using integrated interconnect structures

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CPC
G01P2015/0877

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GPHYSICS G01Measuring instruments G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT

Current Industry

G01P2015/0877using integrated interconnect structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Strain gauge sensor accelerometer with improved accuracy
- Patent number 11,085,945
- Issue date Aug 10, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Loïc Joet
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method including an intertial mass element
- Patent number 9,679,857
- Issue date Jun 13, 2017
- NXP B.V.
- Matthias Merz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micropatterned component and method for manufacturing a micropatter...
- Patent number 9,229,020
- Issue date Jan 5, 2016
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical structure, in particular sensor arrangement, and co...
- Patent number 8,901,679
- Issue date Dec 2, 2014
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor physical quantity sensor
- Patent number 8,759,926
- Issue date Jun 24, 2014
- Denso Corporation
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Region divided substrate and semiconductor device
- Patent number 8,455,973
- Issue date Jun 4, 2013
- Denso Corporation
- Tetsuo Fujii
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
IN-PLANE AND OUT-OF-PLANE ACCELEROMETER
- Publication number 20240300805
- Publication date Sep 12, 2024
- Murata Manufacturing Co., Ltd.
- Ville-Pekka RYTKÖNEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-AXIS ACCELEROMETER
- Publication number 20200182903
- Publication date Jun 11, 2020
- MiraMEMS Sensing Technology Co., Ltd
- Li-Tien TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRAIN GAUGE SENSOR ACCELEROMETER WITH IMPROVED ACCURACY
- Publication number 20200025793
- Publication date Jan 23, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Loïc JOET
- G01 - MEASURING TESTING
Information Patent Application
MICROPATTERNED COMPONENT AND METHOD FOR MANUFACTURING A MICROPATTER...
- Publication number 20140339654
- Publication date Nov 20, 2014
- ROBERT BOSCH GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE, IN PARTICULAR SENSOR ARRANGEMENT, AND CO...
- Publication number 20140021515
- Publication date Jan 23, 2014
- ROBERT BOSCH GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR
- Publication number 20120104520
- Publication date May 3, 2012
- Alps Electric Co., Ltd.
- Yoshitaka UTO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELEMENT STRUCTURE, INERTIA SENSOR, AND ELECTRONIC DEVICE
- Publication number 20110291208
- Publication date Dec 1, 2011
- SEIKO EPSON CORPORATION
- Shigekazu TAKAGI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PHYSICAL QUANTITY SENSOR AND METHOD OF MANUFACTURING...
- Publication number 20110227174
- Publication date Sep 22, 2011
- DENSO CORPORATION
- Tetsuo FUJII
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REGION DIVIDED SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20110133295
- Publication date Jun 9, 2011
- DENSO CORPORATION
- Tetsuo Fujii
- G01 - MEASURING TESTING

using integrated interconnect structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Strain gauge sensor accelerometer with improved accuracy

Semiconductor device and method including an intertial mass element

Micropatterned component and method for manufacturing a micropatter...

Micromechanical structure, in particular sensor arrangement, and co...

Semiconductor physical quantity sensor

Region divided substrate and semiconductor device

Patents Applicationslast 30 patents

IN-PLANE AND OUT-OF-PLANE ACCELEROMETER

THREE-AXIS ACCELEROMETER

STRAIN GAUGE SENSOR ACCELEROMETER WITH IMPROVED ACCURACY

MICROPATTERNED COMPONENT AND METHOD FOR MANUFACTURING A MICROPATTER...

MICROMECHANICAL STRUCTURE, IN PARTICULAR SENSOR ARRANGEMENT, AND CO...

MEMS SENSOR

ELEMENT STRUCTURE, INERTIA SENSOR, AND ELECTRONIC DEVICE

SEMICONDUCTOR PHYSICAL QUANTITY SENSOR AND METHOD OF MANUFACTURING...

REGION DIVIDED SUBSTRATE AND SEMICONDUCTOR DEVICE