193,015
- Issue date Dec 7, 2021
- LG Chem, Ltd.
- Hwayeon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for semiconductor package, prepreg, and metal cla...
- Patent number 11,091,630
- Issue date Aug 17, 2021
- LG Chem, Ltd.
- Chang Bo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, prepreg, laminate and multilayer printed wiring...
- Patent number 11,041,045
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Nagai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, and pre-preg, metal-clad laminate and printed ci...
- Patent number 10,994,516
- Issue date May 4, 2021
- Taiwan Union Technology Corporation
- Chih-Wei Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, resin sheet, metal foil-clad laminate,...
- Patent number 10,815,349
- Issue date Oct 27, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Katsuya Tomizawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition and uses of the same
- Patent number 10,774,216
- Issue date Sep 15, 2020
- Taiwan Union Technology Corporation
- Shur-Fen Liu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide precursor composition and use thereof
- Patent number 10,731,004
- Issue date Aug 4, 2020
- Eternal Materials Co., Ltd.
- Chang-Hong Ho
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg or resin sheet comprising the resin comp...
- Patent number 10,721,817
- Issue date Jul 21, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Yoichi Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable fiberglass binder comprising salt of inorganic acid
- Patent number 10,696,588
- Issue date Jun 30, 2020
- Johns Manville
- Bernd Christensen
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Halogen-free flame retardant type resin composition
- Patent number 10,696,844
- Issue date Jun 30, 2020
- SHENGYI TECHNOLOGY CO., LTD.
- Long Xi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and articles made therefrom
- Patent number 10,604,640
- Issue date Mar 31, 2020
- ELITE MATERIAL CO., LTD.
- Chen-Yu Hsieh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Transmission belt and belt-speed-change device
- Patent number 10,591,020
- Issue date Mar 17, 2020
- Mitsuboshi Belting Ltd.
- Mikio Kageyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, prepreg, metal foil-clad laminate, resin composi...
- Patent number 10,550,244
- Issue date Feb 4, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Takashi Kobayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition, resin film for interlayer insulati...
- Patent number 10,544,305
- Issue date Jan 28, 2020
- Hitachi Chemical Company, Ltd.
- Aya Kasahara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Vinylbenzyl imide resin, method of preparing vinylbenzyl imide resi...
- Patent number 10,538,628
- Issue date Jan 21, 2020
- ELITE MATERIAL CO., LTD.
- Chen-Yu Hsieh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition and uses of the same
- Patent number 10,513,607
- Issue date Dec 24, 2019
- Taiwan Union Technology Corporation
- Shur-Fen Liu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Diene/dienophile couples and thermosetting resin compositions havin...
- Patent number 10,472,548
- Issue date Nov 12, 2019
- Henkel IP & Holding GmbH
- Timothy M. Champagne
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Resin film for flexible printed circuit board, metal foil provided...
- Patent number 10,434,750
- Issue date Oct 8, 2019
- Hitachi Chemical Company, Ltd.
- Masaki Takeuchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition and uses of the same
- Patent number 10,322,565
- Issue date Jun 18, 2019
- TAIWAN UNION TECHNOLOGY CORPORATION
- Shur-Fen Liu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
POLYAMIDE-IMIDE COPOLYMER FILM, PREPARATION METHOD THEREOF AND FLEX...
- Publication number 20240101822
- Publication date Mar 28, 2024
- ZHEJIANG OCAS NEW MATERIALS CO., LTD.
- Qun ZHANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED S...
- Publication number 20230399467
- Publication date Dec 14, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroki HORIGOME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Nanocomposite Flame Retardant, Flame Retardant Bismaleimide Resin a...
- Publication number 20230265261
- Publication date Aug 24, 2023
- NANJING TECH UNIVERSITY
- ZHIRONG WANG
- B82 - NANO-TECHNOLOGY
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN,...
- Publication number 20230257581
- Publication date Aug 17, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Jun YASUMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITION COMPRISING MALEIMIDE PRE-POLYMERIZED RESIN
- Publication number 20230135428
- Publication date May 4, 2023
- ELITE MATERIAL CO., LTD.
- SHU-HAO CHANG
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20230099943
