using buried connections

Industry

CPC
G01L19/0076

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Parent Industries

GPHYSICS G01Measuring instruments G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges

Current Industry

G01L19/0076using buried connections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sensor device and method of manufacture
- Patent number 11,600,559
- Issue date Mar 7, 2023
- Melexis Technologies NV
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device having printed circuit board substrate with built-in...
- Patent number 11,089,688
- Issue date Aug 10, 2021
- TT ELECTRONICS PLC
- Brent Hans Larson
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor package
- Patent number 11,041,774
- Issue date Jun 22, 2021
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a stress-decoupled micromechanical pressure se...
- Patent number 10,988,377
- Issue date Apr 27, 2021
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor for detecting one or more quantities of a fluid, in particul...
- Patent number 10,627,301
- Issue date Apr 21, 2020
- Metallux SA
- Massimo Monichino
- G01 - MEASURING TESTING
Information Patent Grant
MEMS integrated pressure sensor devices and methods of forming same
- Patent number 10,508,029
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device having printed circuit board substrate with built-in...
- Patent number 10,285,275
- Issue date May 7, 2019
- TT ELECTRONICS PLC
- Brent Hans Larson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages and methods of packaging sensors
- Patent number 10,246,320
- Issue date Apr 2, 2019
- DunAn Sensing, LLC
- Danny (Duy) Do
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor device with a MEMS piezoresistive element attached...
- Patent number 10,119,875
- Issue date Nov 6, 2018
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS integrated pressure sensor devices and methods of forming same
- Patent number 10,017,382
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cavity type pressure sensor device
- Patent number 9,890,034
- Issue date Feb 13, 2018
- NXP B.V.
- Zhigang Bai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D stacked piezoresistive pressure sensor
- Patent number 9,846,095
- Issue date Dec 19, 2017
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Universal hermetically sealed button pressure sensor
- Patent number 9,778,129
- Issue date Oct 3, 2017
- DunAn Sensing, LLC
- John She Bai
- G01 - MEASURING TESTING
Information Patent Grant
Flat covered leadless pressure sensor assemblies suitable for opera...
- Patent number 9,739,680
- Issue date Aug 22, 2017
- Kulite Semiconductor Products, Inc.
- Alexander A. Ned
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a pressure sensor and corresponding sensor
- Patent number 9,643,836
- Issue date May 9, 2017
- Auxitrol S.A.
- Sebastiano Brida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing electronic devices
- Patent number 9,640,506
- Issue date May 2, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flat covered leadless pressure sensor assemblies suitable for opera...
- Patent number 9,513,181
- Issue date Dec 6, 2016
- Kulite Semiconductor Products, Inc.
- Alexander A. Ned
- G01 - MEASURING TESTING
Information Patent Grant
Capacitive pressure sensors for high temperature applications
- Patent number 9,464,950
- Issue date Oct 11, 2016
- Rosemount Aerospace Inc.
- Weibin Zhang
- G01 - MEASURING TESTING
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,425,119
- Issue date Aug 23, 2016
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor chips
- Patent number 9,391,002
- Issue date Jul 12, 2016
- Amphenol Thermometrics, Inc.
- Nickolai S. Belov
- G01 - MEASURING TESTING
Information Patent Grant
MEMS capacitive pressure sensor, operating method and manufacturing...
- Patent number 9,383,282
- Issue date Jul 5, 2016
- ams International AG
- Willem Frederik Adrianus Besling
- G01 - MEASURING TESTING
Information Patent Grant
Eutectic bonding of thin chips on a carrier substrate
- Patent number 9,266,721
- Issue date Feb 23, 2016
- Robert Bosch GmbH
- Andreas Pruemm
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS integrated pressure sensor devices and methods of forming same
- Patent number 9,260,296
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing an electrical feedthrough in a substrate, and...
- Patent number 9,136,169
- Issue date Sep 15, 2015
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure detection module and pressure sensor device having such a...
- Patent number 9,046,428
- Issue date Jun 2, 2015
- Robert Bosch GmbH
- Masoud Habibi
- G01 - MEASURING TESTING
Information Patent Grant
Capacitive pressure sensor and method for manufacturing same
- Patent number 8,754,453
- Issue date Jun 17, 2014
- Korea Electronics Technology Institute
- Hak-In Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Sensor module
- Patent number 8,748,998
- Issue date Jun 10, 2014
- Robert Bosch GmbH
- Jens Frey
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flat covered leadless pressure sensor assemblies suitable for opera...
- Patent number 8,656,784
- Issue date Feb 25, 2014
- Kulite Semiconductor Products, Inc.
- Alexander Ned
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming a transducer
- Patent number 8,460,961
- Issue date Jun 11, 2013
- Rosemount Aerospace Inc.
- Shuwen Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated MEMS and ESD protection devices
- Patent number 8,330,224
- Issue date Dec 11, 2012
- Meggitt (San Juan Capistrano), Inc.
- Tom Kwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SENSOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20200075466
