using a cutting wire

Industry

CPC
B24B27/0633

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B27/00Other grinding machines or devices

Current Industry

B24B27/0633using a cutting wire

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wire saw having dust collecting apparatus
- Patent number 12,109,729
- Issue date Oct 8, 2024
- EGUN CO., LTD.
- Sung Jun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor wafers using a wire saw, wire sa...
- Patent number 12,083,705
- Issue date Sep 10, 2024
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing workpiece and wire saw
- Patent number 11,958,160
- Issue date Apr 16, 2024
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing ingot
- Patent number 11,878,385
- Issue date Jan 23, 2024
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Kanbayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing wire saw apparatus and wire saw apparatus
- Patent number 11,806,827
- Issue date Nov 7, 2023
- Shin-Etsu Handotai Co., Ltd.
- Yoshihiro Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing hexagonal semiconductor plate crystal
- Patent number 11,772,301
- Issue date Oct 3, 2023
- Mitsubishi Chemical Corporation
- Hirofumi Uchida
- C30 - CRYSTAL GROWTH
Information Patent Grant
Three-dimensional object manufacturing method, three-dimensional ob...
- Patent number 11,718,016
- Issue date Aug 8, 2023
- Mimaki Engineering Co., Ltd.
- Kazuhiro Ochi
- B24 - GRINDING POLISHING
Information Patent Grant
Method for simultaneously cutting a plurality of disks from a workp...
- Patent number 11,717,930
- Issue date Aug 8, 2023
- Siltronic Corporation
- Guenther Grupp Mueller
- B24 - GRINDING POLISHING
Information Patent Grant
Wire saw apparatus and method for manufacturing wafer
- Patent number 11,584,037
- Issue date Feb 21, 2023
- Shin-Etsu Handotai Co., Ltd.
- Kazutoshi Mizushima
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive article and method of forming
- Patent number 11,504,783
- Issue date Nov 22, 2022
- Saint-Gobain Abrasives, Inc.
- Maureen A. Brosnan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire saw device, and processing method and processing device for wo...
- Patent number 11,504,857
- Issue date Nov 22, 2022
- TAKATORI CORPORATION
- Makoto Masuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for cutting a mat or a panel of mineral wool or a...
- Patent number 11,117,281
- Issue date Sep 14, 2021
- Saint-Gobain Placo
- Jean-Pierre Douche
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal wire, saw wire, cutting apparatus, and method of manufacturin...
- Patent number 10,967,447
- Issue date Apr 6, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Kanazawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component removal device
- Patent number 10,973,161
- Issue date Apr 6, 2021
- Raytheon Company
- Brad S. Williams
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding tool, method for manufacturing ultrasonic bondin...
- Patent number 10,864,597
- Issue date Dec 15, 2020
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akio Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Abrasive article and method of forming
- Patent number 10,596,681
- Issue date Mar 24, 2020
- Saint-Gobain Abrasives, Inc.
- Yinggang Tian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire saw apparatus
- Patent number 10,589,446
- Issue date Mar 17, 2020
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for slicing workpiece and wire saw
- Patent number 10,518,380
- Issue date Dec 31, 2019
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Silicon carbide ingot and method for manufacturing silicon carbide...
- Patent number 10,427,324
- Issue date Oct 1, 2019
- Sumitomo Electric Industries, Ltd.
- Tsutomu Hori
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for slicing workpiece and workpiece holder
- Patent number 10,350,788
- Issue date Jul 16, 2019
- Shin-Etsu Handotai Co., Ltd.
- Atsuo Uchiyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire guide roll for wire saw and method
