using masks

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CPC
C25D7/0678

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D7/00Electroplating characterised by the article coated

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C25D7/0678using masks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plasma treatments for flexures of hard disk drives
- Patent number 12,129,567
- Issue date Oct 29, 2024
- Hutchinson Technology Incorporated
- Kurt F. Fischer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 11,756,800
- Issue date Sep 12, 2023
- Rashid Mavliev
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Heat equalization plate and method for manufacturing the same
- Patent number 11,672,100
- Issue date Jun 6, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Resin composite electrolytic copper foil, copper clad laminate and...
- Patent number 9,949,371
- Issue date Apr 17, 2018
- Mitsubishi Gas Chemical Company, Inc.
- Mitsuru Nozaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Machine for the electro-marking of large metallic surfaces and rela...
- Patent number 9,475,144
- Issue date Oct 25, 2016
- METALY S.R.L.
- Michele Lapelosa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Continuous plating system and method with mask registration
- Patent number 8,287,714
- Issue date Oct 16, 2012
- Leviton Manufacturing Co., Inc.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Continuous plating system and method with mask registration
- Patent number 7,744,732
- Issue date Jun 29, 2010
- Leviton Manufacturing Company, Inc.
- Darrell W. Zielke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating device and plating method
- Patent number 7,544,274
- Issue date Jun 9, 2009
- Dowa Metaltech Co., Ltd.
- Hiroshi Miyazawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Repair method for textured and/or smooth steel surfaces on endless...
- Patent number 6,887,366
- Issue date May 3, 2005
- Hueck Engraving GmbH
- Heinz-Peter Lettmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Partial plating system
- Patent number 6,656,275
- Issue date Dec 2, 2003
- Shinko Electric Industries Co., Ltd.
- Shigeki Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for sequentially metalizing polymeric films an...
- Patent number 6,224,722
- Issue date May 1, 2001
- Gould Electronics Inc.
- Thomas J. Ameen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for sequentially metalizing polymeric films an...
- Patent number 5,944,965
- Issue date Aug 31, 1999
- Gould Electronics Inc.
- Thomas J. Ameen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for sequentially metalizing polymeric films an...
- Patent number 5,716,502
- Issue date Feb 10, 1998
- Gould Electronics Inc.
- Thomas J. Ameen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for sequentially metalized polymeric films and...
- Patent number 5,685,970
- Issue date Nov 11, 1997
- Gould Electronics Inc.
- Thomas J. Ameen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming printed circuits
- Patent number 5,681,443
- Issue date Oct 28, 1997
- Gould Electronics Inc.
- Thomas J. Ameen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of protecting steel strip
- Patent number 5,567,482
- Issue date Oct 22, 1996
- USX Corporation
- Ersan Ilgar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for a continuous selective electrodeposition on a strip
- Patent number 5,389,220
- Issue date Feb 14, 1995
- Doduco GmbH and Co. Dr. Eugen Durrwachter
- Horst Herzog
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating a metallic deposit on inter...
- Patent number 4,770,754
- Issue date Sep 13, 1988
- Meco Equipment Engineers B.V.
- Pieter W. Meuldijk
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of applying coverings in the form of completely or not compl...
- Patent number 4,388,157
- Issue date Jun 14, 1983
- Galentan AG
- Harry C. Piepers
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electrolytic treatment
- Patent number 4,082,618
- Issue date Apr 4, 1978
- Daiichi Denshi Kogyo Kabushiki Kaisha
- Kiyoto Furuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electrolytic treatment
- Patent number 4,039,398
- Issue date Aug 2, 1977
- Daiichi Denshi Kogyo Kabushiki Kaisha
- Kiyoto Furuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating contacts of printed circuits
- Patent number 4,000,045
- Issue date Dec 28, 1976
- Burroughs Corporation
- Richard Ralph Rotzow
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating selected portions of a strip
- Patent number 3,974,056
- Issue date Aug 10, 1976
- Ann Arbor Circuits, Inc.
- Kurt W. Jogwick
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3888745
- Patent number 3,888,745
- Issue date Jun 10, 1975
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3855108
- Patent number 3,855,108
- Issue date Dec 17, 1974
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3746630
- Patent number 3,746,630
- Issue date Jul 17, 1973
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3697399
- Patent number 3,697,399
- Issue date Oct 10, 1972
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20230369065
- Publication date Nov 16, 2023
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HEAT EQUALIZATION PLATE
- Publication number 20230240045
- Publication date Jul 27, 2023
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HEAT EQUALIZATION PLATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210161028
- Publication date May 27, 2021
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND...
- Publication number 20160360615
- Publication date Dec 8, 2016
- Mitsubishi Gas Chemical Company, Inc.
- Mitsuru NOZAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating Method and Apparatus, and Strip Obtained by this Method
- Publication number 20130334055
- Publication date Dec 19, 2013
- FCI
- Damien Comte
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTINUOUS PLATING SYSTEM AND METHOD WITH MASK REGISTRATION
- Publication number 20090255821
- Publication date Oct 15, 2009
- LEVITON MANUFACTURING COMPANY, INC.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Continuous plating system and method with mask registration
- Publication number 20070045786
- Publication date Mar 1, 2007
- Leviton Manufacturing Co., Inc.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating device and plating method
- Publication number 20060137987
- Publication date Jun 29, 2006
- DOWA MINING CO., LTD.
- Hiroshi Miyazawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposited layer
- Publication number 20050074934
- Publication date Apr 7, 2005
- Jean-Louis Guyot
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and device for producing a galvanic layer on a substrate sur...
- Publication number 20040020779
- Publication date Feb 5, 2004
- Konrad Koeberle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Repair method for textured and/or smooth steel surfaces on endless...
- Publication number 20030089610
- Publication date May 15, 2003
- Heinz-Peter Lettmann
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Partial plating system
- Publication number 20010036514
- Publication date Nov 1, 2001
- Shigeki Iwamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

using masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and systems of forming metal interconnect layers using engi...

Plasma treatments for flexures of hard disk drives

Methods and systems of forming metal interconnect layers using engi...

Heat equalization plate and method for manufacturing the same

Resin composite electrolytic copper foil, copper clad laminate and...

Machine for the electro-marking of large metallic surfaces and rela...

Continuous plating system and method with mask registration

Continuous plating system and method with mask registration

Plating device and plating method

Repair method for textured and/or smooth steel surfaces on endless...

Partial plating system

Method and apparatus for sequentially metalizing polymeric films an...

Method and apparatus for sequentially metalizing polymeric films an...

Method and apparatus for sequentially metalizing polymeric films an...

Method and apparatus for sequentially metalized polymeric films and...

Method for forming printed circuits

Method of protecting steel strip

Apparatus for a continuous selective electrodeposition on a strip

Method and apparatus for electroplating a metallic deposit on inter...

Method of applying coverings in the form of completely or not compl...

Method for electrolytic treatment

Method and apparatus for electrolytic treatment

Electroplating contacts of printed circuits

Electroplating selected portions of a strip

3888745

3855108

3746630

3697399

Patents Applicationslast 30 patents

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

HEAT EQUALIZATION PLATE

HEAT EQUALIZATION PLATE AND METHOD FOR MANUFACTURING THE SAME

RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND...

Plating Method and Apparatus, and Strip Obtained by this Method

CONTINUOUS PLATING SYSTEM AND METHOD WITH MASK REGISTRATION

Continuous plating system and method with mask registration

Plating device and plating method

Electrodeposited layer

Method and device for producing a galvanic layer on a substrate sur...

Repair method for textured and/or smooth steel surfaces on endless...

Partial plating system