- Publication date Mar 5, 2020
- MELEXIS TECHNOLOGIES NV
- Jian CHEN
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR PACKAGE
- Publication number 20190265118
- Publication date Aug 29, 2019
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- G01 - MEASURING TESTING
Information Patent Application
SENSOR DEVICE HAVING PRINTED CIRCUIT BOARD SUBSTRATE WITH BUILT-IN...
- Publication number 20190254168
- Publication date Aug 15, 2019
- TT Electronics Plc
- Brent Hans Larson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A STRESS-DECOUPLED MICROMECHANICAL PRESSURE SE...
- Publication number 20190202687
- Publication date Jul 4, 2019
- ROBERT BOSCH GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Device Having Printed Circuit Board Substrate With Built-In...
- Publication number 20180343745
- Publication date Nov 29, 2018
- TT Electronics Plc
- Brent Hans Larson
- G01 - MEASURING TESTING
Information Patent Application
DETERMINING FLUID DENSITY WITHIN A TANK
- Publication number 20180172571
- Publication date Jun 21, 2018
- Simmonds Precision Products, Inc.
- Giusi Quartarone
- G01 - MEASURING TESTING
Information Patent Application
SENSOR FOR DETECTING ONE OR MORE QUANTITIES OF A FLUID, IN PARTICUL...
- Publication number 20180113042
- Publication date Apr 26, 2018
- METALLUX SA
- Massimo MONICHINO
- G01 - MEASURING TESTING
Information Patent Application
CAVITY TYPE PRESSURE SENSOR DEVICE
- Publication number 20170362077
- Publication date Dec 21, 2017
- NXP USA,INC.
- ZHIGANG BAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICES
- Publication number 20140291850
- Publication date Oct 2, 2014
- STMicroelectronics S.r. I.
- Federico Giovanni ZIGLIOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Integrated Pressure Sensor Devices and Methods of Forming Same
- Publication number 20140264648
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Flat Covered Leadless Pressure Sensor Assemblies Suitable for Opera...
- Publication number 20140123765
- Publication date May 8, 2014
- Kulite Semiconductor Products, Inc.
- Alexander A. Ned
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE DETECTION MODULE AND PRESSURE SENSOR DEVICE HAVING SUCH A...
- Publication number 20140033824
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Masoud HABIBI
- G01 - MEASURING TESTING
Information Patent Application
EUTECTIC BONDING OF THIN CHIPS ON A CARRIER SUBSTRATE
- Publication number 20130241012
- Publication date Sep 19, 2013
- ROBERT BOSCH GmbH
- Andreas Pruemm
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITANCE TYPE MEASURING DEVICE
- Publication number 20130162270
- Publication date Jun 27, 2013
- HORIBA STEC, CO., LTD.
- Soutaro Kishida
- G01 - MEASURING TESTING
Information Patent Application
CAPACITIVE PRESSURE SENSOR AND METHOD FOR MANUFACTURING SAME
- Publication number 20130126994
- Publication date May 23, 2013
- KOREA ELECTRONICS TECHNOLOGY INSTITUTE
- Hak-In Hwang
- G01 - MEASURING TESTING
Information Patent Application
MEMS CAPACITIVE PRESSURE SENSOR, OPERATING METHOD AND MANUFACTURING...
- Publication number 20130118265
- Publication date May 16, 2013
- NXP B.V.
- Willem Frederik Adrianus BESLING
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PRODUCING AN ELECTRICAL FEEDTHROUGH IN A SUBSTRATE, AND...
- Publication number 20130099382
- Publication date Apr 25, 2013
- ROBERT BOSCH GmbH
- Jochen REINMUTH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLAT COVERED LEADLESS PRESSURE SENSOR ASSEMBLIES SUITABLE FOR OPERA...
- Publication number 20130042694
- Publication date Feb 21, 2013
- Kulite Semiconductor Products, Inc.
- ALEXANDER NED
- G01 - MEASURING TESTING
Information Patent Application
Method for producing an electrical feedthrough in a substrate, and...
- Publication number 20120037412
- Publication date Feb 16, 2012
- Jochen REINMUTH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR MODULE
- Publication number 20120032283
- Publication date Feb 9, 2012
- Jens FREY
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING A TRANSDUCER
- Publication number 20110256652
- Publication date Oct 20, 2011
- Rosemount Aerospace Inc.
- Shuwen Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated MEMS and ESD protection devices
- Publication number 20110068421
- Publication date Mar 24, 2011
- Tom Kwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH TEMPERATURE RESISTANT SOLID STATE PRESSURE SENSOR
- Publication number 20100155866
- Publication date Jun 24, 2010
- Shuwen Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Micromechanical Pressure Sensing Device
- Publication number 20100139410
- Publication date Jun 10, 2010
- INFINEON TECHNOLOGIES SENSONOR AS
- Henrik Jakobsen
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
TRANSDUCER
- Publication number 20100065934
- Publication date Mar 18, 2010
- Odd Harald Steen Eriksen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MAKING A TRANSDUCER
- Publication number 20090203163
- Publication date Aug 13, 2009
- Odd Harald Steen Eriksen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSDUCER FOR USE IN HARSH ENVIRONMENTS
- Publication number 20090108382
- Publication date Apr 30, 2009
- Odd Harald Steen Eriksen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Micromechanical Pressure Sensing Device
- Publication number 20080178680
- Publication date Jul 31, 2008
- INFINEON TECHNOLOGIES SENSONOR AS
- Henrik Jakobsen
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Capacitive sensor
- Publication number 20050229710
- Publication date Oct 20, 2005
- John O'Dowd
- G01 - MEASURING TESTING