- Publication date Mar 30, 2023
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Teng XU
- B32 - LAYERED PRODUCTS
Information Patent Application
Bismaleimide Compound, Composition Containing Same, Polybenzoxazole...
- Publication number 20220298281
- Publication date Sep 22, 2022
- Nippon Kayaku Kabushiki-Kaisha
- Naoki Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM
- Publication number 20220267526
- Publication date Aug 25, 2022
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HIGH MOLECULAR WEIGHT FLEXIBLE CURABLE POLYIMIDES
- Publication number 20220204766
- Publication date Jun 30, 2022
- DESIGNER MOLECULES, INC.
- Farhad G Mizori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOA...
- Publication number 20220169852
- Publication date Jun 2, 2022
- Showa Denko Materials Co., Ltd.
- Takahiro TAKI
- B32 - LAYERED PRODUCTS
Information Patent Application
TEMPERATURE SENSOR ELEMENT
- Publication number 20220082452
- Publication date Mar 17, 2022
- Sumitomo Chemical Company, Limited
- Megumi HAYASAKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT,...
- Publication number 20220057711
- Publication date Feb 24, 2022
- FUJIFILM CORPORATION
- Yuki NARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PERMANENT BONDING AND PATTERNING MATERIAL
- Publication number 20220049095
- Publication date Feb 17, 2022
- Brewer Science, Inc.
- Xiao Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLAME RETARDANT COMPOUND, METHOD OF MAKING THE SAME, RESIN COMPOSIT...
- Publication number 20220024952
- Publication date Jan 27, 2022
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Zhilong HU
- C07 - ORGANIC CHEMISTRY
Information Patent Application
THERMOSETTING RESIN COMPOSITION, FILM ADHESIVE, PREPREG, AND PRODUC...
- Publication number 20220017698
- Publication date Jan 20, 2022
- TEIJIN LIMITED
- Miki HORIKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYARYLENE SULFIDE RESIN COMPOSITION, METHOD OF PREPARING POLYARYL...
- Publication number 20220002544
- Publication date Jan 6, 2022
- LG CHEM, LTD.
- Ran Hee LEE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND ADHESIVE AGENT, SUBSTR...
- Publication number 20210371594
- Publication date Dec 2, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yuki KUDO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE POLYIMIDES
- Publication number 20210301133
- Publication date Sep 30, 2021
- DESIGNER MOLECULES, INC.
- Farhad G Mizori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20210171770
- Publication date Jun 10, 2021
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Zhilong HU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYMER-CERAMIC HYBRID SEPARATOR MEMBRANES, PRECURSORS, AND MANUFAC...
- Publication number 20210167463
- Publication date Jun 3, 2021
- Cornell University
- Soshana SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...
- Publication number 20210147680
- Publication date May 20, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Kohei HIGASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MALEIMIDE RESIN COMPOSITION AND MALEIMIDE RESIN FILM
- Publication number 20210079219
- Publication date Mar 18, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20200377725
- Publication date Dec 3, 2020
- Elite Electronic Material (kunShan) Co., Ltd.
- Yan ZHANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR INSULATING FILM
- Publication number 20200347226
- Publication date Nov 5, 2020
- NISSAN CHEMICAL CORPORATION
- Takuya OHASHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW-DIELECTRIC HEAT DISSIPATION FILM COMPOSITION AND LOW-DIELECTRIC...
- Publication number 20200325334
- Publication date Oct 15, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPR...
- Publication number 20200190313
- Publication date Jun 18, 2020
- LG CHEM, LTD.
- Hwayeon MOON
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG, AND METAL CLA...
- Publication number 20190270881
- Publication date Sep 5, 2019
- LG CHEM, LTD.
- Chang Bo SHIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING POLYALKENYLPHENOL COMPOUND, CURABLE COMPOSITIO...
- Publication number 20190225566
- Publication date Jul 25, 2019
- SHOWA DENKO K.K.
- Aoi HASEGAWA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
CURABLE FIBERGLASS BINDER
- Publication number 20190177217
- Publication date Jun 13, 2019
- JOHNS MANVILLE
- Kiarash Alavi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYIMIDE PRECURSOR AND LITHOGRAPHY PATTERN FORMED BY THE SAME
- Publication number 20190163061
- Publication date May 30, 2019
- TAIFLEX SCIENTIFIC CO., LTD.
- Chi-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Unsaturated polyimide precursors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composition comprising maleimide pre-polymerized resin