- Patent number 10,245,661
- Issue date Apr 2, 2019
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing workpiece and processing liquid
- Patent number 10,189,181
- Issue date Jan 29, 2019
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Kanbayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Wire saw
- Patent number 10,124,431
- Issue date Nov 13, 2018
- Komatsu NTC Ltd.
- Hitoshi Shimada
- B24 - GRINDING POLISHING
Information Patent Grant
Method for slicing workpiece
- Patent number 10,029,392
- Issue date Jul 24, 2018
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Kanbayashi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece
- Patent number 10,011,046
- Issue date Jul 3, 2018
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire saw apparatus and cut-machining method
- Patent number 9,969,017
- Issue date May 15, 2018
- Toyo Advanced Technologies Co., Ltd.
- Shoji Imakurusu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyalkylene glycol-grafted polycarboxylate suspension and dispersi...
- Patent number 9,920,273
- Issue date Mar 20, 2018
- Dow Global Technologies LLC
- Yi-Ping Zhu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for processing semiconductor wafer
- Patent number 9,881,783
- Issue date Jan 30, 2018
- Sumco Corporation
- Toshiyuki Tanaka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Abrasive articles including abrasive particles bonded to an elongat...
- Patent number 9,862,041
- Issue date Jan 9, 2018
- Saint-Gobain Abrasives, Inc.
- Susanne Liebelt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods, wires, and apparatus for slicing hard materials
- Patent number 9,782,846
- Issue date Oct 10, 2017
- University of South Carolina
- Tangali Sudarshan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SIMULTANEOUSLY CUTTING A PLURALITY OF DISKS FROM A WORKP...
- Publication number 20220379426
- Publication date Dec 1, 2022
- Siltronic Corporation
- Guenther Grupp Mueller
- B24 - GRINDING POLISHING
Information Patent Application
WIRE SAW APPARATUS AND METHOD FOR MANUFACTURING WAFER
- Publication number 20210362373
- Publication date Nov 25, 2021
- Shin-Etsu Handotai Co., Ltd.
- Kazutoshi MIZUSHIMA
- B24 - GRINDING POLISHING
Information Patent Application
WIRE SAW DEVICE, AND PROCESSING METHOD AND PROCESSING DEVICE FOR WO...
- Publication number 20210308871
- Publication date Oct 7, 2021
- Takatori Corporation
- Makoto MASUDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING HEXAGONAL SEMICONDUCTOR PLATE CRYSTAL
- Publication number 20210146575
- Publication date May 20, 2021
- MITSUBISHI CHEMICAL CORPORATION
- Hirofumi UCHIDA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR SLICING INGOT AND WIRE SAW
- Publication number 20210114257
- Publication date Apr 22, 2021
- Shin-Etsu Handotai Co., Ltd.
- Keiichi KANBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR SLICING WORKPIECE AND WIRE SAW
- Publication number 20210016413
- Publication date Jan 21, 2021
- Shin-Etsu Handotai Co., Ltd.
- Koji KITAGAWA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND DEVICE FOR CUTTING A MAT OR A PANEL OF MINERAL WOOL OR A...
- Publication number 20200307009
- Publication date Oct 1, 2020
- SAINT-GOBAIN PLACO
- Jean-Pierre DOUCHE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SLICING INGOT
- Publication number 20200016719
- Publication date Jan 16, 2020
- Shin-Etsu Handotai Co., Ltd.
- Keiichi KANBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
METAL WIRE, SAW WIRE, CUTTING APPARATUS, AND METHOD OF MANUFACTURIN...
- Publication number 20190232404
- Publication date Aug 1, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro KANAZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRE SAW APPARATUS AND WIRE SAW APPARATUS
- Publication number 20190105750
- Publication date Apr 11, 2019
- Shin-Etsu Handotai Co., Ltd.
- Yoshihiro USAMI
- B24 - GRINDING POLISHING
Information Patent Application
ABRASIVE ARTICLE AND METHOD OF FORMING