using buried connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sensor device and method of manufacture

Sensor device having printed circuit board substrate with built-in...

Pressure sensor package

Method for producing a stress-decoupled micromechanical pressure se...

Sensor for detecting one or more quantities of a fluid, in particul...

MEMS integrated pressure sensor devices and methods of forming same

Sensor device having printed circuit board substrate with built-in...

Packages and methods of packaging sensors

Pressure sensor device with a MEMS piezoresistive element attached...

MEMS integrated pressure sensor devices and methods of forming same

Cavity type pressure sensor device

3D stacked piezoresistive pressure sensor

Universal hermetically sealed button pressure sensor

Flat covered leadless pressure sensor assemblies suitable for opera...

Method for producing a pressure sensor and corresponding sensor

Method for manufacturing electronic devices

Flat covered leadless pressure sensor assemblies suitable for opera...

Capacitive pressure sensors for high temperature applications

Package structure and fabrication method thereof

Semiconductor sensor chips

MEMS capacitive pressure sensor, operating method and manufacturing...

Eutectic bonding of thin chips on a carrier substrate

MEMS integrated pressure sensor devices and methods of forming same

Method for producing an electrical feedthrough in a substrate, and...

Pressure detection module and pressure sensor device having such a...

Capacitive pressure sensor and method for manufacturing same

Sensor module

Flat covered leadless pressure sensor assemblies suitable for opera...

Method for forming a transducer

Integrated MEMS and ESD protection devices

Patents Applicationslast 30 patents

SENSOR DEVICE AND METHOD OF MANUFACTURE

PRESSURE SENSOR PACKAGE

SENSOR DEVICE HAVING PRINTED CIRCUIT BOARD SUBSTRATE WITH BUILT-IN...

METHOD FOR PRODUCING A STRESS-DECOUPLED MICROMECHANICAL PRESSURE SE...

Sensor Device Having Printed Circuit Board Substrate With Built-In...

DETERMINING FLUID DENSITY WITHIN A TANK

SENSOR FOR DETECTING ONE OR MORE QUANTITIES OF A FLUID, IN PARTICUL...

CAVITY TYPE PRESSURE SENSOR DEVICE

METHOD FOR MANUFACTURING ELECTRONIC DEVICES

MEMS Integrated Pressure Sensor Devices and Methods of Forming Same

Flat Covered Leadless Pressure Sensor Assemblies Suitable for Opera...

PRESSURE DETECTION MODULE AND PRESSURE SENSOR DEVICE HAVING SUCH A...

EUTECTIC BONDING OF THIN CHIPS ON A CARRIER SUBSTRATE

CAPACITANCE TYPE MEASURING DEVICE

CAPACITIVE PRESSURE SENSOR AND METHOD FOR MANUFACTURING SAME

MEMS CAPACITIVE PRESSURE SENSOR, OPERATING METHOD AND MANUFACTURING...

METHOD FOR PRODUCING AN ELECTRICAL FEEDTHROUGH IN A SUBSTRATE, AND...

FLAT COVERED LEADLESS PRESSURE SENSOR ASSEMBLIES SUITABLE FOR OPERA...

Method for producing an electrical feedthrough in a substrate, and...

SENSOR MODULE

METHOD FOR FORMING A TRANSDUCER

Integrated MEMS and ESD protection devices

HIGH TEMPERATURE RESISTANT SOLID STATE PRESSURE SENSOR

Micromechanical Pressure Sensing Device

TRANSDUCER

METHOD FOR MAKING A TRANSDUCER

TRANSDUCER FOR USE IN HARSH ENVIRONMENTS

Micromechanical Pressure Sensing Device

Capacitive sensor