Using direct fluid current against work during delaminating

Industry

CPC
Y10T156/1126

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10T156/1126Using direct fluid current against work during delaminating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Use of mixtures of water and essential oil for separating multilaye...
- Patent number 11,981,115
- Issue date May 14, 2024
- Covestro Deutschland AG
- Joerg Buechner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for peeling pressure-sensitive adhesive sheet
- Patent number 11,970,644
- Issue date Apr 30, 2024
- Nitto Denko Corporation
- Naofumi Kosaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Peeling device and peeling method using the same
- Patent number 11,760,080
- Issue date Sep 19, 2023
- Samsung Display Co., Ltd.
- Daeho Yang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier plate removing method
- Patent number 11,538,710
- Issue date Dec 27, 2022
- Disco Corporation
- Takatoshi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing carrier plate
- Patent number 11,222,808
- Issue date Jan 11, 2022
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Lining material peeling method
- Patent number 11,097,528
- Issue date Aug 24, 2021
- IHI Corporation
- Akira Sadaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Lining material peeling method
- Patent number 11,052,646
- Issue date Jul 6, 2021
- IHI Corporation
- Akira Sadaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier plate removing method
- Patent number 10,933,618
- Issue date Mar 2, 2021
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Removal method of carrier plate
- Patent number 10,926,524
- Issue date Feb 23, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling bar for peeling polarizing film from panel, peeling apparat...
- Patent number 10,870,267
- Issue date Dec 22, 2020
- LG Chem, Ltd.
- San Park
- B32 - LAYERED PRODUCTS
Information Patent Grant
Display laminate formed as a continuous web
- Patent number 10,661,547
- Issue date May 26, 2020
- MARIELLA LABELS OY
- Esa Hämäläinen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Peeling apparatus
- Patent number 10,507,637
- Issue date Dec 17, 2019
- Disco Corporation
- Kazuyuki Hinohara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separating device for bonded cine film and method therefor
- Patent number 10,444,630
- Issue date Oct 15, 2019
- Shaanxi Normal University
- Zhihui Jia
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Grant
Processing apparatus and processing method of stack
- Patent number 10,442,172
- Issue date Oct 15, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo Kumakura
- G02 - OPTICS
Information Patent Grant
Temporary carrier debond initiation, and associated systems and met...
- Patent number 10,446,431
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Jonathan S. Hacker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for forming separation starting point and separation method
- Patent number 10,259,207
- Issue date Apr 16, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for debonding temporarily adhesive-bonded carrier-workpiece...
- Patent number 10,211,077
- Issue date Feb 19, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Chunbin Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for retreading a vehicle tire casing and vehicle casing obta...
- Patent number 10,046,533
- Issue date Aug 14, 2018
- Compagnie Generale des Etablissements Michelin
- Cedric Astier
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for mount tape die release system for thin die ejection
- Patent number 10,043,688
- Issue date Aug 7, 2018
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for separating semiconductor devices from a wafer
- Patent number 9,984,927
- Issue date May 29, 2018
- Infineon Technologies AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation method, separation apparatus, and separation system
- Patent number 9,956,755
- Issue date May 1, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for processing display laminate
- Patent number 9,956,754
- Issue date May 1, 2018
- MARIELLA LABELS OY
- Esa Hämäläinen
- G02 - OPTICS
Information Patent Grant
Graphene platelet fabrication method and graphene platelet fabricat...
- Patent number 9,944,530
- Issue date Apr 17, 2018
- RITEDIA CORPORATION
- I-Chiao Lin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Peeling device, peeling system and peeling method
- Patent number 9,919,509
- Issue date Mar 20, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for forming separation starting point, stack manufacturing a...
- Patent number 9,764,488
- Issue date Sep 19, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Ryu Komatsu
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Processing apparatus and processing method of stack
- Patent number 9,682,544
- Issue date Jun 20, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo Kumakura
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Handling of epoxy resins
- Patent number 9,545,783
- Issue date Jan 17, 2017
- COEXPAIR
- Marc Gillard
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thermoplastic coating and removal using bonding interface with cata...
- Patent number 9,481,160
- Issue date Nov 1, 2016
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele Sjong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multiple bonding layers for thin-wafer handling
- Patent number 9,472,436
- Issue date Oct 18, 2016
- Brewer Science Inc.
- Rama Puligadda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Processing apparatus and processing method of stack
- Patent number 9,333,736
- Issue date May 10, 2016
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo Kumakura
- B26 - HAND CUTTING TOOLS CUTTING SEVERING

