using fluid or gas pressure

Industry

CPC
B28D5/0047

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/0047using fluid or gas pressure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip manufacturing device and method of manufacturing...
- Patent number 11,973,309
- Issue date Apr 30, 2024
- Mitsubishi Electric Corporation
- Tetsuya Uetsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus including a water collection pan
- Patent number 11,691,313
- Issue date Jul 4, 2023
- Disco Corporation
- Toshiyasu Rikiishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Planarization process, apparatus and method of manufacturing an art...
- Patent number 11,034,057
- Issue date Jun 15, 2021
- Canon Kabushiki Kaisha
- Ozkan Ozturk
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Material sheet handling system and processing methods
- Patent number 8,528,886
- Issue date Sep 10, 2013
- Corning Incorporated
- Chester Hann Huei Chang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Automated dicing tool for semiconductor substrate materials
- Patent number 7,559,446
- Issue date Jul 14, 2009
- International Business Machines Corporation
- Pierre-Luc Duchesne
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of gas cleaving a semiconductor product
- Patent number 6,274,458
- Issue date Aug 14, 2001
- Agere Systems Optoelectronics Guardian Corp.
- Joseph Michael Freund
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for cleaving semiconductor material
- Patent number 6,017,804
- Issue date Jan 25, 2000
- Lucent Technologies Inc.
- Joseph Michael Freund
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer method for breaking a semiconductor
- Patent number 5,527,744
- Issue date Jun 18, 1996
- Texas Instruments Incorporated
- Michael A. Mignardi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Integrated partial sawing process
- Patent number 5,393,706
- Issue date Feb 28, 1995
- Texas Instruments Incorporated
- Michael A. Mignardi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3730410
- Patent number 3,730,410
- Issue date May 1, 1973
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3667661
- Patent number 3,667,661
- Issue date Jun 6, 1972
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3615047
- Patent number 3,615,047
- Issue date Oct 26, 1971
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3507426
- Patent number 3,507,426
- Issue date Apr 21, 1970
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3493155
- Patent number 3,493,155
- Issue date Feb 3, 1970
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
3182873
- Patent number 3,182,873
- Issue date May 11, 1965
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP MANUFACTURING DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20210391684
- Publication date Dec 16, 2021
- Mitsubishi Electric Corporation
- Tetsuya UETSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS
- Publication number 20200238570
- Publication date Jul 30, 2020
- Disco Corporation
- Toshiyasu RIKIISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING DEVICE FOR THE CHIP-FREE CUTTING OF WAFERS OF DONOR SUBS...
- Publication number 20180009130
- Publication date Jan 11, 2018
- SILTECTRA GMBH
- Jan Richter
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
MATERIAL SHEET HANDLING SYSTEM AND PROCESSING METHODS
- Publication number 20130302971
- Publication date Nov 14, 2013
- Corning Incorporated
- Chester Hann Huei Chang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
MATERIAL SHEET HANDLING SYSTEM AND PROCESSING METHODS
- Publication number 20100194011
- Publication date Aug 5, 2010
- Chester Hann Huei Chang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
AN AUTOMATED DICING TOOL FOR SEMICONDUCTOR SUBSTRATE MATERIALS
- Publication number 20060143908
- Publication date Jul 6, 2006
- Pierre-Luc Duchesne
- B28 - WORKING CEMENT, CLAY, OR STONE

using fluid or gas pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip manufacturing device and method of manufacturing...

Processing apparatus including a water collection pan

Planarization process, apparatus and method of manufacturing an art...

Material sheet handling system and processing methods

Automated dicing tool for semiconductor substrate materials

Method of gas cleaving a semiconductor product

Method and apparatus for cleaving semiconductor material

Wafer method for breaking a semiconductor

Integrated partial sawing process

3730410

3667661

3615047

3507426

3493155

3182873

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP MANUFACTURING DEVICE AND METHOD OF MANUFACTURING...

PROCESSING APPARATUS

SEPARATING DEVICE FOR THE CHIP-FREE CUTTING OF WAFERS OF DONOR SUBS...

MATERIAL SHEET HANDLING SYSTEM AND PROCESSING METHODS

MATERIAL SHEET HANDLING SYSTEM AND PROCESSING METHODS

AN AUTOMATED DICING TOOL FOR SEMICONDUCTOR SUBSTRATE MATERIALS