Thermosetting resin composition, film adhesive, prepreg, and produc...

Resin composition, laminate, semiconductor wafer with resin composi...

Bismaleimide compound, composition containing same, polybenzoxazole...

Resin composition, prepreg, laminate, multilayer printed wiring boa...

Resin composition and article made therefrom

Flame retardant compound, method of making the same, resin composit...

Low-dielectric heat dissipation film composition and low-dielectric...

Liquid compression molding encapsulants

Modified silicone compound, and thermosetting resin composition, pr...

Friction drive belt

Thermosetting resin composition for semiconductor package and prepr...

Resin composition for semiconductor package, prepreg, and metal cla...

Resin composition, prepreg, laminate and multilayer printed wiring...

Resin composition, and pre-preg, metal-clad laminate and printed ci...

Resin composition, prepreg, resin sheet, metal foil-clad laminate,...

Resin composition and uses of the same

Polyimide precursor composition and use thereof

Resin composition, prepreg or resin sheet comprising the resin comp...

Curable fiberglass binder comprising salt of inorganic acid

Halogen-free flame retardant type resin composition

Resin composition and articles made therefrom

Transmission belt and belt-speed-change device

Resin composition, prepreg, metal foil-clad laminate, resin composi...

Thermosetting resin composition, resin film for interlayer insulati...

Vinylbenzyl imide resin, method of preparing vinylbenzyl imide resi...

Resin composition and uses of the same

Diene/dienophile couples and thermosetting resin compositions havin...

Resin film for flexible printed circuit board, metal foil provided...

Resin composition and uses of the same

Patents Applicationslast 30 patents

POLYAMIDE-IMIDE COPOLYMER FILM, PREPARATION METHOD THEREOF AND FLEX...

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED S...

Nanocomposite Flame Retardant, Flame Retardant Bismaleimide Resin a...

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN,...

COMPOSITION COMPRISING MALEIMIDE PRE-POLYMERIZED RESIN

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

Bismaleimide Compound, Composition Containing Same, Polybenzoxazole...

MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM

HIGH MOLECULAR WEIGHT FLEXIBLE CURABLE POLYIMIDES

RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOA...

TEMPERATURE SENSOR ELEMENT

RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT,...

PERMANENT BONDING AND PATTERNING MATERIAL

FLAME RETARDANT COMPOUND, METHOD OF MAKING THE SAME, RESIN COMPOSIT...

THERMOSETTING RESIN COMPOSITION, FILM ADHESIVE, PREPREG, AND PRODUC...

POLYARYLENE SULFIDE RESIN COMPOSITION, METHOD OF PREPARING POLYARYL...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND ADHESIVE AGENT, SUBSTR...

CURABLE POLYIMIDES

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

POLYMER-CERAMIC HYBRID SEPARATOR MEMBRANES, PRECURSORS, AND MANUFAC...

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...

MALEIMIDE RESIN COMPOSITION AND MALEIMIDE RESIN FILM

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

RESIN COMPOSITION FOR INSULATING FILM

LOW-DIELECTRIC HEAT DISSIPATION FILM COMPOSITION AND LOW-DIELECTRIC...

THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPR...

RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG, AND METAL CLA...

METHOD FOR PRODUCING POLYALKENYLPHENOL COMPOUND, CURABLE COMPOSITIO...

CURABLE FIBERGLASS BINDER

POLYIMIDE PRECURSOR AND LITHOGRAPHY PATTERN FORMED BY THE SAME