Patents Applicationslast 30 patents

Information Patent Application
PEELING DEVICE AND PEELING METHOD USING THE SAME
- Publication number 20240001665
- Publication date Jan 4, 2024
- SAMSUNG DISPLAY CO., LTD.
- DAEHO YANG
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD OF STACK
- Publication number 20170334187
- Publication date Nov 23, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo KUMAKURA
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER
- Publication number 20140367015
- Publication date Dec 18, 2014
- Mathias VAUPEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING
- Publication number 20140239453
- Publication date Aug 28, 2014
- BREWER SCIENCE INC.
- Rama Puligadda
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING
- Publication number 20140174627
- Publication date Jun 26, 2014
- BREWER SCIENCE INC.
- Rama Puligadda
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING
- Publication number 20140162034
- Publication date Jun 12, 2014
- BREWER SCIENCE INC.
- Rama Puligadda
- B32 - LAYERED PRODUCTS
Information Patent Application
Polarizing Sheet Removing Tool and Removing Method
- Publication number 20140144302
- Publication date May 29, 2014
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Yizhuang Zhuang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
WAFER SEPARATING APPARATUS AND WAFER SEPARATING METHOD
- Publication number 20140130986
- Publication date May 15, 2014
- PANASONIC CORPORATION
- MICHIROU YOSHINO
- B32 - LAYERED PRODUCTS
Information Patent Application
GRAPHENE PLATELET FABRICATION METHOD AND GRAPHENE PLATELET FABRICAT...
- Publication number 20140106153
- Publication date Apr 17, 2014
- RITEDIA CORPORATION
- I-Chiao LIN
- B82 - NANO-TECHNOLOGY
Information Patent Application
THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...
- Publication number 20140034247
- Publication date Feb 6, 2014
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele SJONG
- B32 - LAYERED PRODUCTS
Information Patent Application
SEPARATION METHOD, SEPARATION APPARATUS, AND SEPARATION SYSTEM
- Publication number 20130327484
- Publication date Dec 12, 2013
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE INVERTING DEVICE, SUBSTRATE INVERTING METHOD, AND PEELING...
- Publication number 20130292062
- Publication date Nov 7, 2013
- TOKYO ELECTRON LIMITED
- Yasuharu Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD
- Publication number 20130269879
- Publication date Oct 17, 2013
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Application
Label for Removable Attachment to an Article
- Publication number 20130146230
- Publication date Jun 13, 2013
- SPEAR GROUP HOLDINGS LIMITED
- David John Davies
- B32 - LAYERED PRODUCTS
Information Patent Application
REMOVING AND SEGREGATING COMPONENTS FROM PRINTED CIRCUIT BOARDS
- Publication number 20130125364
- Publication date May 23, 2013
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Mark Meloni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair
- Publication number 20120247686
- Publication date Oct 4, 2012
- MEMC Electronic Materials, Inc.
- Anca Stefanescu
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING
- Publication number 20120034437
- Publication date Feb 9, 2012
- BREWER SCIENCE INC.
- Rama Puligadda
- B32 - LAYERED PRODUCTS
Information Patent Application
DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS
- Publication number 20110253314
- Publication date Oct 20, 2011
- SUSS MICROTEC LITHOGRAPHY, GMBH
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS
- Publication number 20110253315
- Publication date Oct 20, 2011
- SUSS MICROTEC LITHOGRAPHY, GMBH
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF THINNING A STRUCTURE
- Publication number 20110230034
- Publication date Sep 22, 2011
- S. O. I. Tec Silicon on Insulator Technologies
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...
- Publication number 20110114260
- Publication date May 19, 2011
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele Sjong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
GLASS SUBSTRATE SPACER SEPARATING SYSTEM AND GLASS SUBSTRATE FABRIC...
- Publication number 20110053466
- Publication date Mar 3, 2011
- ASAHI GLASS COMPANY, LIMITED
- Tomohiro HOSHINO
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR PEELING PRESSURE-SENSITIVE ADHESIVE OPTICAL FILM, AND PR...
- Publication number 20100304134
- Publication date Dec 2, 2010
- NITTO DENKO CORPORATION a corporation
- Fumiko Nakano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TRANSFERRING STRUCTURE FOR FLEXIBLE ELECTRONIC DEVICE AND METHOD FO...
- Publication number 20100203296
- Publication date Aug 12, 2010
- Industrial Technology Research Institute
- Pao-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEEL-OFF COATING COMPOSITIONS
- Publication number 20100167075
- Publication date Jul 1, 2010
- Robert Mesa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Treatment liquid permeation unit and treating apparatus
- Publication number 20090218050
- Publication date Sep 3, 2009
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Label for Removable Attachment to an Article
- Publication number 20090218307
- Publication date Sep 3, 2009
- David J. Davies
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PEELING APPARATUS, PEELING METHOD, AND METHOD OF MANUFACTURING INFO...
- Publication number 20090166930
- Publication date Jul 2, 2009
- TDK Corporation
- Minoru FUJITA
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20090114348
- Publication date May 7, 2009
- Jae Seok HWANG
- G02 - OPTICS
Information Patent Application
RELEASING METHOD AND RELEASING APPARATUS OF WORK HAVING ADHESIVE TAPE
- Publication number 20080230183
- Publication date Sep 25, 2008
- NITTO DENKO CORPORATION
- Masayuki Yamamoto
- B32 - LAYERED PRODUCTS