- Publication number 20190091782
- Publication date Mar 28, 2019
- Saint-Gobain Abrasives, Inc.
- Maureen A. BROSNAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL OBJECT MANUFACTURING METHOD, THREE-DIMENSIONAL OB...
- Publication number 20190084220
- Publication date Mar 21, 2019
- MIMAKI ENGINEERING CO., LTD.
- Kazuhiro Ochi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WIRE SAW DEVICE, AND PROCESSING METHOD AND PROCESSING DEVICE FOR WO...
- Publication number 20180326590
- Publication date Nov 15, 2018
- Takatori Corporation
- Makoto MASUDA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE AND WIRE SAW
- Publication number 20180281147
- Publication date Oct 4, 2018
- Shin-Etsu Handotai Co., Ltd.
- Koji KITAGAWA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
ABRASIVE DIAMOND GRAIN FOR WIRE TOOL AND WIRE TOOL
- Publication number 20180215074
- Publication date Aug 2, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoki Tanaka
- B24 - GRINDING POLISHING
Information Patent Application
Electronic Component Removal Device
- Publication number 20180206371
- Publication date Jul 19, 2018
- Raytheon Company
- Brad S. Williams
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING HEXAGONAL SEMICONDUCTOR PLATE CRYSTAL
- Publication number 20180079109
- Publication date Mar 22, 2018
- MITSUBISHI CHEMICAL CORPORATION
- Hirofumi UCHIDA
- C30 - CRYSTAL GROWTH
Information Patent Application
WIRE SAW APPARATUS
- Publication number 20180079108
- Publication date Mar 22, 2018
- Shin-Etsu Handotai Co., Ltd.
- Koji KITAGAWA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
ABRASIVE ARTICLE AND METHOD OF FORMING
- Publication number 20170252897
- Publication date Sep 7, 2017
- Saint-Gobain Abrasives, Inc.
- Yinggang Tian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXED-ABRASIVE-GRAIN WIRE, WIRE SAW, AND METHOD FOR SLICING WORKPIECE
- Publication number 20170072594
- Publication date Mar 16, 2017
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro KATO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE AND PROCESSING LIQUID
- Publication number 20170015019
- Publication date Jan 19, 2017
- Shin-Etsu Handotai Co., Ltd.
- Keiichi KANBAYASHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
MULTI-WIRE SAW
- Publication number 20160368069
- Publication date Dec 22, 2016
- Disco Corporation
- Masayuki Matsubara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SLICING WORKPIECE AND WORKPIECE HOLDER
- Publication number 20160303765
- Publication date Oct 20, 2016
- Shin-Etsu Handotai Co., Ltd.
- Atsuo UCHIYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
ABRASIVE ARTICLE AND METHOD OF FORMING
- Publication number 20160263726
- Publication date Sep 15, 2016
- Saint-Gobain Abrasives, Inc.
- Yinggang TIAN
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR SLICING WORKPIECE
- Publication number 20160250776
- Publication date Sep 1, 2016
- Shin-Etsu Handotai Co., Ltd.
- Keiichi KANBAYASHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SILICON CARBIDE INGOT AND METHOD FOR MANUFACTURING SILICON CARBIDE...
- Publication number 20160236375
- Publication date Aug 18, 2016
- Sumitomo Electric Industries, Ltd.
- Tsutomu HORI
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR SLICING INGOT AND WIRE SAW
- Publication number 20160176069
- Publication date Jun 23, 2016
- Shin-Etsu Handotai Co., Ltd.
- Keiichi KANBAYASHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WIRE SAW
- Publication number 20160175953
- Publication date Jun 23, 2016
- Hitoshi Shimada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polyalkylene Glycol-Grafted Polycarboxylate Suspension and Dispersi...
- Publication number 20160102265
- Publication date Apr 14, 2016
- DOW GLOBAL TECHNOLOGIES LLC
- Yi-Ping Zhu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF RESUMING OPERATION OF WIRE SAW
- Publication number 20150328800
- Publication date Nov 19, 2015
- Shin-Etsu Handotai Co., Ltd.
- Atsuo UCHIYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE

using a cutting wire

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire saw having dust collecting apparatus

Method for producing semiconductor wafers using a wire saw, wire sa...

Method for slicing workpiece and wire saw

Method for slicing ingot

Method for manufacturing wire saw apparatus and wire saw apparatus

Method for manufacturing hexagonal semiconductor plate crystal

Three-dimensional object manufacturing method, three-dimensional ob...

Method for simultaneously cutting a plurality of disks from a workp...

Wire saw apparatus and method for manufacturing wafer

Abrasive article and method of forming

Wire saw device, and processing method and processing device for wo...

Method and device for cutting a mat or a panel of mineral wool or a...

Metal wire, saw wire, cutting apparatus, and method of manufacturin...

Electronic component removal device

Ultrasonic bonding tool, method for manufacturing ultrasonic bondin...

Abrasive article and method of forming

Wire saw apparatus

Method for slicing workpiece and wire saw

Silicon carbide ingot and method for manufacturing silicon carbide...

Method for slicing workpiece and workpiece holder

Wire guide roll for wire saw and method

Method for slicing workpiece and processing liquid

Wire saw

Method for slicing workpiece

Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece

Wire saw apparatus and cut-machining method

Polyalkylene glycol-grafted polycarboxylate suspension and dispersi...

Method for processing semiconductor wafer

Abrasive articles including abrasive particles bonded to an elongat...

Methods, wires, and apparatus for slicing hard materials

Patents Applicationslast 30 patents

METHOD FOR SIMULTANEOUSLY CUTTING A PLURALITY OF DISKS FROM A WORKP...

WIRE SAW APPARATUS AND METHOD FOR MANUFACTURING WAFER

WIRE SAW DEVICE, AND PROCESSING METHOD AND PROCESSING DEVICE FOR WO...

METHOD FOR MANUFACTURING HEXAGONAL SEMICONDUCTOR PLATE CRYSTAL

METHOD FOR SLICING INGOT AND WIRE SAW

METHOD FOR SLICING WORKPIECE AND WIRE SAW

METHOD AND DEVICE FOR CUTTING A MAT OR A PANEL OF MINERAL WOOL OR A...

METHOD FOR SLICING INGOT

METAL WIRE, SAW WIRE, CUTTING APPARATUS, AND METHOD OF MANUFACTURIN...

METHOD FOR MANUFACTURING WIRE SAW APPARATUS AND WIRE SAW APPARATUS

ABRASIVE ARTICLE AND METHOD OF FORMING

THREE-DIMENSIONAL OBJECT MANUFACTURING METHOD, THREE-DIMENSIONAL OB...

WIRE SAW DEVICE, AND PROCESSING METHOD AND PROCESSING DEVICE FOR WO...

METHOD FOR SLICING WORKPIECE AND WIRE SAW

ABRASIVE DIAMOND GRAIN FOR WIRE TOOL AND WIRE TOOL

Electronic Component Removal Device

METHOD FOR MANUFACTURING HEXAGONAL SEMICONDUCTOR PLATE CRYSTAL

WIRE SAW APPARATUS

ABRASIVE ARTICLE AND METHOD OF FORMING

FIXED-ABRASIVE-GRAIN WIRE, WIRE SAW, AND METHOD FOR SLICING WORKPIECE

METHOD FOR SLICING WORKPIECE AND PROCESSING LIQUID

MULTI-WIRE SAW

METHOD FOR SLICING WORKPIECE AND WORKPIECE HOLDER

ABRASIVE ARTICLE AND METHOD OF FORMING

METHOD FOR SLICING WORKPIECE

SILICON CARBIDE INGOT AND METHOD FOR MANUFACTURING SILICON CARBIDE...

METHOD FOR SLICING INGOT AND WIRE SAW

WIRE SAW

Polyalkylene Glycol-Grafted Polycarboxylate Suspension and Dispersi...

METHOD OF RESUMING OPERATION OF WIRE SAW