Using direct fluid current against work during delaminating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Use of mixtures of water and essential oil for separating multilaye...

Method for peeling pressure-sensitive adhesive sheet

Peeling device and peeling method using the same

Carrier plate removing method

Method of removing carrier plate

Lining material peeling method

Lining material peeling method

Carrier plate removing method

Removal method of carrier plate

Peeling bar for peeling polarizing film from panel, peeling apparat...

Display laminate formed as a continuous web

Peeling apparatus

Separating device for bonded cine film and method therefor

Processing apparatus and processing method of stack

Temporary carrier debond initiation, and associated systems and met...

Method for forming separation starting point and separation method

Method for debonding temporarily adhesive-bonded carrier-workpiece...

Method for retreading a vehicle tire casing and vehicle casing obta...

Method for mount tape die release system for thin die ejection

Method and apparatus for separating semiconductor devices from a wafer

Separation method, separation apparatus, and separation system

Method and apparatus for processing display laminate

Graphene platelet fabrication method and graphene platelet fabricat...

Peeling device, peeling system and peeling method

Device for forming separation starting point, stack manufacturing a...

Processing apparatus and processing method of stack

Handling of epoxy resins

Thermoplastic coating and removal using bonding interface with cata...

Multiple bonding layers for thin-wafer handling

Processing apparatus and processing method of stack

Patents Applicationslast 30 patents

PEELING DEVICE AND PEELING METHOD USING THE SAME

PROCESSING APPARATUS AND PROCESSING METHOD OF STACK

METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER

MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING

MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING

MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING

Polarizing Sheet Removing Tool and Removing Method

WAFER SEPARATING APPARATUS AND WAFER SEPARATING METHOD

GRAPHENE PLATELET FABRICATION METHOD AND GRAPHENE PLATELET FABRICAT...

THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...

SEPARATION METHOD, SEPARATION APPARATUS, AND SEPARATION SYSTEM

SUBSTRATE INVERTING DEVICE, SUBSTRATE INVERTING METHOD, AND PEELING...

PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD

Label for Removable Attachment to an Article

REMOVING AND SEGREGATING COMPONENTS FROM PRINTED CIRCUIT BOARDS

Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair

MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING

DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS

DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS

METHOD OF THINNING A STRUCTURE

THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...

GLASS SUBSTRATE SPACER SEPARATING SYSTEM AND GLASS SUBSTRATE FABRIC...

METHOD FOR PEELING PRESSURE-SENSITIVE ADHESIVE OPTICAL FILM, AND PR...

TRANSFERRING STRUCTURE FOR FLEXIBLE ELECTRONIC DEVICE AND METHOD FO...

PEEL-OFF COATING COMPOSITIONS

Treatment liquid permeation unit and treating apparatus

Label for Removable Attachment to an Article

PEELING APPARATUS, PEELING METHOD, AND METHOD OF MANUFACTURING INFO...

SUBSTRATE BONDING APPARATUS

RELEASING METHOD AND RELEASING APPARATUS OF WORK HAVING ADHESIVE TAPE